JP2023520035A5 - - Google Patents
Info
- Publication number
- JP2023520035A5 JP2023520035A5 JP2022559853A JP2022559853A JP2023520035A5 JP 2023520035 A5 JP2023520035 A5 JP 2023520035A5 JP 2022559853 A JP2022559853 A JP 2022559853A JP 2022559853 A JP2022559853 A JP 2022559853A JP 2023520035 A5 JP2023520035 A5 JP 2023520035A5
- Authority
- JP
- Japan
- Prior art keywords
- gases
- substrate
- edge ring
- injection ports
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063004132P | 2020-04-02 | 2020-04-02 | |
| US63/004,132 | 2020-04-02 | ||
| US202063041694P | 2020-06-19 | 2020-06-19 | |
| US63/041,694 | 2020-06-19 | ||
| PCT/US2021/022036 WO2021202080A1 (en) | 2020-04-02 | 2021-03-12 | Edge ring for localized delivery of tuning gas |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023520035A JP2023520035A (ja) | 2023-05-15 |
| JP2023520035A5 true JP2023520035A5 (https=) | 2024-03-25 |
| JP7668814B2 JP7668814B2 (ja) | 2025-04-25 |
Family
ID=77929392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022559853A Active JP7668814B2 (ja) | 2020-04-02 | 2021-03-12 | 調節ガスの局所供給用エッジリング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230128551A1 (https=) |
| JP (1) | JP7668814B2 (https=) |
| KR (1) | KR102902661B1 (https=) |
| CN (1) | CN115362544A (https=) |
| TW (1) | TWI906275B (https=) |
| WO (1) | WO2021202080A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558905B (zh) * | 2022-12-01 | 2023-07-07 | 浙江晶越半导体有限公司 | 一种提高碳化硅沉积速率与均匀性的方法与反应器 |
| US20240304486A1 (en) * | 2023-03-10 | 2024-09-12 | Applied Materials, Inc. | Differential substrate backside cooling |
| US20250121348A1 (en) * | 2023-10-12 | 2025-04-17 | Cristina Piekarz | Modular regenerative hydrothermal reactor and methods for mineralization of recalcitrant organic compounds at hydrothermal operating conditions |
| CN120221381B (zh) * | 2025-05-26 | 2025-07-25 | 上海邦芯半导体科技有限公司 | 边缘保护环及深硅刻蚀设备 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744049A (en) * | 1994-07-18 | 1998-04-28 | Applied Materials, Inc. | Plasma reactor with enhanced plasma uniformity by gas addition, and method of using same |
| US5960555A (en) * | 1996-07-24 | 1999-10-05 | Applied Materials, Inc. | Method and apparatus for purging the back side of a substrate during chemical vapor processing |
| US6780759B2 (en) * | 2001-05-09 | 2004-08-24 | Silicon Genesis Corporation | Method for multi-frequency bonding |
| JP4108465B2 (ja) * | 2002-12-18 | 2008-06-25 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| US7658816B2 (en) * | 2003-09-05 | 2010-02-09 | Tokyo Electron Limited | Focus ring and plasma processing apparatus |
| US20050196971A1 (en) * | 2004-03-05 | 2005-09-08 | Applied Materials, Inc. | Hardware development to reduce bevel deposition |
| US8097120B2 (en) | 2006-02-21 | 2012-01-17 | Lam Research Corporation | Process tuning gas injection from the substrate edge |
| US8048226B2 (en) | 2007-03-30 | 2011-11-01 | Tokyo Electron Limited | Method and system for improving deposition uniformity in a vapor deposition system |
| CN101552182B (zh) * | 2008-03-31 | 2010-11-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种用于半导体制造工艺中的边缘环机构 |
| JP4591590B2 (ja) * | 2008-10-31 | 2010-12-01 | 三菱電機株式会社 | 粒子線照射装置及び粒子線治療装置 |
| US20130168352A1 (en) * | 2011-12-28 | 2013-07-04 | Andreas Fischer | Methods and apparatuses for controlling plasma properties by controlling conductance between sub-chambers of a plasma processing chamber |
| US10410832B2 (en) * | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
| KR102641441B1 (ko) * | 2016-09-28 | 2024-02-29 | 삼성전자주식회사 | 링 어셈블리 및 이를 포함하는 척 어셈블리 |
-
2021
- 2021-03-12 CN CN202180027087.XA patent/CN115362544A/zh active Pending
- 2021-03-12 WO PCT/US2021/022036 patent/WO2021202080A1/en not_active Ceased
- 2021-03-12 US US17/915,573 patent/US20230128551A1/en active Pending
- 2021-03-12 JP JP2022559853A patent/JP7668814B2/ja active Active
- 2021-03-12 KR KR1020227038261A patent/KR102902661B1/ko active Active
- 2021-03-30 TW TW110111530A patent/TWI906275B/zh active
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