JP2024508408A5 - - Google Patents
Info
- Publication number
- JP2024508408A5 JP2024508408A5 JP2023548785A JP2023548785A JP2024508408A5 JP 2024508408 A5 JP2024508408 A5 JP 2024508408A5 JP 2023548785 A JP2023548785 A JP 2023548785A JP 2023548785 A JP2023548785 A JP 2023548785A JP 2024508408 A5 JP2024508408 A5 JP 2024508408A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- encapsulation layer
- integrated device
- package
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/191,550 US12142577B2 (en) | 2021-03-03 | 2021-03-03 | Package comprising metal layer configured for electromagnetic interference shield and heat dissipation |
| US17/191,550 | 2021-03-03 | ||
| PCT/US2022/015521 WO2022186953A2 (en) | 2021-03-03 | 2022-02-07 | Package comprising metal layer configured for electromagnetic interference shield and heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024508408A JP2024508408A (ja) | 2024-02-27 |
| JP2024508408A5 true JP2024508408A5 (OSRAM) | 2025-07-11 |
Family
ID=80623490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548785A Pending JP2024508408A (ja) | 2021-03-03 | 2022-02-07 | 電磁干渉シールドおよび放熱のために構成された金属層を含むパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12142577B2 (OSRAM) |
| EP (1) | EP4302331A2 (OSRAM) |
| JP (1) | JP2024508408A (OSRAM) |
| KR (1) | KR20230153374A (OSRAM) |
| CN (1) | CN116964729A (OSRAM) |
| PH (1) | PH12023551687A1 (OSRAM) |
| TW (1) | TW202236447A (OSRAM) |
| WO (1) | WO2022186953A2 (OSRAM) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230245978A1 (en) * | 2022-02-01 | 2023-08-03 | Skyworks Solutions, Inc. | Shielded wafer level chip scale package with shield connected to ground with vias through die |
| TWI840075B (zh) * | 2023-01-05 | 2024-04-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| TWI865147B (zh) * | 2023-01-05 | 2024-12-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| TWI883373B (zh) * | 2023-01-17 | 2025-05-11 | 華東科技股份有限公司 | 具散熱功能及電磁防護功能的晶片封裝結構的製造方法 |
| US20240371774A1 (en) * | 2023-05-01 | 2024-11-07 | Taiwan Semiconductor Manufacturing Company Limited | Package module including a recessed upper surface and methods of forming the package module |
| EP4519917A1 (en) * | 2023-07-26 | 2025-03-12 | Yangtze Memory Technologies Co., Ltd. | Chip packaging structure, semiconductor structure, and fabricating method thereof |
| CN119232106B (zh) * | 2024-09-20 | 2025-12-05 | 泉州市三安集成电路有限公司 | 声表面波器件及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100703090B1 (ko) * | 2005-08-30 | 2007-04-06 | 삼성전기주식회사 | 후면 접지형 플립칩 반도체 패키지 |
| JP2009277910A (ja) * | 2008-05-15 | 2009-11-26 | Sharp Corp | 半導体モジュールおよび半導体モジュールの製造方法 |
| US8373264B2 (en) * | 2008-07-31 | 2013-02-12 | Skyworks Solutions, Inc. | Semiconductor package with integrated interference shielding and method of manufacture thereof |
| EP2308085A4 (en) * | 2008-07-31 | 2013-06-05 | Skyworks Solutions Inc | SEMICONDUCTOR SEALING WITH INTEGRATED FAULT SHIELDING AND MANUFACTURING METHOD THEREFOR |
| KR101584042B1 (ko) | 2012-06-14 | 2016-01-08 | 스카이워크스 솔루션즈, 인코포레이티드 | 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈 |
| KR20140057979A (ko) * | 2012-11-05 | 2014-05-14 | 삼성전자주식회사 | 반도체 패키지 및 반도체 패키지의 제조 방법 |
| JP5767268B2 (ja) * | 2013-04-02 | 2015-08-19 | 太陽誘電株式会社 | 回路モジュール及びその製造方法 |
| JP6484019B2 (ja) * | 2014-12-11 | 2019-03-13 | アピックヤマダ株式会社 | 半導体製造装置 |
| WO2016181954A1 (ja) * | 2015-05-11 | 2016-11-17 | 株式会社村田製作所 | 高周波モジュール |
| TWI590392B (zh) * | 2015-08-03 | 2017-07-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| US10163808B2 (en) * | 2015-10-22 | 2018-12-25 | Avago Technologies International Sales Pte. Limited | Module with embedded side shield structures and method of fabricating the same |
| US10872879B2 (en) | 2015-11-12 | 2020-12-22 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor package and manufacturing method thereof |
| JP2017103282A (ja) * | 2015-11-30 | 2017-06-08 | イビデン株式会社 | プリント配線板 |
| US10147685B2 (en) * | 2016-03-10 | 2018-12-04 | Apple Inc. | System-in-package devices with magnetic shielding |
| WO2017187559A1 (ja) * | 2016-04-27 | 2017-11-02 | 三菱電機株式会社 | 高周波回路 |
| JP6500859B2 (ja) * | 2016-08-22 | 2019-04-17 | 株式会社村田製作所 | 無線モジュール |
| US10178757B2 (en) * | 2016-09-30 | 2019-01-08 | Avago Technologies International Sales Pte. Limited | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages |
| TWI603456B (zh) | 2016-09-30 | 2017-10-21 | 矽品精密工業股份有限公司 | 電子封裝結構及其製法 |
| US20180374798A1 (en) * | 2017-06-24 | 2018-12-27 | Amkor Technology, Inc. | Semiconductor device having emi shielding structure and related methods |
| KR102442623B1 (ko) * | 2017-08-08 | 2022-09-13 | 삼성전자주식회사 | 반도체 패키지 |
| US11380624B2 (en) * | 2017-09-30 | 2022-07-05 | Intel Corporation | Electromagnetic interference shield created on package using high throughput additive manufacturing |
| JP7130958B2 (ja) * | 2017-12-27 | 2022-09-06 | 株式会社村田製作所 | モジュール |
| US10790238B2 (en) * | 2018-05-10 | 2020-09-29 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
| US20200098698A1 (en) | 2018-09-26 | 2020-03-26 | Intel Corporation | Novel wafer level chip scale package (wlcsp), flip-chip chip scale package (fccsp), and fan out shielding concepts |
| KR102586888B1 (ko) * | 2018-11-27 | 2023-10-06 | 삼성전기주식회사 | 반도체 패키지 |
| DE102019100896A1 (de) * | 2019-01-15 | 2020-07-16 | Infineon Technologies Ag | Halbleitervorrichtungen mit haftvermittelnden Strukturen und Verfahren zu ihrer Herstellung |
| US11310907B2 (en) * | 2019-11-27 | 2022-04-19 | Intel Corporation | Microelectronic package with substrate-integrated components |
| US11605571B2 (en) | 2020-05-29 | 2023-03-14 | Qualcomm Incorporated | Package comprising a substrate, an integrated device, and an encapsulation layer with undercut |
| US11495531B2 (en) * | 2020-07-09 | 2022-11-08 | Advanced Semiconductore Engineering Korea, Inc. | Semiconductor device package and method of manufacturing the same |
-
2021
- 2021-03-03 US US17/191,550 patent/US12142577B2/en active Active
-
2022
- 2022-02-07 JP JP2023548785A patent/JP2024508408A/ja active Pending
- 2022-02-07 KR KR1020237028883A patent/KR20230153374A/ko active Pending
- 2022-02-07 WO PCT/US2022/015521 patent/WO2022186953A2/en not_active Ceased
- 2022-02-07 CN CN202280016806.2A patent/CN116964729A/zh active Pending
- 2022-02-07 EP EP22707277.4A patent/EP4302331A2/en active Pending
- 2022-02-07 PH PH1/2023/551687A patent/PH12023551687A1/en unknown
- 2022-03-03 TW TW111107677A patent/TW202236447A/zh unknown
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