JP2021513228A - 窒化ガリウム材料中の拡散によりドープ領域を形成するための方法およびシステム - Google Patents
窒化ガリウム材料中の拡散によりドープ領域を形成するための方法およびシステム Download PDFInfo
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- JP2021513228A JP2021513228A JP2020542951A JP2020542951A JP2021513228A JP 2021513228 A JP2021513228 A JP 2021513228A JP 2020542951 A JP2020542951 A JP 2020542951A JP 2020542951 A JP2020542951 A JP 2020542951A JP 2021513228 A JP2021513228 A JP 2021513228A
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- Prior art keywords
- gallium nitride
- nitride layer
- magnesium
- layer
- epitaxial
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 394
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 372
- 238000000034 method Methods 0.000 title claims abstract description 132
- 238000009792 diffusion process Methods 0.000 title claims abstract description 70
- 239000000463 material Substances 0.000 title claims abstract description 68
- 239000011777 magnesium Substances 0.000 claims abstract description 176
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 172
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 168
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 239000002019 doping agent Substances 0.000 claims abstract description 27
- 230000004888 barrier function Effects 0.000 claims description 28
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 25
- 238000000151 deposition Methods 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 17
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 16
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 9
- 238000000427 thin-film deposition Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 476
- 230000008569 process Effects 0.000 description 38
- 238000012986 modification Methods 0.000 description 29
- 230000004048 modification Effects 0.000 description 29
- 239000012790 adhesive layer Substances 0.000 description 24
- 229910002704 AlGaN Inorganic materials 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 20
- 238000000137 annealing Methods 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 229910010293 ceramic material Inorganic materials 0.000 description 7
- 238000005137 deposition process Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 4
- -1 magnesium nitride Chemical class 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000004151 rapid thermal annealing Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000036039 immunity Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 229920006926 PFC Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
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- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
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- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
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- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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Abstract
【選択図】図2C
Description
本出願は、2018年2月12日に提出された米国仮特許出願第62/629,588号に対する優先権を主張し、その開示は、あらゆる目的のためにその全体が参照により本明細書に組み込まれる。
の形で温度に指数関数的に依存する場合があり、ここで、kはボルツマン定数、Tは温度、EDは活性化エネルギーである。
Claims (20)
- 窒化ガリウム材料中の拡散によりドープ領域を形成する方法であって、前記方法が、
窒化ガリウム層を含む基板構造を提供することと、
前記窒化ガリウム層上にマスクを形成することであって、前記マスクが前記窒化ガリウム層の上面の1つまたは複数の部分を露出させる、形成することと、
前記窒化ガリウム層の前記上面の前記1つまたは複数の部分にマグネシウム含有窒化ガリウム層を堆積させることと、
前記マグネシウム含有窒化ガリウム層の堆積と同時に、前記1つまたは複数の部分を通して前記窒化ガリウム層にマグネシウムを拡散させることにより、前記窒化ガリウム層に1つまたは複数のマグネシウムドープ領域を形成することであって、前記マグネシウム含有窒化ガリウム層がマグネシウムドーパントのソースを提供する、形成することと、
前記マグネシウム含有窒化ガリウム層を除去することと、
前記マスクを除去することと
を含む、方法。 - 前記マグネシウム含有窒化ガリウム層を堆積させることが薄膜堆積チャンバ内で行われる、請求項1に記載の方法。
- 前記マグネシウム含有窒化ガリウム層を堆積させることが、約900℃〜約1100℃の範囲の温度で行われる、請求項1に記載の方法。
- 前記マグネシウム含有窒化ガリウム層は、約1×1019cm−3〜約1×1020cm−3の範囲のマグネシウム密度を有する、請求項1に記載の方法。
- 前記基板構造が、
基板上に形成されたバッファ層と、
前記バッファ層上に形成された第1のエピタキシャル窒化ガリウム層と、
前記第1のエピタキシャル窒化ガリウム層上に形成された第2のエピタキシャル窒化ガリウム層とを含み、
前記1つまたは複数のマグネシウムドープ領域は、前記第2のエピタキシャル窒化ガリウム層に形成される、請求項1に記載の方法。 - 前記基板が、
多結晶セラミックコアと、
前記多結晶セラミックコアを封入するバリア層と、
前記バリア層に結合された結合層と、
前記結合層に結合された実質的に単結晶の層と
を含む、請求項5に記載の方法。 - 前記第2のエピタキシャル窒化ガリウム層は、前記マグネシウム含有窒化ガリウム層が堆積される前にドープされていない、請求項5に記載の方法。
- 前記第1のエピタキシャル窒化ガリウム層がN型ドープされている、請求項7に記載の方法。
- 前記第2のエピタキシャル窒化ガリウム層内の前記1つまたは複数のマグネシウムドープ領域の各々が、前記第1のエピタキシャル窒化ガリウム層との界面でp−n接合を形成する、請求項8に記載の方法。
- 前記第2のエピタキシャル窒化ガリウム層内の前記1つまたは複数のマグネシウムドープ領域が、マージされたp−i−nショットキー(MPS)ダイオードの一部を形成する、請求項8に記載の方法。
- 前記第2のエピタキシャル窒化ガリウム層内の前記1つまたは複数のマグネシウムドープ領域は、前記MPSダイオードの接合終端拡張部(JTE)の一部を形成する、請求項10に記載の方法。
- 前記第2のエピタキシャル窒化ガリウム層内の前記1つまたは複数のマグネシウムドープ領域の2つが、前記第2のエピタキシャル窒化ガリウム層の一部によって互いに分離された第1のエッジ終端領域と第2のエッジ終端領域とを含み、前記方法がさらに、
前記第2のエピタキシャル窒化ガリウム層の一部と、前記第1のエッジ終端領域および前記第2のエッジ終端領域とに結合されたショットキー接触を形成すること
を含む、請求項5に記載の方法。 - 窒化ガリウム材料中にドープ領域を形成する方法であって、前記方法が、
窒化ガリウム基板構造を提供することであって、前記窒化ガリウム基板構造が、
基板上に形成されたバッファ層と、
前記バッファ層上に形成された第1のエピタキシャル窒化ガリウム層と、
前記第1のエピタキシャル窒化ガリウム層上に形成された第2のエピタキシャル窒化ガリウム層と、
前記第2のエピタキシャル窒化ガリウム層上に形成されたエピタキシャル窒化アルミニウムガリウム層と
を含む、提供することと、
前記エピタキシャル窒化アルミニウムガリウム層上にマスクを形成することであって、前記マスクが、前記エピタキシャル窒化アルミニウムガリウム層の上面の1つまたは複数の部分を露出させる、形成することと、
前記エピタキシャル窒化アルミニウムガリウム層の前記上面の前記1つまたは複数の部分にマグネシウム含有窒化ガリウム層を堆積させることと、
前記マグネシウム含有窒化ガリウム層の堆積と同時に、前記1つまたは複数の部分を通して前記エピタキシャル窒化アルミニウムガリウム層にマグネシウムを拡散させることにより、前記エピタキシャル窒化アルミニウムガリウム層に1つまたは複数のマグネシウムドープ領域を形成することであって、前記マグネシウム含有窒化ガリウム層がマグネシウムドーパントのソースを提供する、形成することと、
前記マグネシウム含有窒化ガリウム層を除去することと、
前記マスクを除去することと
を含む、方法。 - 前記マグネシウム含有窒化ガリウム層を堆積させることが薄膜堆積チャンバ内で行われる、請求項13に記載の方法。
- 前記マグネシウム含有窒化ガリウム層を堆積させることが、約900℃〜約1100℃の範囲の温度で行われる、請求項13に記載の方法。
- 前記マグネシウム含有窒化ガリウム層は、約1×1019cm−3〜約1×1019cm−3の範囲のマグネシウム密度を有する、請求項13に記載の方法。
- 前記基板が、
多結晶セラミックコアと、
前記多結晶セラミックコアを封入するバリア層と、
前記バリア層に結合された結合層と、
前記結合層に結合された実質的に単結晶の層と
を含む、請求項13に記載の方法。 - 前記第2のエピタキシャル窒化ガリウム層がドープされていない、請求項13に記載の方法。
- 前記第1のエピタキシャル窒化ガリウム層がN型ドープされている、請求項18に記載の方法。
- 前記エピタキシャル窒化アルミニウムガリウム層の前記1つまたは複数のマグネシウムドープ領域の各々が、前記第2のエピタキシャル窒化ガリウム層との界面を形成し、前記界面は、高電子移動度トランジスタ(HEMT)パワーデバイスの閾値電圧を制御する、請求項19に記載の方法。
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JP7328234B2 (ja) | 2023-08-16 |
EP3753044B1 (en) | 2023-05-03 |
EP3753044A1 (en) | 2020-12-23 |
TW201941430A (zh) | 2019-10-16 |
US10763110B2 (en) | 2020-09-01 |
TWI796432B (zh) | 2023-03-21 |
SG11202007497WA (en) | 2020-09-29 |
KR20200120679A (ko) | 2020-10-21 |
EP3753044A4 (en) | 2021-12-08 |
US20190252186A1 (en) | 2019-08-15 |
KR102592686B1 (ko) | 2023-10-20 |
CN111919281B (zh) | 2024-04-02 |
CN111919281A (zh) | 2020-11-10 |
WO2019157384A1 (en) | 2019-08-15 |
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