JP2022050408A5 - - Google Patents
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- Publication number
- JP2022050408A5 JP2022050408A5 JP2021200897A JP2021200897A JP2022050408A5 JP 2022050408 A5 JP2022050408 A5 JP 2022050408A5 JP 2021200897 A JP2021200897 A JP 2021200897A JP 2021200897 A JP2021200897 A JP 2021200897A JP 2022050408 A5 JP2022050408 A5 JP 2022050408A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate support
- support pedestal
- lower plate
- plate portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 12
- 238000007789 sealing Methods 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 claims 2
- 239000010980 sapphire Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 210000000239 visual pathway Anatomy 0.000 claims 1
- 230000004400 visual pathway Effects 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562249559P | 2015-11-02 | 2015-11-02 | |
| US62/249,559 | 2015-11-02 | ||
| JP2018543028A JP7240174B2 (ja) | 2015-11-02 | 2016-11-02 | 高温半導体処理におけるクランピングのための静電チャック及びそれを製造する方法 |
| PCT/US2016/060169 WO2017079338A1 (en) | 2015-11-02 | 2016-11-02 | Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018543028A Division JP7240174B2 (ja) | 2015-11-02 | 2016-11-02 | 高温半導体処理におけるクランピングのための静電チャック及びそれを製造する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022050408A JP2022050408A (ja) | 2022-03-30 |
| JP2022050408A5 true JP2022050408A5 (enExample) | 2022-11-14 |
| JP7504857B2 JP7504857B2 (ja) | 2024-06-24 |
Family
ID=58662749
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018543028A Active JP7240174B2 (ja) | 2015-11-02 | 2016-11-02 | 高温半導体処理におけるクランピングのための静電チャック及びそれを製造する方法 |
| JP2021200897A Active JP7504857B2 (ja) | 2015-11-02 | 2021-12-10 | 高温半導体処理におけるクランピングのための静電チャック及びそれを製造する方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018543028A Active JP7240174B2 (ja) | 2015-11-02 | 2016-11-02 | 高温半導体処理におけるクランピングのための静電チャック及びそれを製造する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10593584B2 (enExample) |
| EP (1) | EP3371881B1 (enExample) |
| JP (2) | JP7240174B2 (enExample) |
| KR (1) | KR20180075667A (enExample) |
| CN (1) | CN108476006B (enExample) |
| WO (1) | WO2017079338A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108476006B (zh) | 2015-11-02 | 2022-04-15 | 沃特洛电气制造公司 | 用于高温半导体加工中夹持的静电卡盘及其制造方法 |
| EP3602603A4 (en) * | 2017-03-21 | 2020-12-30 | Component Re-Engineering Company Inc. | CERAMIC MATERIAL KIT FOR USE IN HIGHLY CORROSIVE OR EROSIVE SEMICONDUCTOR TREATMENT APPLICATIONS |
| KR102411272B1 (ko) * | 2018-03-26 | 2022-06-22 | 엔지케이 인슐레이터 엘티디 | 정전척 히터 |
| US10882130B2 (en) | 2018-04-17 | 2021-01-05 | Watlow Electric Manufacturing Company | Ceramic-aluminum assembly with bonding trenches |
| JP7378210B2 (ja) * | 2019-01-17 | 2023-11-13 | 新光電気工業株式会社 | セラミック部材の製造方法 |
| JP7341043B2 (ja) * | 2019-12-06 | 2023-09-08 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| US11302557B2 (en) * | 2020-05-01 | 2022-04-12 | Applied Materials, Inc. | Electrostatic clamping system and method |
| CN113399858A (zh) * | 2021-04-25 | 2021-09-17 | 郑州机械研究所有限公司 | 一种钎焊用复合钎料及其制备方法和硬质合金刀具 |
| US20230230816A1 (en) * | 2022-01-19 | 2023-07-20 | Changxin Memory Technologies, Inc. | Semiconductor device, semiconductor equipment, and semiconductor process method |
| CN119501223B (zh) * | 2024-10-22 | 2025-09-23 | 君原电子科技(海宁)有限公司 | 一种用于静电卡盘的真空钎焊方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5600530A (en) * | 1992-08-04 | 1997-02-04 | The Morgan Crucible Company Plc | Electrostatic chuck |
| US5368220A (en) | 1992-08-04 | 1994-11-29 | Morgan Crucible Company Plc | Sealed conductive active alloy feedthroughs |
| US5413360A (en) * | 1992-12-01 | 1995-05-09 | Kyocera Corporation | Electrostatic chuck |
| JPH06291175A (ja) * | 1993-04-01 | 1994-10-18 | Kyocera Corp | 静電チャック |
| US5535090A (en) | 1994-03-03 | 1996-07-09 | Sherman; Arthur | Electrostatic chuck |
| JPH0870036A (ja) * | 1994-08-29 | 1996-03-12 | Souzou Kagaku:Kk | 静電チャック |
| JPH08227933A (ja) * | 1995-02-20 | 1996-09-03 | Shin Etsu Chem Co Ltd | 静電吸着機能を有するウエハ加熱装置 |
| US5671116A (en) * | 1995-03-10 | 1997-09-23 | Lam Research Corporation | Multilayered electrostatic chuck and method of manufacture thereof |
| JPH08279550A (ja) * | 1995-04-07 | 1996-10-22 | Souzou Kagaku:Kk | 静電チャック |
| JPH09172057A (ja) * | 1995-12-20 | 1997-06-30 | Souzou Kagaku:Kk | 静電チャック |
| JP3253002B2 (ja) | 1995-12-27 | 2002-02-04 | 東京エレクトロン株式会社 | 処理装置 |
| US6088213A (en) * | 1997-07-11 | 2000-07-11 | Applied Materials, Inc. | Bipolar electrostatic chuck and method of making same |
| JP4013386B2 (ja) * | 1998-03-02 | 2007-11-28 | 住友電気工業株式会社 | 半導体製造用保持体およびその製造方法 |
| EP1304717A4 (en) | 2000-07-27 | 2009-12-09 | Ebara Corp | FLOOR BEAM ANALYSIS APPARATUS |
| JP4493264B2 (ja) | 2001-11-26 | 2010-06-30 | 日本碍子株式会社 | 窒化アルミニウム質セラミックス、半導体製造用部材および耐蝕性部材 |
| JP2003264223A (ja) | 2002-03-08 | 2003-09-19 | Rasa Ind Ltd | 静電チャック部品および静電チャック装置およびその製造方法 |
| MY137585A (en) | 2003-03-19 | 2009-02-27 | Systems On Silicon Mfg Company Pte Ltd | A method of repairing a pedestal surface |
| JP2004349664A (ja) | 2003-05-23 | 2004-12-09 | Creative Technology:Kk | 静電チャック |
| US7595972B2 (en) * | 2004-04-09 | 2009-09-29 | Varian Semiconductor Equipment Associates, Inc. | Clamp for use in processing semiconductor workpieces |
| CN2922118Y (zh) * | 2006-04-24 | 2007-07-11 | 北京中科信电子装备有限公司 | 一种用于晶片夹持的静电卡盘 |
| JP5019811B2 (ja) | 2006-07-20 | 2012-09-05 | 東京エレクトロン株式会社 | 静電吸着電極の補修方法 |
| JP5087561B2 (ja) | 2007-02-15 | 2012-12-05 | 株式会社クリエイティブ テクノロジー | 静電チャック |
| JP2011222931A (ja) * | 2009-12-28 | 2011-11-04 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| US20130107415A1 (en) * | 2011-10-28 | 2013-05-02 | Applied Materials, Inc. | Electrostatic chuck |
| US9624137B2 (en) | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
| US8932690B2 (en) * | 2011-11-30 | 2015-01-13 | Component Re-Engineering Company, Inc. | Plate and shaft device |
| US8684256B2 (en) * | 2011-11-30 | 2014-04-01 | Component Re-Engineering Company, Inc. | Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing |
| KR102304432B1 (ko) | 2012-09-19 | 2021-09-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판들을 접합하기 위한 방법들 |
| EP2960933B1 (en) * | 2013-02-25 | 2017-12-06 | Kyocera Corporation | Sample holding tool |
| CN108476006B (zh) | 2015-11-02 | 2022-04-15 | 沃特洛电气制造公司 | 用于高温半导体加工中夹持的静电卡盘及其制造方法 |
| TWI595220B (zh) * | 2016-02-05 | 2017-08-11 | 群創光電股份有限公司 | 壓力感測裝置及其製造方法 |
-
2016
- 2016-11-02 CN CN201680074692.1A patent/CN108476006B/zh active Active
- 2016-11-02 US US15/341,843 patent/US10593584B2/en active Active
- 2016-11-02 WO PCT/US2016/060169 patent/WO2017079338A1/en not_active Ceased
- 2016-11-02 EP EP16862905.3A patent/EP3371881B1/en active Active
- 2016-11-02 KR KR1020187015747A patent/KR20180075667A/ko not_active Ceased
- 2016-11-02 JP JP2018543028A patent/JP7240174B2/ja active Active
-
2020
- 2020-03-13 US US16/817,627 patent/US11222804B2/en active Active
-
2021
- 2021-12-10 JP JP2021200897A patent/JP7504857B2/ja active Active
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