|
US5854671A
(en)
|
1993-05-28 |
1998-12-29 |
Nikon Corporation |
Scanning exposure method and apparatus therefor and a projection exposure apparatus and method which selectively chooses between static exposure and scanning exposure
|
|
US6271916B1
(en)
|
1994-03-24 |
2001-08-07 |
Kla-Tencor Corporation |
Process and assembly for non-destructive surface inspections
|
|
JP3398472B2
(ja)
*
|
1994-06-14 |
2003-04-21 |
株式会社日立製作所 |
検査方法および検査装置
|
|
US5864394A
(en)
|
1994-06-20 |
1999-01-26 |
Kla-Tencor Corporation |
Surface inspection system
|
|
US6608676B1
(en)
|
1997-08-01 |
2003-08-19 |
Kla-Tencor Corporation |
System for detecting anomalies and/or features of a surface
|
|
US6201601B1
(en)
|
1997-09-19 |
2001-03-13 |
Kla-Tencor Corporation |
Sample inspection system
|
|
JP4089798B2
(ja)
|
1998-04-13 |
2008-05-28 |
株式会社トプコン |
表面検査装置
|
|
US6169601B1
(en)
|
1998-06-23 |
2001-01-02 |
Ade Optical Systems |
Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light
|
|
US6208411B1
(en)
|
1998-09-28 |
2001-03-27 |
Kla-Tencor Corporation |
Massively parallel inspection and imaging system
|
|
TW444247B
(en)
|
1999-01-29 |
2001-07-01 |
Toshiba Corp |
Laser beam irradiating device, manufacture of non-single crystal semiconductor film, and manufacture of liquid crystal display device
|
|
US6529270B1
(en)
|
1999-03-31 |
2003-03-04 |
Ade Optical Systems Corporation |
Apparatus and method for detecting defects in the surface of a workpiece
|
|
US6486946B1
(en)
|
1999-06-15 |
2002-11-26 |
Ade Corporation |
Method for discriminating between holes in and particles on a film covering a substrate
|
|
US6466315B1
(en)
|
1999-09-03 |
2002-10-15 |
Applied Materials, Inc. |
Method and system for reticle inspection by photolithography simulation
|
|
US6891627B1
(en)
|
2000-09-20 |
2005-05-10 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a critical dimension and overlay of a specimen
|
|
US6515742B1
(en)
|
2000-11-28 |
2003-02-04 |
Memc Electronic Materials, Inc. |
Defect classification using scattered light intensities
|
|
US7046353B2
(en)
|
2001-12-04 |
2006-05-16 |
Kabushiki Kaisha Topcon |
Surface inspection system
|
|
JP3833556B2
(ja)
*
|
2002-03-14 |
2006-10-11 |
三菱電機株式会社 |
光振幅位相時間応答測定装置
|
|
US7130039B2
(en)
|
2002-04-18 |
2006-10-31 |
Kla-Tencor Technologies Corporation |
Simultaneous multi-spot inspection and imaging
|
|
US7286697B2
(en)
|
2002-10-18 |
2007-10-23 |
Applied Materials, Israel, Ltd. |
System for imaging an extended area
|
|
JP4641143B2
(ja)
|
2003-06-30 |
2011-03-02 |
株式会社トプコン |
表面検査装置
|
|
JP4567984B2
(ja)
|
2004-01-30 |
2010-10-27 |
株式会社 日立ディスプレイズ |
平面表示装置の製造装置
|
|
US7295303B1
(en)
|
2004-03-25 |
2007-11-13 |
Kla-Tencor Technologies Corporation |
Methods and apparatus for inspecting a sample
|
|
JP5033314B2
(ja)
|
2004-09-29 |
2012-09-26 |
株式会社日立ハイテクノロジーズ |
イオンビーム加工装置及び加工方法
|
|
JP4694179B2
(ja)
|
2004-11-18 |
2011-06-08 |
株式会社トプコン |
表面検査装置
|
|
JP2006162500A
(ja)
|
2004-12-09 |
2006-06-22 |
Hitachi High-Technologies Corp |
欠陥検査装置
|
|
JP2008529199A
(ja)
|
2005-02-03 |
2008-07-31 |
コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ |
マルチビーム光走査装置のためのスポットサイズ焦点誤差検出
|
|
US7548308B2
(en)
|
2005-05-11 |
2009-06-16 |
Kla-Tencor Corporation |
Illumination energy management in surface inspection
|
|
US7436508B2
(en)
|
2005-07-14 |
2008-10-14 |
Kla-Tencor Technologies Corp. |
Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system
|
|
WO2008011903A1
(en)
|
2006-07-28 |
2008-01-31 |
Avago Technologies Wireless Ip (Singapore) Pte. Ltd. |
Apparatus and method for processing a wafer
|
|
JP5182090B2
(ja)
*
|
2006-08-02 |
2013-04-10 |
株式会社ニコン |
欠陥検出装置及び欠陥検出方法
|
|
US7643157B2
(en)
*
|
2007-01-04 |
2010-01-05 |
Lasertec Corporation |
Phase shift amount measurement apparatus and transmittance measurement apparatus
|
|
US7787114B2
(en)
|
2007-06-06 |
2010-08-31 |
Kla-Tencor Technologies Corp. |
Systems and methods for inspecting a specimen with light at varying power levels
|
|
US8194240B1
(en)
|
2008-03-04 |
2012-06-05 |
Kla-Tencor Corporation |
Enhanced focusing capability on a sample using a spot matrix
|
|
US8194301B2
(en)
|
2008-03-04 |
2012-06-05 |
Kla-Tencor Corporation |
Multi-spot scanning system and method
|
|
US7912658B2
(en)
|
2008-05-28 |
2011-03-22 |
Kla-Tencor Corp. |
Systems and methods for determining two or more characteristics of a wafer
|
|
WO2009149103A1
(en)
*
|
2008-06-03 |
2009-12-10 |
Jeong Hwan J |
Interferometric defect detection and classification
|
|
US7986412B2
(en)
*
|
2008-06-03 |
2011-07-26 |
Jzw Llc |
Interferometric defect detection and classification
|
|
JP4618360B2
(ja)
|
2008-10-10 |
2011-01-26 |
ソニー株式会社 |
レーザアニール方法およびレーザアニール装置
|
|
DE102009000528B4
(de)
|
2009-01-30 |
2011-04-07 |
Nanophotonics Ag |
Inspektionsvorrichtung und -verfahren für die optische Untersuchung von Objektoberflächen, insbesondere von Waferoberflächen
|
|
JP5283037B2
(ja)
|
2009-04-25 |
2013-09-04 |
独立行政法人産業技術総合研究所 |
高均一照度が得られる照明装置及び照明方法
|
|
JP5544176B2
(ja)
|
2010-01-07 |
2014-07-09 |
株式会社日立ハイテクノロジーズ |
検査装置および検査方法
|
|
US8885158B2
(en)
|
2011-03-10 |
2014-11-11 |
Kla-Tencor Corporation |
Surface scanning inspection system with adjustable scan pitch
|
|
NL2009001A
(en)
*
|
2011-07-08 |
2013-01-09 |
Asml Netherlands Bv |
Methods and patterning devices for measuring phase aberration.
|
|
US9279774B2
(en)
|
2011-07-12 |
2016-03-08 |
Kla-Tencor Corp. |
Wafer inspection
|
|
US8755044B2
(en)
|
2011-08-15 |
2014-06-17 |
Kla-Tencor Corporation |
Large particle detection for multi-spot surface scanning inspection systems
|
|
KR101272603B1
(ko)
|
2011-10-31 |
2013-06-07 |
부산대학교 산학협력단 |
다접점 온도 조절 시스템
|
|
US9255891B2
(en)
|
2012-11-20 |
2016-02-09 |
Kla-Tencor Corporation |
Inspection beam shaping for improved detection sensitivity
|
|
US9390887B2
(en)
|
2013-09-17 |
2016-07-12 |
Kla-Tencor Corporation |
Non-invasive charged particle beam monitor
|
|
JP5725681B1
(ja)
*
|
2014-01-22 |
2015-05-27 |
レーザーテック株式会社 |
干渉計及び位相シフト量測定装置
|
|
US9506873B2
(en)
*
|
2014-04-15 |
2016-11-29 |
Kla-Tencor Corp. |
Pattern suppression in logic for wafer inspection
|
|
WO2016005167A1
(en)
|
2014-07-09 |
2016-01-14 |
Asml Netherlands B.V. |
Inspection apparatus, inspection method and device manufacturing method
|
|
KR20160047360A
(ko)
*
|
2014-10-22 |
2016-05-02 |
동우 화인켐 주식회사 |
결함 검출 시스템 및 방법
|
|
US9739719B2
(en)
|
2014-10-31 |
2017-08-22 |
Kla-Tencor Corporation |
Measurement systems having linked field and pupil signal detection
|
|
CN112859540B
(zh)
|
2015-05-19 |
2024-10-18 |
科磊股份有限公司 |
成像计量目标及方法
|
|
CN107850555B
(zh)
*
|
2015-06-30 |
2023-06-13 |
康宁股份有限公司 |
使用静态条纹图案的干涉法滚降测量
|
|
US9915625B2
(en)
*
|
2016-01-04 |
2018-03-13 |
Kla-Tencor Corp. |
Optical die to database inspection
|
|
US9574992B1
(en)
|
2016-01-22 |
2017-02-21 |
Kla-Tencor Corporation |
Single wavelength ellipsometry with improved spot size capability
|
|
US9874526B2
(en)
|
2016-03-28 |
2018-01-23 |
Kla-Tencor Corporation |
Methods and apparatus for polarized wafer inspection
|
|
JP6738254B2
(ja)
|
2016-09-26 |
2020-08-12 |
株式会社日立ハイテク |
欠陥検出装置及び欠陥観察装置
|
|
US10317198B2
(en)
|
2016-09-30 |
2019-06-11 |
Kla-Tencor Corporation |
Three-dimensional mapping of a wafer
|
|
US10481111B2
(en)
*
|
2016-10-21 |
2019-11-19 |
Kla-Tencor Corporation |
Calibration of a small angle X-ray scatterometry based metrology system
|
|
US10234402B2
(en)
|
2017-01-05 |
2019-03-19 |
Kla-Tencor Corporation |
Systems and methods for defect material classification
|
|
US11333621B2
(en)
*
|
2017-07-11 |
2022-05-17 |
Kla-Tencor Corporation |
Methods and systems for semiconductor metrology based on polychromatic soft X-Ray diffraction
|
|
US10215714B1
(en)
|
2017-08-16 |
2019-02-26 |
Siemens Energy, Inc. |
Method and system for detecting defects on surface of object
|