JP2022544346A - ポリエステル樹脂組成物およびその成形品 - Google Patents
ポリエステル樹脂組成物およびその成形品 Download PDFInfo
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- JP2022544346A JP2022544346A JP2021573866A JP2021573866A JP2022544346A JP 2022544346 A JP2022544346 A JP 2022544346A JP 2021573866 A JP2021573866 A JP 2021573866A JP 2021573866 A JP2021573866 A JP 2021573866A JP 2022544346 A JP2022544346 A JP 2022544346A
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- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 78
- 239000004645 polyester resin Substances 0.000 title claims abstract description 78
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- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 53
- 238000002834 transmittance Methods 0.000 claims abstract description 47
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- 229920006127 amorphous resin Polymers 0.000 claims abstract description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 44
- 125000004432 carbon atom Chemical group C* 0.000 claims description 27
- 229920001577 copolymer Polymers 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 21
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- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical group OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 claims description 11
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- 125000003118 aryl group Chemical group 0.000 claims description 10
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
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- 238000010438 heat treatment Methods 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 5
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
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- 239000012298 atmosphere Substances 0.000 claims description 4
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
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- 125000004185 ester group Chemical group 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 11
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- 229910019142 PO4 Inorganic materials 0.000 description 24
- 239000010452 phosphate Substances 0.000 description 24
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 24
- 150000001875 compounds Chemical class 0.000 description 17
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000000835 fiber Substances 0.000 description 10
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical class OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 9
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
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- 229910052757 nitrogen Inorganic materials 0.000 description 5
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical group OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 3
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 3
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- FRXGWNKDEMTFPL-UHFFFAOYSA-N dioctadecyl hydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCCCCCCCC FRXGWNKDEMTFPL-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 150000002596 lactones Chemical class 0.000 description 3
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 3
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
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- 239000011342 resin composition Substances 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
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- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
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- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
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- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
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- QQWAKSKPSOFJFF-UHFFFAOYSA-N oxiran-2-ylmethyl 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)OCC1CO1 QQWAKSKPSOFJFF-UHFFFAOYSA-N 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
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- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
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Images
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
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Abstract
Description
1.少なくとも以下(A)~(C)を配合して得られることを特徴とするポリエステル樹脂組成物。。
(A)ポリブチレンテレフタレート樹脂100重量部、
(B)非晶性樹脂15~100重量部、
(C)トリスフェノールメタン型、テトラキスフェノールエタン型、ノボラック型、およびナフタレン型から選ばれる少なくとも1種のエポキシ樹脂0.010~5.0重量部。
また、ポリエステル樹脂組成物を、窒素ガス雰囲気下で示差走査熱量計を用いて、20℃/minの降温速度で、溶融状態から20℃まで降温し、その後20℃/minの昇温速度で昇温し、その昇温過程中に出現する吸熱ピークの温度が210℃以上、221℃以下である。
2.(B)非晶性樹脂が、ポリカーボネート、シクロヘキサンジメチレンテレフタレート単位を含む非晶性ポリエステル、アクリロニトリル/スチレン共重合体から選ばれる少なくとも1種である、上記1に記載のポリエステル樹脂組成物。
3.(C)エポキシ樹脂がグリシジルエーテルまたはグリシジルエステル構造を有する上記1に記載のポリエステル樹脂組成物。
4.(C)エポキシ樹脂が、下記一般式(1)で表されるグリシジルエーテル構造を有するノボラック型エポキシ樹脂である上記3に記載のポリエステル樹脂組成物。
5.(A)ポリブチレンテレフタレート樹脂100重量部に対して、(C)エポキシ樹脂の含有量が、0.05~3重量部である上記1に記載のポリエステル樹脂組成物。
6.さらに、(D)充填材を含む上記1に記載のポリエステル樹脂組成物。
7.(D)充填材がガラス繊維、または炭素繊維から選ばれる少なくとも1種である、上記6に記載のポリエステル樹脂組成物。
8.(A)ポリブチレンテレフタレート樹脂100重量部に対して、(D)充填材の含有量が1~150重量部である上記6に記載のポリエステル樹脂組成物。
9.さらに(E)エステル交換防止剤を含む上記1に記載のポリエステル樹脂組成物。
10.(E)エステル交換防止剤が、下記一般式(4)で表される上記9に記載のポリエステル樹脂組成物。
11.(A)ポリブチレンテレフタレート樹脂100重量部に対して、(E)エステル交換防止剤の含有量が0.025~0.5重量部である上記9に記載のポリエステル樹脂組成物。
12.さらに(F)核剤を含む上記1に記載のポリエステル樹脂組成物。
13.(F)核剤が、シリカ、酸化アルミニウム、酸化ジルコニウム、酸化チタン、ウォラストナイト、カオリン、タルク、マイカ、炭化ケイ素、エチレンビスラウリル酸アミド、およびソルビトール系誘導体からなる群から選ばれる少なくとも1種である上記12に記載のポリエステル樹脂組成物。
14.(A)ポリブチレンテレフタレート樹脂100重量部に対して、(F)核剤の含有量が0.05~5重量部である上記12に記載のポリエステル樹脂組成物。
15.ポリエステル樹脂組成物を、成形温度260℃、金型温度80℃で成形し、得られた厚み1mmの成形片の波長940nmの条件での分光光度計の透過率が48%以上である上記1に記載のポリエステル樹脂組成物。
16.上記1~15いずれかに記載のポリエステル樹脂組成物から製造された成形品。。
17.レーザー溶着用透過材である上記16に記載の成形品。
18.レーザーを透過する成形品部位の厚さが3mm以下である上記16記載の成形品。
本発明のポリエステル樹脂組成物中のマトリックス樹脂である(A)ポリブチレンテレフタレート(PBT)樹脂としては、ブチレンテレフタレートを主成分とするホモポリエステルまたはコポリエステル等が挙げられる。
本発明のポリエステル樹脂組成物中の(B)非晶性樹脂は、スチレンホモポリマー/コポリマー、ポリフェニレンエーテル、ポリエーテルイミド等の芳香族ポリエーテル、ポリカーボネート、ポリアリレート、ポリスルホン、ポリエーテルスルホン、ポリイミド、またはシクロヘキサンジメチレンテレフタレート単位を含む非晶ポリエステル等が挙げられる。
[η]=limηsp/c(c→0)。
本発明のポリエステル樹脂組成物は、トリスフェノールメタン型、テトラキスフェノールエタン型、ノボラック型、ナフタレン型から選ばれる少なくとも1種のエポキシ樹脂を含む。その中で、(A)ポリブチレンテレフタレート樹脂と(B)非晶性樹脂の相溶性向上を考慮すると、(C)エポキシ樹脂は、グリシジルエーテル構造またはグリシジルエステル構造を有することが好ましい。
本発明のポリエステル樹脂組成物には、さらに(D)充填材を添加することができる。(D)充填材としては、従来技術で用いられる樹脂の充填材を用いることができる。例えば、ガラス繊維、炭素繊維、チタン酸カリウムウイスカー、酸化亜鉛ウイスカー、ホウ酸アルミニウムウイスカー、アラミド繊維、アルミナ繊維、炭化ケイ素繊維、セラミック繊維、アスベスト繊維、石膏繊維、金属繊維、ガラスフレーク、ウォラストナイト、ゼオライト、セリサイト、カオリン、マイカ、タルク、クレー、パイロフィライト、ベントナイト、モンモリロナイト、ヘクトライト、合成雲母、アスベスト、グラファイト、アルミノシリケート、アルミナ、 シリカ、酸化マグネシウム、酸化ジルコニウム、酸化チタン、酸化鉄、炭酸カルシウム、炭酸マグネシウム、ドロマイト、硫酸カルシウム、硫酸バリウム、水酸化マグネシウム、水酸化カルシウム、水酸化アルミニウム、ガラスビーズ、中空ガラスビーズ、セラミックビーズ、窒化ホウ素、炭化ケイ素または珪灰石などが挙げられる。充填材は、中空充填材であってもよく、さらにこれらの充填材を2種以上併用してもよい。 充填剤の平均粒径は、特に限定されないが、ポリエステル樹脂組成物の外観をより良好にするためには、0.001~20μmであることが好ましい。
本発明のポリエステル樹脂組成物には、さらに(E)エステル交換防止剤を添加することができる。(E)エステル交換防止剤としては、(A)ポリブチレンテレフタレート樹脂に含まれるエステル交換反応触媒を失活する化合物であれば特に制限なく用いることができ、ホスファイト系化合物、ホスフェート系化合物が好ましく用いられる。
本発明のポリエステル樹脂組成物中の結晶化促進剤として用いられる(F)結晶核剤としては、ポリマーの結晶化核剤として一般的に用いられているものが満足いくものであり、無機結晶核剤および有機結晶核剤のうちのいずれか1つ以上を用いることができる。
本発明のポリエステル樹脂組成物は、(A)~(F)成分に加えて、酸化防止剤、離型剤、難燃剤、またはマスターバッチ等の添加剤をさらに含有してもよい。
(A)ポリブチレンテレフタレート樹脂
ポリブチレンテレフタレート樹脂(PBT):東レ株式会社 固有粘度:0.76dl/g、カルボキシ末端基濃度:15mol/tonのポリブチレンテレフタレート樹脂
(B)非晶性樹脂
ポリカーボネート(PC):三菱エンジニアリングプラスチック株式会社S1000
シクロヘキサンジメチレンテレフタレート/エチレンテレフタレートの共重合体(PCTG):イーストマンEastarEB062
(C)エポキシ樹脂
エポキシ樹脂1:DIC株式会社 HP-7200H(芳香族グリシジルエーテル構造を有するノボラック型エポキシ樹脂、エポキシ価280g/eq)
エポキシ樹脂2:DIC株式会社 HP4700(芳香族グリシジルエーテル構造を有するナフタレン型エポキシ樹脂、エポキシ価160g/eq)
エポキシ樹脂3:Hexion Cardura E10P(バーサティック酸グリシジルエステル、エポキシ価244g/eq)
エポキシ樹脂4:三菱化学会部式会社JER1009(ビスフェノールA型エポキシ樹脂、エポキシ価2950g/eq)
(D)充填材
ガラス繊維:日本電気硝子株式会社 T187
(E)エステル交換防止剤
エステル交換防止剤:株式会社ADEKA AX-71(ジステアリルアシッドホスフェートとステアリルアシッドホスフェートの混合体)
(F)核剤
核剤1:竹原化学工業株式会社 Hightron(タルク)
核剤2:广州市欧穎化工有限公司 EBL(エチレンビスラウリル酸アミド)
(1)透過率測定
島津製作所製の紫外近赤外分光光度計(UV-3100)を使用し、透過性評価を行った。また、積分球を検出器として用いた。レーザー透過性は、1mm厚のサンプルの近赤外線940nm波長領域の光線透過率を測定した。表中に、透過光量と入射光量との比を百分率で表示した。近赤外940nm波長域の透過率を測定し、10nm毎に透過率を測定して近赤外940nm波長域の透過率の最大値と最小値を求めた。 測定は5回行い、上限値と下限値の平均値を求めた。
TAインスツルメント社製示差走査熱量計(DSC250)を用いて、各実施例および比較例により得られた熱可塑性樹脂組成物5~7mgを正確に秤量し、窒素雰囲気下、20℃/minの昇温速度で、20℃から昇温を開始したときに現れる吸熱ピーク(T0)の温度よりも30℃高い温度まで昇温し、この温度で2min保持、その後、20℃/minの降温速度で20℃まで降温し、20℃で2min保持、再度20℃/minの昇温速度でT0よりも30℃高い温度に昇温し、融点Tmを求めた。Tmは二回目の昇温過程中の吸熱ピークに対応する温度である。
原料は表1に示した。日本製鋼所製TEX30α型二軸押出機(L/D=45.5)を用いて、溶融混練した。押出機は、13個の加熱ゾーンがあり、計量器を備えた供給装置を2つ、真空排気設備を有している。ガラス繊維以外の原料を混合した後、押出機のメインフィーダーから投入、ガラス繊維は押出機のサイドフィーダーから投入した。押出機の温度は100℃~260℃に設定し、溶融混練し、冷却、ペレット化を経由して、粒状のポリエステル樹脂組成物を得た。この粒状物を130℃のオーブンで3hr乾燥した後、日精樹脂工業株式会社製NEX50型射出成形機を用いて、成形温度260℃、金型温度80℃の条件で透過性評価サンプル(金型サイズは長さ80mm、幅80mm、厚み1mm)を射出成形した。上記透過率、融点測定方法によって、測定を行った。測定結果を表1に示した。
製造方法は実施例1と同様、原料は表2に示した通りである。上記透過率、融点試験方法に従って試験した結果を表2に示した。
Claims (18)
- 少なくとも以下(A)~(C)を配合して得られることを特徴とするポリエステル樹脂組成物。
(A)ポリブチレンテレフタレート樹脂100重量部、
(B)非晶性樹脂15~100重量部、
(C)トリスフェノールメタン型、テトラキスフェノールエタン型、ノボラック型、およびナフタレン型から選ばれる少なくとも1種のエポキシ樹脂0.010~5.0重量部。
また、ポリエステル樹脂組成物を、窒素ガス雰囲気下で示差走査熱量計を用いて、20℃/minの降温速度で、溶融状態から20℃まで降温し、その後20℃/minの昇温速度で昇温し、その昇温過程中に出現する吸熱ピークの温度が210℃以上、221℃以下である。 - (B)非晶性樹脂が、ポリカーボネート、シクロヘキサンジメチレンテレフタレート単位を含む非晶性ポリエステル、アクリロニトリル/スチレン共重合体から選ばれる少なくとも1種である、請求項1に記載のポリエステル樹脂組成物。
- (C)エポキシ樹脂がグリシジルエーテル、またはグリシジルエステル構造を有する請求項1に記載のポリエステル樹脂組成物。
- (C)エポキシ樹脂が、下記一般式(1)で表されるグリシジルエーテル構造を有するノボラック型エポキシ樹脂である請求項3に記載のポリエステル樹脂組成物。
- (A)ポリブチレンテレフタレート樹脂100重量部に対して、(C)エポキシ樹脂の含有量が、0.05~3重量部である請求項1に記載のポリエステル樹脂組成物。
- さらに、(D)充填材を含む請求項1に記載のポリエステル樹脂組成物。
- (D)充填材がガラス繊維、または炭素繊維から選ばれる少なくとも1種である、請求項6に記載のポリエステル樹脂組成物。
- (A)ポリブチレンテレフタレート樹脂100重量部に対して、(D)充填材の含有量が1~150重量部である請求項6に記載のポリエステル樹脂組成物。
- さらに(E)エステル交換防止剤を含む請求項1に記載のポリエステル樹脂組成物。
- (A)ポリブチレンテレフタレート樹脂100重量部に対して、(E)エステル交換防止剤の含有量が0.025~0.5重量部である請求項9に記載のポリエステル樹脂組成物。
- さらに(F)核剤を含む請求項1に記載のポリエステル樹脂組成物。
- (F)核剤が、シリカ、酸化アルミニウム、酸化ジルコニウム、酸化チタン、ウォラストナイト、カオリン、タルク、マイカ、炭化ケイ素、エチレンビスラウリル酸アミド、およびソルビトール系誘導体からなる群から選ばれる少なくとも1種である請求項12に記載のポリエステル樹脂組成物。
- (A)ポリブチレンテレフタレート樹脂100重量部に対して、(F)核剤の含有量が0.05~5重量部である請求項12に記載のポリエステル樹脂組成物。
- ポリエステル樹脂組成物を、成形温度260℃、金型温度80℃で成形し、得られた厚み1mmの成形片の分光高度計による波長940nmでの透過率が48%以上である請求項1に記載のポリエステル樹脂組成物。
- 請求項1~15いずれかに記載のポリエステル樹脂組成物から製造された成形品。
- レーザー溶着用透過材である請求項16に記載の成形品。
- レーザーを透過する成形品部位の厚さが3mm以下である請求項16記載の成形品。
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PCT/CN2020/102916 WO2021013115A1 (zh) | 2019-07-22 | 2020-07-20 | 一种聚酯树脂组合物及其成型品 |
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US (1) | US20220275199A1 (ja) |
EP (1) | EP4006103A4 (ja) |
JP (1) | JP2022544346A (ja) |
CN (1) | CN112384568B (ja) |
WO (1) | WO2021013115A1 (ja) |
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US20220325037A1 (en) * | 2019-05-20 | 2022-10-13 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition for millimeter-wave radar member, molded article, and method for producing resin composition |
JP7265979B2 (ja) * | 2019-12-17 | 2023-04-27 | ポリプラスチックス株式会社 | レーザー溶着用成形品、レーザー溶着用成形品のレーザー透過率のばらつき抑制剤 |
CN118103449A (zh) * | 2021-08-13 | 2024-05-28 | 国际人造丝公司 | 激光透明组合物及由其制成的模制品 |
EP4166605A1 (en) * | 2021-10-18 | 2023-04-19 | SHPP Global Technologies B.V. | Laser transparent low warpage glass filled pbt compositions for laser welding |
KR20230096633A (ko) * | 2021-12-23 | 2023-06-30 | 롯데케미칼 주식회사 | 열가소성 수지 조성물 및 이로부터 제조된 성형품 |
CN118696092A (zh) | 2022-02-16 | 2024-09-24 | 巴斯夫欧洲公司 | 聚对苯二甲酸丁二醇酯组合物 |
CN115322531A (zh) * | 2022-08-12 | 2022-11-11 | 湖北合聚新材料有限公司 | 一种耐水解的激光焊接pbt材料及其制备方法 |
CN116200016A (zh) * | 2023-03-16 | 2023-06-02 | 苏州旭光聚合物有限公司 | 一种可激光焊接的玻纤增强聚酯材料及其制备方法 |
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JP3656603B2 (ja) * | 2002-01-28 | 2005-06-08 | 松下電工株式会社 | 熱可塑性樹脂成形材料及び樹脂成形品 |
CN100376630C (zh) | 2003-10-07 | 2008-03-26 | 胜技高分子株式会社 | 激光熔敷用树脂组合物和成形品 |
US20050171321A1 (en) * | 2004-01-06 | 2005-08-04 | Hiroyuki Sumi | Laser weldable polyester composition and process for laser welding |
JP5076270B2 (ja) | 2004-05-28 | 2012-11-21 | 東レ株式会社 | 中空成形品および複合成形品 |
JP2007186584A (ja) | 2006-01-13 | 2007-07-26 | Mitsubishi Engineering Plastics Corp | レーザー溶着用ポリエステル樹脂組成物およびこれを用いた成形品 |
US8142900B2 (en) * | 2006-09-13 | 2012-03-27 | Wintech Polymer Ltd. | Laser-weldable resin composition and molded product |
JP5420834B2 (ja) * | 2007-10-31 | 2014-02-19 | 東レ株式会社 | 熱可塑性樹脂組成物およびそれからなる成形品ならびに複合成形体 |
JP5210068B2 (ja) * | 2008-07-23 | 2013-06-12 | パナソニック株式会社 | レーザ溶着用熱可塑性樹脂組成物、樹脂成形品の製造方法、及び樹脂成形品 |
JP2010070626A (ja) * | 2008-09-18 | 2010-04-02 | Toray Ind Inc | ポリエステル樹脂組成物および複合成形体 |
JP5884102B2 (ja) * | 2012-01-30 | 2016-03-15 | オリヱント化学工業株式会社 | レーザー溶着用樹脂組成物及びその溶着体 |
CN106471059B (zh) * | 2014-07-01 | 2019-03-19 | 三菱工程塑料株式会社 | 聚酯树脂组合物、注射成型品、光反射体基体和光反射体 |
US10781308B2 (en) * | 2016-02-25 | 2020-09-22 | Mitsubishi Engineering-Plastics Corporation | Resin composition for laser welding and welded body thereof |
EP3287493A1 (de) * | 2016-08-26 | 2018-02-28 | LANXESS Deutschland GmbH | Polyesterzusammensetzungen |
JP7177737B2 (ja) * | 2019-03-25 | 2022-11-24 | 日本化薬株式会社 | 金属酸化物、その分散液、樹脂組成物、及び熱線遮蔽性フィルム |
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- 2020-07-20 WO PCT/CN2020/102916 patent/WO2021013115A1/zh unknown
- 2020-07-20 JP JP2021573866A patent/JP2022544346A/ja active Pending
- 2020-07-20 US US17/627,215 patent/US20220275199A1/en active Pending
- 2020-07-20 CN CN202080002494.0A patent/CN112384568B/zh active Active
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CN112384568B (zh) | 2021-08-06 |
US20220275199A1 (en) | 2022-09-01 |
CN112384568A (zh) | 2021-02-19 |
EP4006103A4 (en) | 2023-08-23 |
EP4006103A1 (en) | 2022-06-01 |
WO2021013115A1 (zh) | 2021-01-28 |
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