JP2024042010A5 - - Google Patents
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- Publication number
- JP2024042010A5 JP2024042010A5 JP2024008072A JP2024008072A JP2024042010A5 JP 2024042010 A5 JP2024042010 A5 JP 2024042010A5 JP 2024008072 A JP2024008072 A JP 2024008072A JP 2024008072 A JP2024008072 A JP 2024008072A JP 2024042010 A5 JP2024042010 A5 JP 2024042010A5
- Authority
- JP
- Japan
- Prior art keywords
- diffusion layer
- substrate
- board according
- wiring board
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000002184 metal Substances 0.000 claims 18
- 238000009792 diffusion process Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 230000007423 decrease Effects 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025064481A JP2025103022A (ja) | 2018-03-28 | 2025-04-09 | 配線基板 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018061148 | 2018-03-28 | ||
| JP2018061148 | 2018-03-28 | ||
| JP2020509993A JP7468342B2 (ja) | 2018-03-28 | 2019-03-22 | 配線基板、および配線基板を製造する方法 |
| PCT/JP2019/012249 WO2019188843A1 (ja) | 2018-03-28 | 2019-03-22 | 配線基板、および配線基板を製造する方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020509993A Division JP7468342B2 (ja) | 2018-03-28 | 2019-03-22 | 配線基板、および配線基板を製造する方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025064481A Division JP2025103022A (ja) | 2018-03-28 | 2025-04-09 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024042010A JP2024042010A (ja) | 2024-03-27 |
| JP2024042010A5 true JP2024042010A5 (https=) | 2024-06-11 |
| JP7666668B2 JP7666668B2 (ja) | 2025-04-22 |
Family
ID=68061763
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020509993A Active JP7468342B2 (ja) | 2018-03-28 | 2019-03-22 | 配線基板、および配線基板を製造する方法 |
| JP2024008072A Active JP7666668B2 (ja) | 2018-03-28 | 2024-01-23 | 配線基板 |
| JP2025064481A Pending JP2025103022A (ja) | 2018-03-28 | 2025-04-09 | 配線基板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020509993A Active JP7468342B2 (ja) | 2018-03-28 | 2019-03-22 | 配線基板、および配線基板を製造する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025064481A Pending JP2025103022A (ja) | 2018-03-28 | 2025-04-09 | 配線基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12028972B2 (https=) |
| JP (3) | JP7468342B2 (https=) |
| KR (2) | KR20240159006A (https=) |
| CN (2) | CN111868301A (https=) |
| TW (3) | TWI816769B (https=) |
| WO (1) | WO2019188843A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7354944B2 (ja) * | 2020-07-06 | 2023-10-03 | トヨタ自動車株式会社 | 配線基板の製造方法 |
| JP7456330B2 (ja) * | 2020-08-21 | 2024-03-27 | トヨタ自動車株式会社 | 配線基板の製造方法 |
| WO2022270253A1 (ja) * | 2021-06-24 | 2022-12-29 | 奥野製薬工業株式会社 | めっき皮膜及びめっき皮膜の製造方法 |
| US12506040B2 (en) | 2021-08-30 | 2025-12-23 | Absolics Inc. | Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method |
| KR102686710B1 (ko) * | 2021-11-29 | 2024-07-19 | 와이엠티 주식회사 | 표면조도가 낮은 금속박을 이용한 기판의 회로패턴 형성방법 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3798136A (en) * | 1972-06-09 | 1974-03-19 | Ibm | Method for completely filling small diameter through-holes with large length to diameter ratio |
| JPS61236192A (ja) * | 1985-04-12 | 1986-10-21 | 株式会社日立製作所 | セラミツク基板の電極形成方法 |
| JPS63118058A (ja) * | 1986-11-05 | 1988-05-23 | Toyota Motor Corp | セラミツク溶射部材およびその製造方法 |
| JPH08293654A (ja) * | 1995-04-21 | 1996-11-05 | World Metal:Kk | セラミックへの金属被膜形成方法及び金属被覆セラミック構造体 |
| US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
| JP2003107523A (ja) * | 2001-09-28 | 2003-04-09 | Hitachi Ltd | 液晶表示装置 |
| DE10392162B4 (de) * | 2002-08-07 | 2012-02-23 | Denso Corporation | Schaltkreiskartenverbindungsstruktur und Herstellungsverfahren hierfür |
| JP4401912B2 (ja) * | 2003-10-17 | 2010-01-20 | 学校法人早稲田大学 | 半導体多層配線板の形成方法 |
| JP2005158887A (ja) * | 2003-11-21 | 2005-06-16 | Dept Corp | 回路基板及びその製造方法 |
| JP2006032851A (ja) * | 2004-07-21 | 2006-02-02 | Mitsui Mining & Smelting Co Ltd | 被覆銅、ホイスカの発生抑制方法、プリント配線基板および半導体装置 |
| JP4564342B2 (ja) * | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 多層配線基板およびその製造方法 |
| JP4355743B2 (ja) | 2006-12-04 | 2009-11-04 | 株式会社神戸製鋼所 | Ｃｕ合金配線膜とそのＣｕ合金配線膜を用いたフラットパネルディスプレイ用ＴＦＴ素子、及びそのＣｕ合金配線膜を作製するためのＣｕ合金スパッタリングターゲット |
| JP5121299B2 (ja) * | 2007-05-09 | 2013-01-16 | アルティアム サービシズ リミテッド エルエルシー | 液晶表示装置 |
| JP2009283739A (ja) * | 2008-05-23 | 2009-12-03 | Shinko Electric Ind Co Ltd | 配線基板および配線基板の製造方法 |
| JP5203108B2 (ja) * | 2008-09-12 | 2013-06-05 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP2011222567A (ja) * | 2010-04-02 | 2011-11-04 | Kobe Steel Ltd | 配線構造、表示装置、および半導体装置 |
| JP2012027159A (ja) * | 2010-07-21 | 2012-02-09 | Kobe Steel Ltd | 表示装置 |
| TW201251542A (en) * | 2011-05-24 | 2012-12-16 | Fujifilm Corp | Printed wiring board, and method for selecting printed wiring board |
| KR101321305B1 (ko) | 2011-11-25 | 2013-10-28 | 삼성전기주식회사 | 빌드업 인쇄회로기판 및 그의 제조방법 |
| JP2013125655A (ja) * | 2011-12-14 | 2013-06-24 | Hitachi Chemical Co Ltd | 導電性接着材、導電性積層体、導電性積層体の製造方法、配線基板、表示装置及び太陽電池モジュール |
| WO2014084077A1 (ja) * | 2012-11-28 | 2014-06-05 | ニッコー株式会社 | 銅メタライズ配線セラミック基板及びその製造方法 |
| JP2015038925A (ja) * | 2013-08-19 | 2015-02-26 | 株式会社東芝 | 半導体装置 |
| EP3049556A1 (en) | 2013-09-26 | 2016-08-03 | ATOTECH Deutschland GmbH | Novel adhesion promoting agents for metallisation of substrate surfaces |
| JP6478982B2 (ja) | 2013-09-26 | 2019-03-06 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 基材表面を金属化するための新規の密着性促進方法 |
| JP6539992B2 (ja) * | 2014-11-14 | 2019-07-10 | 凸版印刷株式会社 | 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法 |
| US10332968B2 (en) | 2015-06-29 | 2019-06-25 | Sharp Kabushiki Kaisha | Semiconductor device and method for manufacturing the same |
| JP6717238B2 (ja) * | 2017-03-07 | 2020-07-01 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板 |
| DE112018006975B4 (de) * | 2018-01-30 | 2022-06-23 | Fujifilm Corporation | Optischer Dünnfilm, optisches Element und optisches System |
-
2019
- 2019-03-22 CN CN201980020134.0A patent/CN111868301A/zh active Pending
- 2019-03-22 JP JP2020509993A patent/JP7468342B2/ja active Active
- 2019-03-22 CN CN202311150946.1A patent/CN117320265A/zh active Pending
- 2019-03-22 WO PCT/JP2019/012249 patent/WO2019188843A1/ja not_active Ceased
- 2019-03-22 KR KR1020247034782A patent/KR20240159006A/ko active Pending
- 2019-03-22 KR KR1020207027438A patent/KR102720915B1/ko active Active
- 2019-03-26 TW TW108110408A patent/TWI816769B/zh active
- 2019-03-26 TW TW114109818A patent/TW202531341A/zh unknown
- 2019-03-26 TW TW112132341A patent/TWI880315B/zh active
-
2020
- 2020-09-03 US US17/011,260 patent/US12028972B2/en active Active
-
2023
- 2023-10-19 US US18/381,789 patent/US20240049384A1/en active Pending
-
2024
- 2024-01-23 JP JP2024008072A patent/JP7666668B2/ja active Active
-
2025
- 2025-04-09 JP JP2025064481A patent/JP2025103022A/ja active Pending
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