JP2021535588A5 - - Google Patents

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Publication number
JP2021535588A5
JP2021535588A5 JP2021506560A JP2021506560A JP2021535588A5 JP 2021535588 A5 JP2021535588 A5 JP 2021535588A5 JP 2021506560 A JP2021506560 A JP 2021506560A JP 2021506560 A JP2021506560 A JP 2021506560A JP 2021535588 A5 JP2021535588 A5 JP 2021535588A5
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JP
Japan
Prior art keywords
semiconductor material
bonding
layer
contact
base wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021506560A
Other languages
English (en)
Japanese (ja)
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JP2021535588A (ja
JP7332680B2 (ja
Filing date
Publication date
Priority claimed from US16/436,794 external-priority patent/US11056611B2/en
Application filed filed Critical
Publication of JP2021535588A publication Critical patent/JP2021535588A/ja
Publication of JP2021535588A5 publication Critical patent/JP2021535588A5/ja
Application granted granted Critical
Publication of JP7332680B2 publication Critical patent/JP7332680B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021506560A 2018-09-11 2019-08-14 ウエハーツーウエハーボンディングのためのメサ形成 Active JP7332680B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862729820P 2018-09-11 2018-09-11
US62/729,820 2018-09-11
US16/436,794 US11056611B2 (en) 2018-09-11 2019-06-10 Mesa formation for wafer-to-wafer bonding
US16/436,794 2019-06-10
PCT/US2019/046536 WO2020055537A1 (en) 2018-09-11 2019-08-14 Mesa formation for wafer -to-wafer bonding

Publications (3)

Publication Number Publication Date
JP2021535588A JP2021535588A (ja) 2021-12-16
JP2021535588A5 true JP2021535588A5 (https=) 2023-06-07
JP7332680B2 JP7332680B2 (ja) 2023-08-23

Family

ID=69720064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021506560A Active JP7332680B2 (ja) 2018-09-11 2019-08-14 ウエハーツーウエハーボンディングのためのメサ形成

Country Status (6)

Country Link
US (2) US11056611B2 (https=)
EP (1) EP3850667B1 (https=)
JP (1) JP7332680B2 (https=)
KR (1) KR20210046065A (https=)
CN (1) CN112740412A (https=)
WO (1) WO2020055537A1 (https=)

Families Citing this family (6)

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US11145786B2 (en) 2018-09-11 2021-10-12 Facebook Technologies, Llc Methods for wafer-to-wafer bonding
US11056611B2 (en) 2018-09-11 2021-07-06 Facebook Technologies, Llc Mesa formation for wafer-to-wafer bonding
US12142717B2 (en) 2020-04-09 2024-11-12 Raysolve Optoelectronics (Suzhou) Company Limited Light emitting diode structure and method for manufacturing the same
CN112864290B (zh) * 2020-04-09 2022-04-22 镭昱光电科技(苏州)有限公司 微型led显示器及其制造方法
TW202512546A (zh) 2020-12-28 2025-03-16 大陸商上海顯耀顯示科技有限公司 微發光二極體結構及包括該結構之微發光二極體晶片

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