JP2022166301A - 積層電子部品 - Google Patents
積層電子部品 Download PDFInfo
- Publication number
- JP2022166301A JP2022166301A JP2022133821A JP2022133821A JP2022166301A JP 2022166301 A JP2022166301 A JP 2022166301A JP 2022133821 A JP2022133821 A JP 2022133821A JP 2022133821 A JP2022133821 A JP 2022133821A JP 2022166301 A JP2022166301 A JP 2022166301A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- external electrodes
- multilayer electronic
- sintered body
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 238000007747 plating Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002003 electrode paste Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/285—Precursor compositions therefor, e.g. pastes, inks, glass frits applied to zinc or cadmium oxide resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
Abstract
Description
化することができる。
、17Bに沿って焼結体11の側面11A、11Bから実装面11Cを超えて実装物2001に向かって濡れ広げることができる。このように構成することにより、リード端子17A、17B側からの応力を分散することができ、積層電子部品1000の信頼性をさらに向上させることができる。
12A,12B 内部電極
13A,13B 外部電極(第1の外部電極)
14A,14B 外部電極(第2の外部電極)
15 絶縁層
16A,16B めっき層
17A,17B リード端子
18A,18B 接合層
Claims (3)
- その内部に内部電極を有する焼結体と、
前記焼結体の側面に設けられ、前記内部電極に接続された外部電極と、
を含む個体部品と、
前記外部電極に、接合層を介して接続されたリード端子と、
を備えた積層電子部品であって、
前記個体部品は、前記積層電子部品が実装物に実装されている状態で前記実装物に対向する実装面を有し、
前記接合層は、前記外部電極から前記リード端子に沿って前記実装面を超えて広がっている、積層電子部品。 - 前記接合層は、はんだを含む、請求項1に記載の積層電子部品。
- 前記リード端子は、L字状に屈曲されている、請求項1または2に記載の積層電子部品。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017197380 | 2017-10-11 | ||
JP2017197380 | 2017-10-11 | ||
PCT/JP2018/034534 WO2019073762A1 (ja) | 2017-10-11 | 2018-09-19 | 積層電子部品の製造方法 |
JP2019547963A JP7361250B2 (ja) | 2017-10-11 | 2018-09-19 | 積層電子部品の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019547963A Division JP7361250B2 (ja) | 2017-10-11 | 2018-09-19 | 積層電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022166301A true JP2022166301A (ja) | 2022-11-01 |
JP7394292B2 JP7394292B2 (ja) | 2023-12-08 |
Family
ID=66100032
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019547963A Active JP7361250B2 (ja) | 2017-10-11 | 2018-09-19 | 積層電子部品の製造方法 |
JP2022133821A Active JP7394292B2 (ja) | 2017-10-11 | 2022-08-25 | 積層電子部品 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019547963A Active JP7361250B2 (ja) | 2017-10-11 | 2018-09-19 | 積層電子部品の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US11387023B2 (ja) |
JP (2) | JP7361250B2 (ja) |
CN (1) | CN110945605B (ja) |
WO (1) | WO2019073762A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58111915U (ja) * | 1982-01-25 | 1983-07-30 | 日本電気株式会社 | 積層セラミツクコンデンサ |
JPS6284921U (ja) * | 1985-11-15 | 1987-05-30 | ||
JP2000306764A (ja) * | 1999-04-23 | 2000-11-02 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2003068563A (ja) * | 2001-08-22 | 2003-03-07 | Tdk Corp | ラジアルリード型積層セラミック電子部品 |
JP2008294180A (ja) * | 2007-05-24 | 2008-12-04 | Murata Mfg Co Ltd | リード線付き電子部品、及び該リード線付き電子部品の製造方法 |
JP2010161172A (ja) * | 2009-01-07 | 2010-07-22 | Tdk Corp | 積層コンデンサ及び積層コンデンサの実装構造 |
JP2016189382A (ja) * | 2015-03-30 | 2016-11-04 | 日本ケミコン株式会社 | コンデンサおよびその製造方法 |
JP2019012749A (ja) * | 2017-06-29 | 2019-01-24 | 太陽誘電株式会社 | セラミック電子部品及びその製造方法、並びに電子部品実装基板 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6160472A (en) * | 1995-03-24 | 2000-12-12 | Tdk Corporation | Multilayer varistor |
JP3640273B2 (ja) * | 1995-03-24 | 2005-04-20 | Tdk株式会社 | 積層型バリスタ |
JP2000164406A (ja) * | 1998-11-25 | 2000-06-16 | Murata Mfg Co Ltd | チップ型電子部品とその製造方法 |
JP2000223359A (ja) | 1999-01-29 | 2000-08-11 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2000235932A (ja) * | 1999-02-16 | 2000-08-29 | Murata Mfg Co Ltd | セラミック電子部品 |
US20080239621A1 (en) * | 2007-03-29 | 2008-10-02 | Azizuddin Tajuddin | Clip-on leadframe |
JP5664574B2 (ja) | 2011-03-18 | 2015-02-04 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP5375877B2 (ja) * | 2011-05-25 | 2013-12-25 | Tdk株式会社 | 積層コンデンサ及び積層コンデンサの製造方法 |
CN203085375U (zh) * | 2012-12-24 | 2013-07-24 | 日科能高电子(苏州)有限公司 | 铝电解电容器引脚切断机 |
JP2015012052A (ja) | 2013-06-27 | 2015-01-19 | 株式会社村田製作所 | セラミックサーミスタ |
JP6295803B2 (ja) | 2014-04-24 | 2018-03-20 | 株式会社Lib総合開発 | オキシフッ化リン酸リチウムの製造方法 |
CN205752078U (zh) * | 2016-05-10 | 2016-11-30 | 南京萨特科技发展有限公司 | 引脚结构大电流微型熔断器 |
CN106024231B (zh) * | 2016-05-27 | 2018-07-10 | 辰硕电子(九江)有限公司 | 一种氧化锌压敏电阻器瓷片的制备方法 |
-
2018
- 2018-09-19 JP JP2019547963A patent/JP7361250B2/ja active Active
- 2018-09-19 WO PCT/JP2018/034534 patent/WO2019073762A1/ja active Application Filing
- 2018-09-19 US US16/622,572 patent/US11387023B2/en active Active
- 2018-09-19 CN CN201880048740.9A patent/CN110945605B/zh active Active
-
2022
- 2022-06-13 US US17/838,961 patent/US20220310291A1/en not_active Abandoned
- 2022-08-25 JP JP2022133821A patent/JP7394292B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58111915U (ja) * | 1982-01-25 | 1983-07-30 | 日本電気株式会社 | 積層セラミツクコンデンサ |
JPS6284921U (ja) * | 1985-11-15 | 1987-05-30 | ||
JP2000306764A (ja) * | 1999-04-23 | 2000-11-02 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2003068563A (ja) * | 2001-08-22 | 2003-03-07 | Tdk Corp | ラジアルリード型積層セラミック電子部品 |
JP2008294180A (ja) * | 2007-05-24 | 2008-12-04 | Murata Mfg Co Ltd | リード線付き電子部品、及び該リード線付き電子部品の製造方法 |
JP2010161172A (ja) * | 2009-01-07 | 2010-07-22 | Tdk Corp | 積層コンデンサ及び積層コンデンサの実装構造 |
JP2016189382A (ja) * | 2015-03-30 | 2016-11-04 | 日本ケミコン株式会社 | コンデンサおよびその製造方法 |
JP2019012749A (ja) * | 2017-06-29 | 2019-01-24 | 太陽誘電株式会社 | セラミック電子部品及びその製造方法、並びに電子部品実装基板 |
Also Published As
Publication number | Publication date |
---|---|
US20200194151A1 (en) | 2020-06-18 |
JP7394292B2 (ja) | 2023-12-08 |
US11387023B2 (en) | 2022-07-12 |
JPWO2019073762A1 (ja) | 2020-09-17 |
WO2019073762A1 (ja) | 2019-04-18 |
JP7361250B2 (ja) | 2023-10-16 |
CN110945605A (zh) | 2020-03-31 |
US20220310291A1 (en) | 2022-09-29 |
CN110945605B (zh) | 2023-01-03 |
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