JP2023512201A5 - - Google Patents
Info
- Publication number
- JP2023512201A5 JP2023512201A5 JP2022545782A JP2022545782A JP2023512201A5 JP 2023512201 A5 JP2023512201 A5 JP 2023512201A5 JP 2022545782 A JP2022545782 A JP 2022545782A JP 2022545782 A JP2022545782 A JP 2022545782A JP 2023512201 A5 JP2023512201 A5 JP 2023512201A5
- Authority
- JP
- Japan
- Prior art keywords
- gas distribution
- distribution plate
- arc
- shaped portion
- inner rings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024188692A JP2025013990A (ja) | 2020-01-28 | 2024-10-28 | 高電力、高圧プロセス用の分割されたガス分配プレート |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062966816P | 2020-01-28 | 2020-01-28 | |
| US62/966,816 | 2020-01-28 | ||
| PCT/US2021/014988 WO2021154673A1 (en) | 2020-01-28 | 2021-01-26 | Segmented gas distribution plate for high-power, high-pressure processes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024188692A Division JP2025013990A (ja) | 2020-01-28 | 2024-10-28 | 高電力、高圧プロセス用の分割されたガス分配プレート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023512201A JP2023512201A (ja) | 2023-03-24 |
| JP2023512201A5 true JP2023512201A5 (https=) | 2024-01-31 |
| JP7579866B2 JP7579866B2 (ja) | 2024-11-08 |
Family
ID=77078307
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545782A Active JP7579866B2 (ja) | 2020-01-28 | 2021-01-26 | 高電力、高圧プロセス用の分割されたガス分配プレート |
| JP2024188692A Pending JP2025013990A (ja) | 2020-01-28 | 2024-10-28 | 高電力、高圧プロセス用の分割されたガス分配プレート |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024188692A Pending JP2025013990A (ja) | 2020-01-28 | 2024-10-28 | 高電力、高圧プロセス用の分割されたガス分配プレート |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220375725A1 (https=) |
| JP (2) | JP7579866B2 (https=) |
| KR (2) | KR102925637B1 (https=) |
| CN (1) | CN115004332A (https=) |
| TW (1) | TWI904130B (https=) |
| WO (1) | WO2021154673A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI899187B (zh) * | 2020-03-19 | 2025-10-01 | 美商蘭姆研究公司 | 基板處理系統 |
| CN116334585A (zh) * | 2021-12-23 | 2023-06-27 | 中微半导体设备(上海)股份有限公司 | 一种半导体设备喷淋头及等离子体装置 |
| CN115547804B (zh) * | 2022-09-29 | 2026-01-09 | 西实显示高新材料(沈阳)有限公司 | 大尺寸icp供气模组与icp设备 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4590042A (en) * | 1984-12-24 | 1986-05-20 | Tegal Corporation | Plasma reactor having slotted manifold |
| JP3038524B2 (ja) * | 1993-04-19 | 2000-05-08 | コマツ電子金属株式会社 | 半導体製造装置 |
| US5746875A (en) * | 1994-09-16 | 1998-05-05 | Applied Materials, Inc. | Gas injection slit nozzle for a plasma process reactor |
| US6019848A (en) * | 1996-11-13 | 2000-02-01 | Applied Materials, Inc. | Lid assembly for high temperature processing chamber |
| US5800621A (en) * | 1997-02-10 | 1998-09-01 | Applied Materials, Inc. | Plasma source for HDP-CVD chamber |
| US6245192B1 (en) * | 1999-06-30 | 2001-06-12 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US6237528B1 (en) * | 2000-01-24 | 2001-05-29 | M.E.C. Technology, Inc. | Showerhead electrode assembly for plasma processing |
| US20040060514A1 (en) * | 2002-01-25 | 2004-04-01 | Applied Materials, Inc. A Delaware Corporation | Gas distribution showerhead |
| US20070084406A1 (en) * | 2005-10-13 | 2007-04-19 | Joseph Yudovsky | Reaction chamber with opposing pockets for gas injection and exhaust |
| US20070084408A1 (en) * | 2005-10-13 | 2007-04-19 | Applied Materials, Inc. | Batch processing chamber with diffuser plate and injector assembly |
| KR101019293B1 (ko) * | 2005-11-04 | 2011-03-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마-강화 원자층 증착 장치 및 방법 |
| US8440049B2 (en) * | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| US7854820B2 (en) * | 2006-10-16 | 2010-12-21 | Lam Research Corporation | Upper electrode backing member with particle reducing features |
| US20090159002A1 (en) * | 2007-12-19 | 2009-06-25 | Kallol Bera | Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution |
| JP3160877U (ja) * | 2009-10-13 | 2010-07-15 | ラム リサーチ コーポレーションLam Research Corporation | シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極 |
| WO2011146571A2 (en) * | 2010-05-21 | 2011-11-24 | Applied Materials, Inc. | Tightly-fitted ceramic insulator on large-area electrode |
| US9793126B2 (en) * | 2010-08-04 | 2017-10-17 | Lam Research Corporation | Ion to neutral control for wafer processing with dual plasma source reactor |
| JP2012216744A (ja) * | 2010-11-10 | 2012-11-08 | Sharp Corp | 気相成長装置及び気相成長方法 |
| US8562785B2 (en) * | 2011-05-31 | 2013-10-22 | Lam Research Corporation | Gas distribution showerhead for inductively coupled plasma etch reactor |
| US9353439B2 (en) * | 2013-04-05 | 2016-05-31 | Lam Research Corporation | Cascade design showerhead for transient uniformity |
| US9390910B2 (en) * | 2014-10-03 | 2016-07-12 | Applied Materials, Inc. | Gas flow profile modulated control of overlay in plasma CVD films |
| KR20160066340A (ko) * | 2014-12-02 | 2016-06-10 | 삼성전자주식회사 | 기판 처리 장치 |
| US10217614B2 (en) * | 2015-01-12 | 2019-02-26 | Lam Research Corporation | Ceramic gas distribution plate with embedded electrode |
| TWI727024B (zh) * | 2016-04-15 | 2021-05-11 | 美商應用材料股份有限公司 | 微體積沉積腔室 |
| US10622189B2 (en) * | 2016-05-11 | 2020-04-14 | Lam Research Corporation | Adjustable side gas plenum for edge rate control in a downstream reactor |
| JP6851188B2 (ja) * | 2016-11-28 | 2021-03-31 | 東京エレクトロン株式会社 | プラズマ処理装置及びシャワーヘッド |
| JP2019145397A (ja) * | 2018-02-22 | 2019-08-29 | 東芝メモリ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| US10840066B2 (en) * | 2018-06-13 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Adjustable fastening device for plasma gas injectors |
| JP7096080B2 (ja) * | 2018-06-18 | 2022-07-05 | 株式会社日立ハイテク | プラズマ処理装置 |
-
2021
- 2021-01-26 CN CN202180011541.2A patent/CN115004332A/zh active Pending
- 2021-01-26 JP JP2022545782A patent/JP7579866B2/ja active Active
- 2021-01-26 WO PCT/US2021/014988 patent/WO2021154673A1/en not_active Ceased
- 2021-01-26 US US17/795,188 patent/US20220375725A1/en active Pending
- 2021-01-26 KR KR1020227028460A patent/KR102925637B1/ko active Active
- 2021-01-26 KR KR1020267003843A patent/KR20260028876A/ko active Pending
- 2021-01-27 TW TW110102992A patent/TWI904130B/zh active
-
2024
- 2024-10-28 JP JP2024188692A patent/JP2025013990A/ja active Pending
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