JP2023512201A5 - - Google Patents

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Publication number
JP2023512201A5
JP2023512201A5 JP2022545782A JP2022545782A JP2023512201A5 JP 2023512201 A5 JP2023512201 A5 JP 2023512201A5 JP 2022545782 A JP2022545782 A JP 2022545782A JP 2022545782 A JP2022545782 A JP 2022545782A JP 2023512201 A5 JP2023512201 A5 JP 2023512201A5
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JP
Japan
Prior art keywords
gas distribution
distribution plate
arc
shaped portion
inner rings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022545782A
Other languages
English (en)
Japanese (ja)
Other versions
JP7579866B2 (ja
JP2023512201A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/014988 external-priority patent/WO2021154673A1/en
Publication of JP2023512201A publication Critical patent/JP2023512201A/ja
Publication of JP2023512201A5 publication Critical patent/JP2023512201A5/ja
Priority to JP2024188692A priority Critical patent/JP2025013990A/ja
Application granted granted Critical
Publication of JP7579866B2 publication Critical patent/JP7579866B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022545782A 2020-01-28 2021-01-26 高電力、高圧プロセス用の分割されたガス分配プレート Active JP7579866B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024188692A JP2025013990A (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062966816P 2020-01-28 2020-01-28
US62/966,816 2020-01-28
PCT/US2021/014988 WO2021154673A1 (en) 2020-01-28 2021-01-26 Segmented gas distribution plate for high-power, high-pressure processes

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024188692A Division JP2025013990A (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Publications (3)

Publication Number Publication Date
JP2023512201A JP2023512201A (ja) 2023-03-24
JP2023512201A5 true JP2023512201A5 (https=) 2024-01-31
JP7579866B2 JP7579866B2 (ja) 2024-11-08

Family

ID=77078307

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022545782A Active JP7579866B2 (ja) 2020-01-28 2021-01-26 高電力、高圧プロセス用の分割されたガス分配プレート
JP2024188692A Pending JP2025013990A (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024188692A Pending JP2025013990A (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Country Status (6)

Country Link
US (1) US20220375725A1 (https=)
JP (2) JP7579866B2 (https=)
KR (2) KR102925637B1 (https=)
CN (1) CN115004332A (https=)
TW (1) TWI904130B (https=)
WO (1) WO2021154673A1 (https=)

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TWI899187B (zh) * 2020-03-19 2025-10-01 美商蘭姆研究公司 基板處理系統
CN116334585A (zh) * 2021-12-23 2023-06-27 中微半导体设备(上海)股份有限公司 一种半导体设备喷淋头及等离子体装置
CN115547804B (zh) * 2022-09-29 2026-01-09 西实显示高新材料(沈阳)有限公司 大尺寸icp供气模组与icp设备

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