JP5056799B2 - Iii族窒化物半導体発光素子およびその製造方法 - Google Patents
Iii族窒化物半導体発光素子およびその製造方法 Download PDFInfo
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- JP5056799B2 JP5056799B2 JP2009150341A JP2009150341A JP5056799B2 JP 5056799 B2 JP5056799 B2 JP 5056799B2 JP 2009150341 A JP2009150341 A JP 2009150341A JP 2009150341 A JP2009150341 A JP 2009150341A JP 5056799 B2 JP5056799 B2 JP 5056799B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Description
102:低融点金属層
103:p電極
104:p型層
105:活性層
106:n型層
107:n電極
108:溝
109:エッチングストッパ層
110:絶縁膜
111:配線状部
112:パッド部
113:微細な凹凸
114:サファイア基板
Claims (5)
- 導電性の支持体と、前記支持体上に位置するp電極と、前記p電極上に順に位置する、III 族窒化物半導体からなるp型層、活性層、n型層と、前記n型層上に位置するn電極と、を有するIII 族窒化物半導体発光素子において、
前記n型層の前記n電極形成側に、複数のドット状の溝がマトリクス状に配置されたパターンに形成された溝と、
前記溝の側面および底面に形成された透光性の絶縁膜と、
を備え、
前記溝は、前記p型層を貫通する深さであり、
前記溝の底面に、金属または誘電体からなるエッチングストッパ層が形成されていて、
前記n電極は配線状に形成されている、
ことを特徴とするIII 族窒化物半導体発光素子。 - 前記エッチングストッパ層は、SiO 2 からなることを特徴とする請求項1に記載のIII 族窒化物半導体発光素子。
- 成長基板上にIII 族窒化物半導体からなるn型層、活性層、p型層を順に積層し、前記p型層上にp電極を形成し、p型層のp電極側表面であって、のちに溝を形成する位置と対向する位置に、金属または誘電体からなるエッチングストッパ層を形成する第1工程と、
前記p電極上に、導電性の支持体を形成する第2工程と、
基板リフトオフにより前記成長基板を分離し除去する第3工程と、
前記成長基板の除去により露出した前記n型層表面に、複数のドット状の溝がマトリクス状に配置されたパターンの溝であって、前記p型層を貫通する深さの溝を形成する第4工程と、
前記溝の側面に透光性の絶縁膜を形成し、前記n型層表面に配線状のn電極を形成する第5工程と、
を有することを特徴とするIII 族窒化物半導体発光素子の製造方法。 - 前記エッチングストッパ層は、SiO 2 からなることを特徴とする請求項3に記載のIII 族窒化物半導体発光素子の製造方法。
- 前記第4工程は、前記溝の形成と同時に、素子間を分離させるメサ溝を形成する工程である、ことを特徴とする請求項3または請求項4に記載のIII 族窒化物半導体発光素子の製造方法。
Priority Applications (2)
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---|---|---|---|
JP2009150341A JP5056799B2 (ja) | 2009-06-24 | 2009-06-24 | Iii族窒化物半導体発光素子およびその製造方法 |
US12/801,456 US8853720B2 (en) | 2009-06-24 | 2010-06-09 | Group III nitride semiconductor light-emitting device and method for producing the same |
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JP2009150341A JP5056799B2 (ja) | 2009-06-24 | 2009-06-24 | Iii族窒化物半導体発光素子およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2011009386A JP2011009386A (ja) | 2011-01-13 |
JP5056799B2 true JP5056799B2 (ja) | 2012-10-24 |
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JP2009150341A Active JP5056799B2 (ja) | 2009-06-24 | 2009-06-24 | Iii族窒化物半導体発光素子およびその製造方法 |
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US (1) | US8853720B2 (ja) |
JP (1) | JP5056799B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150138621A (ko) * | 2014-06-02 | 2015-12-10 | 엘지이노텍 주식회사 | 발광소자 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4997304B2 (ja) | 2010-03-11 | 2012-08-08 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
TWI458122B (zh) * | 2011-11-23 | 2014-10-21 | Toshiba Kk | 半導體發光元件 |
US9196807B2 (en) | 2012-10-24 | 2015-11-24 | Nichia Corporation | Light emitting element |
JP6011244B2 (ja) * | 2012-10-24 | 2016-10-19 | 日亜化学工業株式会社 | 半導体発光素子 |
JP6220614B2 (ja) * | 2013-09-20 | 2017-10-25 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
DE102014112551A1 (de) * | 2014-09-01 | 2016-03-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
CN107078187B (zh) * | 2014-11-07 | 2019-10-25 | 信越半导体株式会社 | 发光组件以及发光组件的制造方法 |
KR102378952B1 (ko) * | 2015-08-27 | 2022-03-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 포함하는 발광소자 패키지 |
JP6730082B2 (ja) * | 2016-05-02 | 2020-07-29 | 日機装株式会社 | 深紫外発光素子の製造方法 |
Family Cites Families (8)
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US6730941B2 (en) * | 2002-01-30 | 2004-05-04 | Showa Denko Kabushiki Kaisha | Boron phosphide-based semiconductor light-emitting device, production method thereof, and light-emitting diode |
JP2006190854A (ja) * | 2005-01-07 | 2006-07-20 | Sony Corp | 発光ダイオード |
US7915619B2 (en) * | 2005-12-22 | 2011-03-29 | Showa Denko K.K. | Light-emitting diode and method for fabrication thereof |
JP4942996B2 (ja) * | 2005-12-22 | 2012-05-30 | 昭和電工株式会社 | 発光ダイオード |
KR100816841B1 (ko) * | 2006-08-14 | 2008-03-26 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광다이오드 소자 및 그 제조방법 |
JP4894411B2 (ja) * | 2006-08-23 | 2012-03-14 | 日立電線株式会社 | 半導体発光素子 |
JP4901453B2 (ja) * | 2006-12-20 | 2012-03-21 | 東芝ディスクリートテクノロジー株式会社 | 半導体発光素子 |
JP2009032882A (ja) * | 2007-07-26 | 2009-02-12 | Sanken Electric Co Ltd | 半導体発光素子及び半導体発光素子製造方法 |
-
2009
- 2009-06-24 JP JP2009150341A patent/JP5056799B2/ja active Active
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2010
- 2010-06-09 US US12/801,456 patent/US8853720B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150138621A (ko) * | 2014-06-02 | 2015-12-10 | 엘지이노텍 주식회사 | 발광소자 |
KR102199995B1 (ko) | 2014-06-02 | 2021-01-11 | 엘지이노텍 주식회사 | 발광소자 |
Also Published As
Publication number | Publication date |
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JP2011009386A (ja) | 2011-01-13 |
US8853720B2 (en) | 2014-10-07 |
US20100327312A1 (en) | 2010-12-30 |
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