WO2022037660A1 - 聚酯树脂组合物及其成型品 - Google Patents
聚酯树脂组合物及其成型品 Download PDFInfo
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- WO2022037660A1 WO2022037660A1 PCT/CN2021/113651 CN2021113651W WO2022037660A1 WO 2022037660 A1 WO2022037660 A1 WO 2022037660A1 CN 2021113651 W CN2021113651 W CN 2021113651W WO 2022037660 A1 WO2022037660 A1 WO 2022037660A1
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- WIPO (PCT)
- Prior art keywords
- polyester resin
- resin composition
- sodium
- mass
- parts
- Prior art date
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- 229920001225 polyester resin Polymers 0.000 title claims abstract description 93
- 239000004645 polyester resin Substances 0.000 title claims abstract description 93
- 239000000203 mixture Substances 0.000 title claims abstract description 89
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 184
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 51
- 239000011734 sodium Substances 0.000 claims abstract description 39
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 39
- 238000002834 transmittance Methods 0.000 claims abstract description 38
- 238000003466 welding Methods 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims description 47
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 28
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 125000000524 functional group Chemical group 0.000 claims description 21
- 239000000945 filler Substances 0.000 claims description 17
- 239000004593 Epoxy Chemical class 0.000 claims description 14
- PJFPFKALGCPVLG-UHFFFAOYSA-N cyclohexane;3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group C1CCCCC1.O=C1OCCOC(=O)C2=CC=C1C=C2 PJFPFKALGCPVLG-UHFFFAOYSA-N 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 13
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- 239000003822 epoxy resin Substances 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 235000010234 sodium benzoate Nutrition 0.000 claims description 6
- 239000004299 sodium benzoate Substances 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 5
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 5
- BYKRNSHANADUFY-UHFFFAOYSA-M sodium octanoate Chemical compound [Na+].CCCCCCCC([O-])=O BYKRNSHANADUFY-UHFFFAOYSA-M 0.000 claims description 5
- JXKPEJDQGNYQSM-UHFFFAOYSA-M sodium propionate Chemical group [Na+].CCC([O-])=O JXKPEJDQGNYQSM-UHFFFAOYSA-M 0.000 claims description 5
- 235000010334 sodium propionate Nutrition 0.000 claims description 5
- 239000004324 sodium propionate Substances 0.000 claims description 5
- 229960003212 sodium propionate Drugs 0.000 claims description 5
- YKIBJOMJPMLJTB-UHFFFAOYSA-M sodium;octacosanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O YKIBJOMJPMLJTB-UHFFFAOYSA-M 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 229960005480 sodium caprylate Drugs 0.000 claims description 4
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims description 3
- 125000005011 alkyl ether group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 159000000000 sodium salts Chemical class 0.000 claims description 3
- 229940080350 sodium stearate Drugs 0.000 claims description 3
- 125000003504 2-oxazolinyl group Chemical class O1C(=NCC1)* 0.000 claims 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical group OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract description 26
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 25
- 238000000034 method Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract description 3
- 230000000630 rising effect Effects 0.000 abstract 2
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- 230000000052 comparative effect Effects 0.000 description 11
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- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 8
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- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 5
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- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
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- 229920000728 polyester Polymers 0.000 description 5
- 239000001993 wax Substances 0.000 description 5
- 229920001634 Copolyester Polymers 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
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- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 3
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
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- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DPNUIZVZBWBCPB-UHFFFAOYSA-J titanium(4+);tetraphenoxide Chemical class [Ti+4].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 DPNUIZVZBWBCPB-UHFFFAOYSA-J 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- SAAMKFBWYWFBNY-UHFFFAOYSA-N tris(4-tert-butylphenyl) phosphite Chemical compound C1=CC(C(C)(C)C)=CC=C1OP(OC=1C=CC(=CC=1)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1 SAAMKFBWYWFBNY-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- BHYQWBKCXBXPKM-UHFFFAOYSA-N tris[3-bromo-2,2-bis(bromomethyl)propyl] phosphate Chemical compound BrCC(CBr)(CBr)COP(=O)(OCC(CBr)(CBr)CBr)OCC(CBr)(CBr)CBr BHYQWBKCXBXPKM-UHFFFAOYSA-N 0.000 description 1
- PEXOFOFLXOCMDX-UHFFFAOYSA-N tritridecyl phosphite Chemical compound CCCCCCCCCCCCCOP(OCCCCCCCCCCCCC)OCCCCCCCCCCCCC PEXOFOFLXOCMDX-UHFFFAOYSA-N 0.000 description 1
- 239000010698 whale oil Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
Definitions
- the present invention relates to a polyester resin composition with high laser transmittance and a molded product thereof, which can be used as a transparent material in a laser welding process.
- thermoplastic polyesters polybutylene terephthalate resins have excellent injection moldability, mechanical properties, heat resistance, chemical resistance and other properties, and are widely used in mechanical parts, electrical/communication parts, and automotive parts. Used as molded products. In recent years, in order to reduce the weight of products, the metal parts used in the past have been gradually replaced by resin composite materials. When resin composites are applied to electronic parts with complex product shapes, adhesives or bolts are usually used for connection. However, there is a problem in work efficiency when connecting using adhesives, bolts, or the like. On the other hand, although heat welding methods such as hot plate welding, vibration welding, and ultrasonic welding can complete the work in a short time, the influence on the appearance of the product is still a problem.
- heat welding methods such as hot plate welding, vibration welding, and ultrasonic welding can complete the work in a short time, the influence on the appearance of the product is still a problem.
- laser welding is a welding method that has high work efficiency and can maintain a good appearance of the product. Using laser light to irradiate a molded product composed of a transparent material and an absorbing material, heat energy can be transmitted between the transparent material and the absorbing material. The contact surface accumulated to the molten resin to achieve the purpose of bonding.
- the processing condition window is narrow, and it is necessary to increase the laser power or irradiation rate during welding, or reduce the laser irradiation part.
- the thickness of the molded part can achieve a good bonding effect.
- increasing the laser power or irradiation rate may cause scorch and whitening on the surface of the material, and at the same time, the welding strength decreases.
- Patent Document 1 describes a polyester mixture added with a basic fatty acid salt as a nucleating agent, which can improve the laser transmittance at 1064 nm of a resin test piece having a thickness of 2 mm.
- the transmittance can also be improved by adding other resins with high laser transmittance.
- Patent Document 2 describes that when a mixture of polybutylene terephthalate resin and polycarbonate is melt-kneaded, and a certain shear force is applied, a biphasic continuous structure with a structure period of 0.001 ⁇ m or more and less than 0.4 ⁇ m is formed.
- a particle phase structure with a pitch of 0.001 ⁇ m or more and less than 0.4 ⁇ m since the polymer alloy has a dispersed structure shorter than the wavelength of visible light, the laser transmittance of the material can be improved.
- Patent Document 3 describes a resin composition containing a polybutylene terephthalate resin, an amorphous resin, a styrene-based elastomer, and a phosphate stabilizer.
- Patent Document 4 describes a polybutylene terephthalate resin, cyclohexane dimethylene terephthalate/ethylene terephthalate copolymer, reinforcing fibers, and methyl methacrylate/ Polyester resin composition of butyl acrylate copolymer.
- Patent Document 5 describes a polybutylene terephthalate resin, a cyclohexane dimethylene terephthalate/ethylene terephthalate copolymer, a compound having three or more functional groups, and an inorganic Thermoplastic resin composition for laser welding of fillers.
- Patent Document 1 International Publication No. WO2012/119996
- Patent Document 2 Japanese Patent Laid-Open No. 2005-336408
- Patent Document 3 Japanese Patent Laid-Open No. 2007-131692
- Patent Document 4 Japanese Patent Laid-Open No. 2010-70626
- Patent Document 5 Japanese Patent Laid-Open No. 2009-132861
- An object of the present invention is to provide a polyester resin composition having high laser transmittance.
- the present inventors have conducted intensive studies and found that by combining at least (A) a polybutylene terephthalate resin and (B) a polyester containing a cyclohexane dimethylene terephthalate unit
- the resin and (C) sodium aliphatic carboxylate and/or sodium aromatic carboxylate are blended in a specific compounding ratio, and the resin composition thus constituted satisfies the following conditions, the laser transmittance of the resin composition can be improved , the conditions are:
- the polyester resin composition was cooled from a molten state to 20°C at a cooling rate of 20°C/min, and then heated at a temperature increase rate of 20°C/min,
- the temperature of the endothermic peak appearing during the temperature rise is 200°C or higher and 222°C or lower.
- the present invention has been achieved.
- the present invention is configured as follows.
- the polyester resin composition was cooled down from a molten state to 20° C. at a cooling rate of 20° C./min, and then the temperature was increased at a rate of 20° C./min.
- the temperature of the endothermic peak which appears during the temperature rise is 200°C or higher and 222°C or lower.
- polyester resin composition according to (1) above further comprising (D) a compound having a functional group reactive with a carboxyl group.
- X represents a divalent group represented by the general formula (2) or the general formula (3), and n represents a value greater than 0 and 10 or less;
- R 1 , R 2 , R 4 , and R 5 may be the same or different, and each independently represents an alkyl group having 1 to 8 carbon atoms, or an alkyl group having 6 carbon atoms. ⁇ 10 aryl group or C1 ⁇ 8 alkyl ether group; R 3 represents hydrogen atom, C1 ⁇ 8 alkyl group or C6 ⁇ 8 aryl group; a, c, d Each independently represents an integer of 0 to 4, and b represents an integer of 0 to 3.
- polyester resin composition according to (1) above further comprising (E) a filler.
- a polyester resin composition having high laser transmittance and suitable for a laser welding process and a molded product thereof can be provided.
- FIG. 1 a is a plan view of a test piece for evaluating the laser transmittance of the polyester resin compositions of Examples and Comparative Examples
- FIG. 1 b is a laser transmittance of the polyester resin compositions of Examples and Comparative Examples.
- the (A) polybutylene terephthalate (PBT) resin serving as the matrix resin in the polyester resin composition of the present invention may be, for example, a homopolyester or a copolyester mainly composed of butylene terephthalate. polyester.
- the monomers that can be copolymerized in the copolyester can be exemplified by dicarboxylic acids other than terephthalic acid, diols other than 1,4-butanediol, oxyacids or lactones, etc. .
- Co-monomers may be used alone or in combination of two or more. Among them, the amount of the copolymerizable monomer is preferably 30 mol % or less of the total monomer amount.
- the dicarboxylic acids other than terephthalic acid can be exemplified by aliphatic dicarboxylic acids (for example, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, Undecyldicarboxylic acid, dodecyldicarboxylic acid, hexadecyldicarboxylic acid), alicyclic dicarboxylic acid (eg, hexahydrophthalic acid, hexahydroisophthalic acid, hexahydrophthalic acid terephthalic acid), aromatic dicarboxylic acids (eg, phthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-dicarboxylic acid C8-16 aromatic dicarboxylic acids such as phenyl ether dicarboxylic acid, 4,4'-dipheny
- the diols other than 1,4-butanediol can be exemplified by aliphatic alkylene glycols (for example, ethylene glycol, propylene glycol, pentanediol, neopentyl glycol, hexanediol, heptanediol, etc.) C2-12 alkane diols such as diol, octanediol, nonanediol, or decanediol, preferably C2-10 alkane diols), polyalkoxy diols (for example, diethylene glycol, dipropylene glycol, diethylene glycol, Butylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, polybutylene glycol and other oxyalkyl group-containing glycols), aromatic glycols (for example, hydroquinone, resorcinol , C6-C14
- the oxyacid can be exemplified by oxybenzoic acid, oxynaphthoic acid, hydroxyphenylacetic acid, glycolic acid, or oxycaproic acid and other hydroxy acids and derivatives thereof.
- the lactone may, for example, be propiolactone, butyrolactone, valerolactone, or C3-12 lactone such as caprolactone.
- the intrinsic viscosity of the (A) polybutylene terephthalate resin in a solution of o-chlorophenol measured at 25°C is 0.36 to 3.0 dl/g, more preferably the intrinsic viscosity is 0.42 to 2.0 dl/g.
- the polyester resin composition of the present invention two or more polybutylene terephthalate resins having different intrinsic viscosities can be used simultaneously, and preferably, the above-mentioned different intrinsic viscosities are all within the above-mentioned ranges.
- the terminal carboxyl group content of the polybutylene terephthalate resin is preferably 50 meq/kg or less.
- the terminal carboxyl group content of the (A) polybutylene terephthalate resin may be obtained by dissolving it in an o-cresol/chloroform solvent and then titrating it with ethanolated potassium hydroxide.
- the polybutylene terephthalate resin can be produced by polymerizing by a conventional method (eg, transesterification, direct esterification, etc.).
- the catalyst used for the transesterification reaction may be a conventionally known catalyst, such as a titanium compound, a tin compound, a magnesium compound, a calcium compound and the like. Among them, titanium compounds are particularly preferred. Specific examples of the titanium compound as a catalyst for transesterification include titanium alkoxides such as tetramethyl titanate, tetraisopropyl titanate, and tetrabutyl titanate, and titanium phenolates such as tetraphenyl titanate.
- Polyester containing cyclohexane dimethylene terephthalate unit refers to the product obtained by polymerizing terephthalic acid or terephthalic acid derivatives capable of forming an ester with 1,4-cyclohexane dimethanol. Homopolyesters or copolyesters of cyclohexanedimethylene terephthalate units.
- examples of copolymerizable monomers include dicarboxylic acids other than terephthalic acid and dicarboxylic acids other than 1,4-cyclohexanedimethanol glycol.
- Comonomers may be used alone or in combination of two or more.
- Diols other than 1,4-cyclohexanedimethanol include aliphatic alkylene glycols (eg, ethylene glycol, propylene glycol, butanediol, pentanediol, neopentyl glycol, hexylene glycol, heptanediol alcohols, octanediol, nonanediol, decanediol or other C2-12 alkyl diols, preferably C2-10 alkyl diols), polyoxyalkylene diols (eg, diols with oxyalkylene units, such as Diethylene glycol, dipropylene glycol, dibutylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, polybutylene glycol), cycloaliphatic diols (eg 1,2-cyclohexanediol) Alcohols, 1,3-cyclo
- Dicarboxylic acids other than terephthalic acid may be exemplified by aliphatic dicarboxylic acids (eg, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid) Alkyl dicarboxylic acids, dodecyl dicarboxylic acids, hexadecyl dicarboxylic acids), alicyclic dicarboxylic acids (e.g., hexahydrophthalic acid, hexahydroisophthalic acid, hexahydroterephthalic acid) dicarboxylic acid), aromatic dicarboxylic acids (eg, phthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenylmethane dicarbox
- the polyester resin containing a cyclohexane dimethylene terephthalate unit is preferably terephthalate.
- terephthalate Formic acid/1,4-cyclohexanedimethanol/ethylene glycol copolymer, terephthalic acid/1,4-cyclohexanedimethanol/2,2,4,4-tetramethyl-1,3-ring Any one or more of butanediol copolymer, terephthalic acid/isophthalic acid/1,4-cyclohexanedimethanol copolymer.
- the molar ratio [(I)/(II)] of the other diol unit (I) and the 1,4-cyclohexanedimethanol unit (II) is preferably 1/99 to 99/1.
- [(I)/(II)] is preferably 80/20 or less, more preferably 75/25 or less, still more preferably 50/ Below 50.
- the lower limit is preferably 20/80 or more, more preferably 25/75 or more, and still more preferably 30/70 or more.
- the glass transition temperature of (B) the polyester resin containing cyclohexane dimethylene terephthalate unit of this invention is 70 degreeC or more and 130 degrees C or less.
- a polyester resin composition having high heat resistance and high transmittance can be obtained. More preferably, it is 75 degreeC or more, More preferably, it is 80 degreeC or more.
- the upper limit is preferably 125°C or lower, more preferably 120°C or lower.
- (B) contains a terephthalic acid ring with respect to 100 parts by mass of the (A) polybutylene terephthalate resin. Content of the polyester resin of a hexane dimethylene ester unit is 5-100 mass parts. Within this range, the laser transmittance and moldability of the polyester resin composition can be improved. Furthermore, (B) 20 mass parts or more are preferable and, as for the lower limit of content of the polyester resin containing a cyclohexane dimethylene terephthalate unit, 30 mass parts or more are more preferable. The upper limit of the content is preferably 70 parts by mass or less, and more preferably 60 parts by mass or less.
- aliphatic sodium carboxylate it can be a linear or branched structure, and can also be a saturated or unsaturated structure. Specifically, sodium formate, sodium acetate, sodium propionate, sodium butyrate, sodium valerate, sodium caproate, sodium caprylate, sodium pelargonate, sodium caprate, sodium laurate, sodium myristate, and palmitic acid may be mentioned. Sodium, sodium heptadecanoate, sodium stearate, sodium behenate, sodium montanic acid and other saturated aliphatic sodium carboxylates having 1 to 50 carbon atoms, sodium oleic acid, linoleic acid Sodium, sodium linolenic, etc. Sodium unsaturated aliphatic carboxylate having 1 to 50 carbon atoms.
- aliphatic sodium carboxylate and aromatic sodium carboxylate may be used alone or in combination of two or more.
- the (C) sodium aliphatic carboxylate and/or sodium aromatic carboxylate is at least one selected from the group consisting of sodium salt of aliphatic carboxylic acid having 1 to 50 carbon atoms and sodium benzoate more preferably at least one selected from the group consisting of sodium propionate, sodium caprylate, sodium stearate and sodium montanate.
- content of (C) sodium aliphatic carboxylate and/or sodium aromatic carboxylate is 0.05-5 mass parts with respect to 100 mass parts of (A) polybutylene terephthalate resin.
- the content is preferably 0.2 parts by mass or more, and more preferably 0.4 parts by mass or more. On the other hand, it is preferably 3.0 parts by mass or less, and more preferably 2.5 parts by mass or less.
- (D) a compound having a functional group reactive with a carboxyl group may be further added.
- the compound having a functional group reactive with a carboxyl group (D) is preferably at least one selected from a carbodiimide compound, an epoxy compound, and an oxazoline compound.
- the carbodiimide compound can be exemplified as N,N'-bis-o-tolylcarbodiimide, N,N'-diphenylcarbodiimide, N,N'-dioctyldecyl Carbodiimide, N,N'-di-2,6-dimethylphenylcarbodiimide, N,N'-di-2,6-diisopropylphenylcarbodiimide, N, N'-di-2,6-di-tert-butylphenylcarbodiimide, N,N'-di-p-nitrophenylcarbodiimide, N,N'-di-p-aminophenylcarbodiimide Diimide, N,N'-di-p-hydroxyphenylcarbodiimide, N,N'-di-cyclohexylcarbodiimide, N,N'-di-p-tolylcarbodiimide,
- any one of a glycidyl ether compound, a glycidyl ester compound, a glycidyl amine compound, a glycidyl imide compound, or an alicyclic epoxy compound can be used.
- the glycidyl ether compound can be exemplified by butyl glycidyl ether, octadecyl glycidyl ether, allyl glycidyl ether, phenyl glycidyl ether, o-phenylphenyl glycidyl ether, epoxy Ethane Lauryl Glycidyl Ether, Ethylene Oxide Phenol Glycidyl Ether, Ethylene Glycol Diglycidyl Ether, Polyethylene Glycol Diglycidyl Ether, Propylene Glycol Diglycidyl Ether, Polypropylene Glycol Diglycidyl Ether, Neopentyl Glycol Diglycidyl Ether, Polytetramethylene Glycol Diglycidyl Ether, Cyclohexanedimethanol Diglycidyl Ether, Glycerol Triglycidyl Ether, Trimethylolpropane Triglycid
- the glycidyl ester compound may, for example, include glycidyl benzoate, glycidyl p-toluate, glycidyl cyclohexanecarboxylate, glycidyl stearate, glycidyl laurate, and glycidyl palmitate.
- Glycerides branched alkane carboxylate glycidyl esters, glycidyl oleate, glycidyl linoleate, glycidyl linoleate, diglycidyl terephthalate, diglycidyl isophthalate, Diglycidyl phthalate, Diglycidyl naphthalene dicarboxylate, Diglycidyl dibenzoate, Diglycidyl methyl terephthalate, Diglycidyl hexahydrophthalate, Tetrahydrophthalate Diglycidyl phthalate, Diglycidyl cyclohexanedicarboxylate, Diglycidyl adipate, Diglycidyl succinate, Diglycidyl sebacate, Diglycidyl dodecanedione Glycidyl ester, octadecanedicarboxylic acid diglycidyl ester, trimellitic acid triglycid
- the glycidyl amine compound can be exemplified by tetraglycidyl aminodiphenylmethane, triglycidyl-p-aminophenol, triglycidyl-m-aminophenol, diglycidylaniline, diglycidyl Toluidine, Tetraglycidyl m-xylylenediamine, Diglycidyl Tribromoaniline, Tetraglycidyl Diaminomethyl Cyclohexane, Triglycidyl Cyanurate, or Triglycidyl Isocyanurate acid esters, etc.
- the glycidyl imide compound can be exemplified by N-glycidyl phthalimide, N-glycidyl-4-methyl phthalimide, N-glycidyl phthalimide -4,5-Dimethylphthalimide, N-glycidyl-3-methylphthalimide, N-glycidyl-3,6-dimethylphthalimide Carboximide, N-glycidyl-4-ethoxyphthalimide, N-glycidyl-4-chlorophthalimide, N-glycidyl-4, 5-Dichlorophthalimide, N-glycidyl-3,4,5,6-tetrabromophthalimide, N-glycidyl-4-n-butyl-5 -Bromophthalimide, N-glycidylsuccinimide, N-glycidylhexahydrophthalimide, N-glycidyl-1,2,3,6-tetra Hydrogenated phthalimide, N
- the alicyclic epoxy compound may, for example, be 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, bis(3,4-epoxycyclohexylmethyl)hexane Diester, vinylcyclohexene diepoxide, N-methyl-4,5-epoxycyclohexane-1,2-dicarboxyimide, N-ethyl-4,5-ring Oxycyclohexane-1,2-dicarboxyimide, N-phenyl-4,5-epoxycyclohexane-1,2-dicarboxyimide, N-naphthyl-4,5 -Epoxycyclohexane-1,2-dicarboxyimide, N-tolyl-3-methyl-4,5-epoxycyclohexane-1,2-dicarboxyimide, etc.
- epoxy compounds can also be used, and examples thereof include epoxy-modified fatty acid glycerides such as epoxidized soybean oil, epoxidized linseed oil, and epoxidized whale oil, phenol novolak-type epoxy resins, or A cresol novolak epoxy resin or the like is used as (D) a compound having a functional group reactive with a carboxyl group.
- the epoxy equivalent of the above epoxy compound is preferably 100 to 1000 g/eq. Within this range, gas generation during melt processing can be suppressed, and the reaction with the carboxyl group of (A) polybutylene terephthalate can be efficiently performed. Furthermore, it is more preferable that the epoxy equivalent of an epoxy compound is 200 g/eq or more. About the upper limit, it is more preferable that it is 500 g/eq or less, and it is still more preferable that it is 400 g/eq or less.
- the oxazoline compound can be exemplified by 2-methoxy-2-oxazoline, 2-ethoxy-2-oxazoline, 2-propoxy-2-oxazoline, 2-butane Oxy-2-oxazoline, 2-pentyloxy-2-oxazoline, 2-hexyloxy-2-oxazoline, 2-heptyloxy-2-oxazoline, 2-octyl Oxy-2-oxazoline, 2-nonyloxy-2-oxazoline, 2-decyloxy-2-oxazoline, 2-cyclopentyloxy-2-oxazoline, 2- Cyclohexyloxy-2-oxazoline, 2-allyloxy-2-oxazoline, 2-methylallyloxy-2-oxazoline, 2-phenoxy-2-oxaline oxazoline, 2-cresol-2-oxazoline, 2-o-ethylphenoxy-2-oxazoline, 2-o-propylphenoxy-2-oxazoline, 2-o-phenyl
- the compound having a functional group reactive with a carboxyl group in the polyester resin composition of the present invention is preferably aliphatic Or at least one of aromatic glycidyl ether, aliphatic or aromatic glycidyl ester.
- the compound having a functional group reactive with the carboxyl group is preferably at room temperature (25° C.). solid.
- the compound (D) is preferably at least one epoxy resin selected from the group consisting of trisphenolmethane type, tetraphenolethane type, novolak type and naphthalene type. It is especially preferable to have a novolak-type epoxy resin represented by the following general formula (1).
- R 1 , R 2 , R 4 and R 5 may be the same or different, and each independently represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms.
- R 3 represents a hydrogen atom, an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 8 carbon atoms; a, c, and d each independently represent an integer of 0 to 4, b represents an integer from 0 to 3.
- (D) content of the compound which has a functional group reactive with a carboxyl group is preferable with respect to 100 mass parts of (A) polybutylene terephthalate resin, (D) content of the compound which has a functional group reactive with a carboxyl group.
- the compound having a functional group capable of reacting with a carboxyl group can react with the terminal carboxyl group of the (A) polybutylene terephthalate resin, thereby suppressing (A) polybutylene terephthalate Butylene diester resin crystallizes to improve laser transmittance.
- the content of the compound having a functional group reactive with a carboxyl group is more preferably 0.5 part by mass or more, and further preferably 1.0 part by mass or more. About the upper limit, it is more preferable that it is 3.5 mass parts or less, and it is still more preferable that it is 3.0 mass parts or less.
- the (E) filler may be further added to the polyester resin composition of the present invention.
- the (E) filler may be a filler commonly used in conventional resins.
- the filler may also be a filler that is structurally hollow, and further, two or more of these fillers may be selected and used in combination.
- the average diameter of the filler is not particularly limited, and in order to obtain a better appearance of the polyester resin composition, it is preferably 0.001 to 20 ⁇ m.
- the filler is preferably at least one of glass fiber or carbon fiber.
- the glass fiber is not particularly limited, and can be the glass fiber used in the prior art. Glass fibers may be chopped strands, rovings, or milled fibers that are cut to length. Generally, the glass fiber preferably used has an average diameter of 5 to 15 ⁇ m. In the case of using chopped strands, the length is not particularly limited, but it is preferable to use fibers with a standard length of 3 mm suitable for extrusion and kneading operations.
- the cross-sectional shape of the above-mentioned fibrous fillers is not particularly limited, and any one or more of circular or flat fibers may be selected and used in combination.
- the content of the filler (E) is preferably 100 parts by mass relative to the polybutylene terephthalate resin (A). 1 to 150 parts by mass. It is more preferable that it is 10 mass parts or more, and it is still more preferable that it is 30 mass parts or more. On the other hand, 100 parts by mass or less is more preferable, and 80 parts by mass or less is further preferable.
- the filler (E) of the present invention can be used after treating its surface with a known coupling agent (eg, silane coupling agent, titanate coupling agent, etc.) or other surface treatment methods.
- a known coupling agent eg, silane coupling agent, titanate coupling agent, etc.
- glass fibers may be coated or bundled with thermoplastic resins such as ethylene/vinyl acetate copolymers or thermosetting resins such as epoxy resins, aminosilanes, and epoxysilanes.
- one or more additives such as nucleating agents, plasticizers, anti-UV agents, transesterification inhibitors, mold release agents, flame retardants may also be added within the scope of not impairing the effects of the present invention.
- colorants eg, pigments or dyes
- lubricants eg, antistatic agents, antioxidants.
- the nucleating agent examples include talc, kaolin, mica, wollastonite, silica, alumina, zirconia, titania, calcium sulfate, barium sulfate, and the like.
- the content of the nucleating agent is preferably 0.05 to 5 parts by mass relative to 100 parts by mass of the (A) polybutylene terephthalate resin.
- the colorant it includes pigments and dyes.
- dyes include dyes such as anthraquinones; specific examples of pigments include organic pigments such as phthalocyanine, azo compound, perone, anthraquinone, etc., as well as chromate, sulfide, silicate, carbonate, ferrocyanide, etc.
- Inorganic pigments such as compounds.
- organic pigments are preferably used as colorants.
- the content of the colorant is preferably 0.01 to 10 parts by mass relative to 100 parts by mass of the (A) polybutylene terephthalate resin.
- the transesterification inhibitor is a compound that can be used to deactivate the transesterification catalyst in the resin containing (A) polybutylene terephthalate, and it is not particularly limited, but phosphite-based, phosphoric acid esters are preferred. series of compounds.
- Examples of the phosphite-based compound include triphenyl phosphite, trinonylbenzene phosphite, tricresyl phosphite, trimethyl phosphite, triethyl phosphite, and tri( 2-ethylhexyl) ester, tridecyl phosphite, tris(dodecyl) phosphite, tris(tridecyl) phosphite, trioleyl phosphite, 2-ethylhexyl diphenyl Phosphite, diphenyl monodecyl phosphite, diphenyl mono(tridecyl) phosphite, phenyl didecyl phosphite, tris(dodecyl trithiophosphite) ) ester, diethyl phosphite, bis(2-ethy
- the phosphate-based compound may, for example, be a compound represented by the following general formula (4).
- R 6 is an alkyl group having 1 to 30 carbon atoms, and m is 1 or 2.
- Specific examples of the compound represented by the general formula (4) include methyl phosphate, dimethyl phosphate, ethyl phosphate, diethyl phosphate, isopropyl phosphate, diisopropyl phosphate, butyl phosphate, Dibutyl phosphate, 2-ethylhexyl phosphate, di-2-ethylhexyl phosphate, octyl phosphate, dioctyl phosphate, isodecyl phosphate, diisodecyl phosphate, isodecyl phosphate Tridecyl Phosphate, Diisotridecyl Phosphate, n-Dodecyl Phosphate, Di(dodecyl) Phosphate, Octadecyl Phosphate, Di(Octadecyl) Phosphate ester, tetracosyl phosphate, bis(tetra
- the phosphate-based compound is preferably octadecyl phosphate or di(octadecyl) phosphate.
- These phosphate-based compounds may be used alone or in combination of two or more.
- the compound of the above-mentioned phosphoric acid ester can also be used as a metal salt with zinc, aluminum, or the like.
- the rate of deactivation using the phosphate-based compound is faster than when the phosphite-based compound is used, so it is preferable to use the phosphate-based compound.
- the transesterification reaction inhibitor is excessively added, the (A) polybutylene terephthalate resin may be decomposed. Therefore, the ester
- the content of the exchange reaction inhibitor is preferably 0.025 to 0.5 parts by mass.
- the antioxidant is preferably at least one of phenolic antioxidants or sulfur antioxidants. In order to obtain more excellent heat resistance and thermal stability, it is preferable to use a phenolic antioxidant and a sulfur antioxidant in combination.
- phenolic antioxidant examples include 2,4-dimethyl-6-tert-butylphenol, 2,6-di-tert-butylphenol, 2,6-di-tert-butyl-p-cresol, 2,6-di-tert-butyl-p-cresol, ,6-di-tert-butyl-4-ethylphenol, 4,4'-butylenebis(6-tert-butyl-3-methylphenol), 2,2'-methylenebis(4-methylphenol) -6-tert-butylphenol), 2,2'-methylene-bis(4-ethyl-6-tert-butylphenol), octadecyl-3-(3',5'-di-tert-butyl) yl-4'-hydroxyphenyl)propionate, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxybenzene)]propionate], 1,1,3
- sulfur-based antioxidants examples include dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, di(tridecyl) ) thiodipropionate, pentatetraalkyl (3-lauryl thiopropionate), or 2-mercaptobenzimidazole and the like.
- antioxidants may be used alone or in combination because a combination of two or more antioxidants may produce a synergistic effect.
- the content of the antioxidant is based on 100 parts by mass in total of (A) polybutylene terephthalate and (B) polyester resin containing cyclohexane dimethylene terephthalate units.
- the content of the antioxidant is preferably 0.01-3 parts by mass. Within this range, the antioxidative effect can be maintained, and gas generation during melt processing can be suppressed.
- the content is more preferably 0.05 part by mass or more, and still more preferably 0.1 part by mass or more.
- the upper limit is preferably 2 parts by mass or less, and more preferably 1 part by mass or less.
- the mold release agent is not particularly limited, and any mold release agent used for general thermoplastic resins can be used. Specifically, fatty acids, fatty acid metal salts, hydroxy fatty acids, fatty acid esters, partially saponified aliphatic esters, paraffins, low molecular weight polyolefins, fatty acid amides, alkylenebisfatty acid amides, aliphatic ketones, fatty acid lower Alcohol ester, fatty acid polyol ester, fatty acid polyglycol ester, or modified polysiloxane, etc.
- the fatty acid is preferably a fatty acid having 6 to 40 carbon atoms, and specific examples thereof include oleic acid, lauric acid, stearic acid, hydroxystearic acid, behenic acid, arachidonic acid, Oleic acid, linolenic acid, ricinoleic acid, palmitic acid, stearic acid, montanic acid, or mixtures thereof and the like.
- the fatty acid metal salt is preferably an alkali metal salt or an alkaline earth metal salt of a fatty acid having 6 to 40 carbon atoms, and specific examples thereof include calcium stearate, sodium montanate, calcium montanate, and the like.
- hydroxy fatty acid 1, 2- hydroxy fatty acid etc. are mentioned.
- fatty acid esters examples include stearic acid esters, oleic acid esters, linoleic acid esters, linolenic acid esters, adipic acid esters, behenic acid esters, arachidonic acid esters, and montanic acid. esters, isostearates, or esters of polymeric acids, etc.
- the paraffin is preferably a paraffin having 18 or more carbon atoms, and examples thereof include liquid paraffin, natural paraffin, microcrystalline wax, petrolatum, and the like.
- the low molecular weight polyolefin is preferably a low molecular weight polyolefin with a weight average molecular weight of less than 5000, specifically polyethylene wax, maleic acid modified polyethylene wax, oxidized polyethylene wax, and chlorinated polyethylene. wax, or polypropylene wax, etc.
- the fatty acid amide is preferably a fatty acid amide having 6 or more carbon atoms, and specific examples thereof include oleic acid amide, erucic acid amide, behenic acid amide, and the like.
- the alkylene bis-fatty acid amide is preferably an alkylene bis-fatty acid amide having 6 or more carbon atoms, specifically, methylene bis-stearamide, ethylene-bis-stearamide, or N,N -Bis(2-hydroxyethyl)stearamide, etc.
- the fatty acid lower alcohol ester is preferably a fatty acid lower alcohol ester having 6 or more carbon atoms, and specifically, ethyl stearate, butyl stearate, ethyl behenate, or rice Wax etc.
- fatty acid polyol ester examples include glycerol monostearate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol adipate stearate, dipentaerythritol adipate stearate ester, or sorbitan monobehenate, etc.
- the fatty acid polyglycol ester may, for example, be polyethylene glycol fatty acid ester or polypropylene glycol fatty acid ester.
- modified polysiloxane methyl styryl modified polysiloxane, polyether modified polysiloxane, higher fatty acid alkoxy modified polysiloxane, higher fatty acid containing polysiloxane, higher fatty acid ester-modified polysiloxane, methacrylic acid-modified polysiloxane, or fluorine-modified polysiloxane, etc.
- the above-mentioned flame retardant can also be exemplified as a chlorine-based flame retardant, including chlorinated paraffin, chlorinated polyethylene, perchlorocyclopentadecane, or tetrachlorophthalic anhydride, and the like.
- the polyester resin composition of the present invention using a differential scanning calorimeter in a nitrogen environment, the polyester resin composition is cooled down from a molten state to 20°C at a cooling rate of 20°C/min.
- the temperature of the endothermic peak (ie, defined herein as "melting point") during the temperature increase was performed at a temperature increase rate of 20°C/min and was 200°C or higher and 222°C or lower.
- the phase of (A) polybutylene terephthalate resin and (B) polyester resin containing cyclohexane dimethylene terephthalate unit can be improved It is soluble, and a polyester resin composition having high transmittance and excellent heat resistance can be obtained.
- the temperature range is more preferably 205°C or higher, further preferably 210°C or higher. On the other hand, it is more preferably 221°C or lower, and still more preferably 220°C or lower.
- the temperature of the endothermic peak with the largest endothermic peak area was defined as the melting point.
- the crystallinity of the (A) polybutylene terephthalate resin is preferably 20% or more and 45% or less. By making the crystallinity within this range, the composition can maintain a high transmittance while maintaining good mechanical strength. It is more preferably 25% or more, and further preferably 30% or more. The upper limit thereof is more preferably 42% or less, and further preferably 40% or less.
- the manufacturing method of the polyester resin composition of this invention can be performed by a known method, and is not specifically limited.
- a typical example is melt-kneading at a temperature of 100-350°C using a melt mixer such as a single-screw or twin-screw extruder, Banbury mixer or kneader, preferably in the temperature range of 200-300°C.
- the screw composition used in the twin-screw extruder may be a combination of a conveying block and a kneading block, but in order to obtain the composition of the present invention, uniform kneading with a screw is required. Therefore, the ratio of the length of the kneading block to the total length of the screw is preferably in the range of 5 to 50%, more preferably in the range of 10 to 40%.
- the resin composition of the present invention can be molded by known molding methods for thermoplastic resins such as injection molding, extrusion molding, blow molding, transfer molding, and vacuum molding to obtain a molded product.
- the laser transmittance at a laser wavelength of 980 nm is preferably 40% or more for a 1 mm-thick molded sheet molded at a molding temperature of 260° C. and a mold temperature of 80° C. with the polyester resin composition of the present invention. More preferably, it is 50% or more, and still more preferably 60% or more.
- the molded article As a molded article, it has the above-mentioned excellent laser transmittance and can be used as a transparent material for laser welding.
- the thickness of the molded product is not particularly limited, but from the viewpoint of improving the laser light transmittance, the thickness of the laser-transmitting portion of the molded product is preferably 3 mm or less.
- a molded product of the polyester resin composition of the present invention can be manufactured into products such as injection molded products, extruded products, blow molded products, films, sheets, and fibers, and can be specifically applied to, for example, automobile parts, electrical/ Electronic parts, building parts, various containers, daily necessities, household goods and medical and health products, etc., especially suitable for laser welding of automotive parts and electrical/electronic parts materials.
- A-1) Polybutylene terephthalate resin with intrinsic viscosity of 0.74 dl/g and terminal carboxyl group content of 10 to 20 meq/kg (manufactured by Toray Industries, Ltd.)
- A-2) Polybutylene terephthalate resin with intrinsic viscosity of 1.23 dl/g and terminal carboxyl group content of 20 to 30 meq/kg (manufactured by Toray Industries, Ltd.)
- Polyester resins containing cyclohexane dimethylene terephthalate units are those containing different 1,4 cyclohexane dimethanol/ethylene glycol Unit composition ratio of the copolymer.
- E-1 Chopped glass fiber (manufactured by Nippon Electric Glass Co., Ltd., trade name ECS03 T-187, average fiber diameter 13 ⁇ m, fiber length 3 mm)
- the transmittance at a wavelength of 980 nm was measured using TMG-3 manufactured by LPKF.
- the measurement area is the central portion (2) of the test piece, and the transmittance is the ratio of the amount of transmitted light to the amount of incident light expressed as a percentage.
- Tm is the temperature corresponding to the peak tip of the endothermic peak during the second heating process.
- ⁇ Hm is the endothermic peak area during the second heating process.
- ⁇ Hcc is the exothermic peak area during the second heating process.
- the extruder has 13 heating zones, two sets of feeding devices with measuring instruments and vacuum exhaust equipment. .
- Example 9 and Comparative Examples 5 and 6 From the comparison between Example 9 and Comparative Examples 5 and 6, it can be seen that when the sodium carboxylate of component (C) is added, the transmittance is significantly improved. From the comparison between Example 9 and Comparative Examples 7 and 8, it can be seen that in the case of using other amorphous resins (PC, AS) instead of PCTG, the extruded polymer was severely decomposed and the samples could not be collected.
- PC amorphous resins
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Abstract
Description
Claims (17)
- 一种聚酯树脂组合物,其特征在于,所述聚酯树脂组合物至少由以下(A)~(C)配合而得到:(A)聚对苯二甲酸丁二酯树脂100质量份、(B)含有对苯二甲酸环己烷二亚甲基酯单元的聚酯树脂5~100质量份、(C)脂肪族羧酸钠和/或芳香族羧酸钠0.05~5质量份,并且,在氮气环境下用差示扫描量热仪,将所述聚酯树脂组合物以20℃/min的降温速度,从熔融状态降温至20℃,然后再以20℃/min的升温速度进行升温,在升温过程中出现的吸热峰的温度为200℃以上且222℃以下。
- 根据权利要求1所述的聚酯树脂组合物,其中,聚酯树脂组合物中的(A)聚对苯二甲酸丁二酯树脂的结晶度为20%以上且45%以下。
- 根据权利要求1所述的聚酯树脂组合物,其中,(C)脂肪族羧酸钠和/或芳香族羧酸钠为选自具有1~50个碳原子的脂肪族羧酸的钠盐和苯甲酸钠中的至少一种。
- 根据权利要求1所述的聚酯树脂组合物,其中,(C)脂肪族羧酸钠和/或芳香族羧酸钠为选自丙酸钠、辛酸钠、硬脂酸钠和蒙坦酸钠中的至少一种。
- 根据权利要求1所述的聚酯树脂组合物,其中,相对于(A)聚对苯二甲酸丁二酯树脂100质量份,(C)脂肪族羧酸钠和/或芳香族羧酸钠的含量为0.2~3.0质量份。
- 根据权利要求1所述的聚酯树脂组合物,其中,进一步包含(D)具有能与羧基反应的官能团的化合物。
- 根据权利要求6所述的聚酯树脂组合物,其中,所述(D)具有能与羧基反应的官能团的化合物为选自碳二亚胺化合物、环氧化合物及噁唑啉化合物中的至少一种。
- 根据权利要求6所述的聚酯树脂组合物,其中,(D)具有能与羧基反应的官能团的化合物为选自脂肪族或芳香族的缩水甘油醚、脂肪族或芳香族 的缩水甘油酯中的至少一种。
- 根据权利要求6所述的聚酯树脂组合物,其中,相对于聚对苯二甲酸丁二酯树脂(A)100质量份,(D)具有能与羧基反应的官能团的化合物的含量为0.1~4质量份。
- 根据权利要求1所述的聚酯树脂组合物,其中,还包含(E)填料。
- 根据权利要求11所述的聚酯树脂组合物,其中,所述(E)填料为选自玻璃纤维和碳纤维中至少一种。
- 根据权利要求11所述的聚酯树脂组合物,其中,相对于聚对苯二甲酸丁二酯树脂(A)100质量份,所述填料(E)的含量为1~150质量份。
- 根据权利要求1所述的聚酯树脂组合物,其中,对于将所述聚酯树脂组合物在260℃的成型温度、80℃的模具温度下所成型的1mm厚的成型片而言,在980nm的激光波长下的激光透射率为40%以上。
- 一种成型品,其由权利要求1~14中任一项所述的聚酯树脂组合物成型得到。
- 根据权利要求15所述的成型品,其为用于激光焊接的透过材料。
- 根据权利要求16所述的成型品,其成型品激光透过部位的厚度为3mm以下。
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CN107163515A (zh) * | 2017-05-17 | 2017-09-15 | 江苏金发科技新材料有限公司 | 改善激光透明性的可焊接用聚酯复合材料 |
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