JP2023550333A5 - - Google Patents

Info

Publication number
JP2023550333A5
JP2023550333A5 JP2023528360A JP2023528360A JP2023550333A5 JP 2023550333 A5 JP2023550333 A5 JP 2023550333A5 JP 2023528360 A JP2023528360 A JP 2023528360A JP 2023528360 A JP2023528360 A JP 2023528360A JP 2023550333 A5 JP2023550333 A5 JP 2023550333A5
Authority
JP
Japan
Prior art keywords
substrate support
thermal conductivity
adhesive layer
spray coating
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023528360A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023550333A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/059455 external-priority patent/WO2022108900A1/en
Publication of JP2023550333A publication Critical patent/JP2023550333A/ja
Publication of JP2023550333A5 publication Critical patent/JP2023550333A5/ja
Pending legal-status Critical Current

Links

JP2023528360A 2020-11-19 2021-11-16 基板全体に均一な温度を有する基板支持体 Pending JP2023550333A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063115988P 2020-11-19 2020-11-19
US63/115,988 2020-11-19
PCT/US2021/059455 WO2022108900A1 (en) 2020-11-19 2021-11-16 Substrate support with uniform temperature across a substrate

Publications (2)

Publication Number Publication Date
JP2023550333A JP2023550333A (ja) 2023-12-01
JP2023550333A5 true JP2023550333A5 (https=) 2024-11-20

Family

ID=81709627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023528360A Pending JP2023550333A (ja) 2020-11-19 2021-11-16 基板全体に均一な温度を有する基板支持体

Country Status (4)

Country Link
US (1) US20230253193A1 (https=)
JP (1) JP2023550333A (https=)
KR (1) KR20230104069A (https=)
WO (1) WO2022108900A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7752711B2 (ja) * 2024-02-22 2025-10-10 日本特殊陶業株式会社 保持装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020036881A1 (en) * 1999-05-07 2002-03-28 Shamouil Shamouilian Electrostatic chuck having composite base and method
JP2001203257A (ja) * 2000-01-20 2001-07-27 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体
JP3104893U (ja) * 2004-03-26 2004-10-21 株式会社クリエイティブ テクノロジー 静電チャックの接着部
JP4409373B2 (ja) * 2004-06-29 2010-02-03 日本碍子株式会社 基板載置装置及び基板温度調整方法
JP2007110023A (ja) * 2005-10-17 2007-04-26 Shinko Electric Ind Co Ltd 基板保持装置
JP4943086B2 (ja) * 2006-08-10 2012-05-30 東京エレクトロン株式会社 静電チャック装置及びプラズマ処理装置
US7723648B2 (en) * 2006-09-25 2010-05-25 Tokyo Electron Limited Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system
JP4944600B2 (ja) * 2006-12-28 2012-06-06 新光電気工業株式会社 基板温調固定装置
JP2009188332A (ja) * 2008-02-08 2009-08-20 Tokyo Electron Ltd プラズマ処理装置用基板載置台、プラズマ処理装置および絶縁皮膜の成膜方法
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP5504924B2 (ja) * 2010-01-29 2014-05-28 住友大阪セメント株式会社 静電チャック装置
JP6034156B2 (ja) * 2011-12-05 2016-11-30 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US9279946B2 (en) * 2012-05-23 2016-03-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Premolded cavity for optoelectronic device
JP2013258270A (ja) * 2012-06-12 2013-12-26 Tokyo Electron Ltd 基板載置台及び基板処理装置
CN106796914B (zh) * 2014-10-17 2020-07-14 住友大阪水泥股份有限公司 静电卡盘装置
US11004661B2 (en) * 2015-09-04 2021-05-11 Applied Materials, Inc. Process chamber for cyclic and selective material removal and etching
JP7038496B2 (ja) * 2017-07-06 2022-03-18 日本特殊陶業株式会社 半導体製造装置用部品、および、半導体製造装置用部品の製造方法
US20200008316A1 (en) * 2018-06-28 2020-01-02 Carbice Corporation Flexible and conformable heat sinks and methods of making and using thereof

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