JP2021525454A5 - - Google Patents

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Publication number
JP2021525454A5
JP2021525454A5 JP2020565321A JP2020565321A JP2021525454A5 JP 2021525454 A5 JP2021525454 A5 JP 2021525454A5 JP 2020565321 A JP2020565321 A JP 2020565321A JP 2020565321 A JP2020565321 A JP 2020565321A JP 2021525454 A5 JP2021525454 A5 JP 2021525454A5
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JP
Japan
Prior art keywords
substrate support
chuck body
heater
support assembly
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020565321A
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English (en)
Japanese (ja)
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JP2021525454A (ja
JP7662339B2 (ja
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Priority claimed from PCT/US2019/030741 external-priority patent/WO2019231614A1/en
Publication of JP2021525454A publication Critical patent/JP2021525454A/ja
Priority to JP2021179166A priority Critical patent/JP7662489B2/ja
Publication of JP2021525454A5 publication Critical patent/JP2021525454A5/ja
Priority to JP2025001181A priority patent/JP2025072361A/ja
Application granted granted Critical
Publication of JP7662339B2 publication Critical patent/JP7662339B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020565321A 2018-05-31 2019-05-03 極めて均一性が高い加熱基板支持アセンブリ Active JP7662339B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021179166A JP7662489B2 (ja) 2018-05-31 2021-11-02 極めて均一性が高い加熱基板支持アセンブリ
JP2025001181A JP2025072361A (ja) 2018-05-31 2025-01-06 極めて均一性が高い加熱基板支持アセンブリ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862678540P 2018-05-31 2018-05-31
US62/678,540 2018-05-31
PCT/US2019/030741 WO2019231614A1 (en) 2018-05-31 2019-05-03 Extreme uniformity heated substrate support assembly

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021179166A Division JP7662489B2 (ja) 2018-05-31 2021-11-02 極めて均一性が高い加熱基板支持アセンブリ

Publications (3)

Publication Number Publication Date
JP2021525454A JP2021525454A (ja) 2021-09-24
JP2021525454A5 true JP2021525454A5 (enExample) 2021-12-16
JP7662339B2 JP7662339B2 (ja) 2025-04-15

Family

ID=68693589

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020565321A Active JP7662339B2 (ja) 2018-05-31 2019-05-03 極めて均一性が高い加熱基板支持アセンブリ
JP2021179166A Active JP7662489B2 (ja) 2018-05-31 2021-11-02 極めて均一性が高い加熱基板支持アセンブリ
JP2025001181A Withdrawn JP2025072361A (ja) 2018-05-31 2025-01-06 極めて均一性が高い加熱基板支持アセンブリ

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021179166A Active JP7662489B2 (ja) 2018-05-31 2021-11-02 極めて均一性が高い加熱基板支持アセンブリ
JP2025001181A Withdrawn JP2025072361A (ja) 2018-05-31 2025-01-06 極めて均一性が高い加熱基板支持アセンブリ

Country Status (6)

Country Link
US (1) US12488967B2 (enExample)
JP (3) JP7662339B2 (enExample)
KR (3) KR102471635B1 (enExample)
CN (1) CN112088427A (enExample)
TW (1) TWI702685B (enExample)
WO (1) WO2019231614A1 (enExample)

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