JP2023524023A5 - - Google Patents

Info

Publication number
JP2023524023A5
JP2023524023A5 JP2022566007A JP2022566007A JP2023524023A5 JP 2023524023 A5 JP2023524023 A5 JP 2023524023A5 JP 2022566007 A JP2022566007 A JP 2022566007A JP 2022566007 A JP2022566007 A JP 2022566007A JP 2023524023 A5 JP2023524023 A5 JP 2023524023A5
Authority
JP
Japan
Prior art keywords
shower head
main body
substrate
carrier ring
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022566007A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023524023A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/026515 external-priority patent/WO2021221881A1/en
Publication of JP2023524023A publication Critical patent/JP2023524023A/ja
Publication of JP2023524023A5 publication Critical patent/JP2023524023A5/ja
Pending legal-status Critical Current

Links

JP2022566007A 2020-04-28 2021-04-09 ウエハのベベル/縁部上の堆積を制御するためのシャワーヘッド設計 Pending JP2023524023A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063016641P 2020-04-28 2020-04-28
US63/016,641 2020-04-28
US202063041630P 2020-06-19 2020-06-19
US63/041,630 2020-06-19
PCT/US2021/026515 WO2021221881A1 (en) 2020-04-28 2021-04-09 Showerhead designs for controlling deposition on wafer bevel/edge

Publications (2)

Publication Number Publication Date
JP2023524023A JP2023524023A (ja) 2023-06-08
JP2023524023A5 true JP2023524023A5 (https=) 2024-04-16

Family

ID=78373848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022566007A Pending JP2023524023A (ja) 2020-04-28 2021-04-09 ウエハのベベル/縁部上の堆積を制御するためのシャワーヘッド設計

Country Status (6)

Country Link
US (1) US20230167552A1 (https=)
JP (1) JP2023524023A (https=)
KR (1) KR20230007440A (https=)
CN (1) CN115461493A (https=)
TW (1) TW202208672A (https=)
WO (1) WO2021221881A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2763222B2 (ja) * 1991-12-13 1998-06-11 三菱電機株式会社 化学気相成長方法ならびにそのための化学気相成長処理システムおよび化学気相成長装置
US20050230350A1 (en) * 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US8092606B2 (en) * 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
JP2009277958A (ja) * 2008-05-16 2009-11-26 Nuflare Technology Inc 成膜装置及び成膜方法
WO2011009002A2 (en) * 2009-07-15 2011-01-20 Applied Materials, Inc. Flow control features of cvd chambers
US9881788B2 (en) * 2014-05-22 2018-01-30 Lam Research Corporation Back side deposition apparatus and applications
US10253412B2 (en) * 2015-05-22 2019-04-09 Lam Research Corporation Deposition apparatus including edge plenum showerhead assembly
TWI723024B (zh) * 2015-06-26 2021-04-01 美商應用材料股份有限公司 用於改良的氣體分配的遞迴注入設備
KR20180071960A (ko) * 2016-12-20 2018-06-28 램 리써치 코포레이션 가스 시일링을 갖는 화학적 증착 챔버
JP6308318B2 (ja) * 2017-04-06 2018-04-11 東京エレクトロン株式会社 成膜装置
US10851457B2 (en) * 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
JP6462072B2 (ja) * 2017-09-01 2019-01-30 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
KR102538177B1 (ko) * 2017-11-16 2023-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
JP7045883B2 (ja) * 2018-03-07 2022-04-01 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP7066565B2 (ja) * 2018-07-27 2022-05-13 東京エレクトロン株式会社 プラズマ処理方法およびプラズマ処理装置
JP7119747B2 (ja) * 2018-08-10 2022-08-17 東京エレクトロン株式会社 ガス処理装置及びガス処理方法

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