JP2021504936A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2021504936A5 JP2021504936A5 JP2020526133A JP2020526133A JP2021504936A5 JP 2021504936 A5 JP2021504936 A5 JP 2021504936A5 JP 2020526133 A JP2020526133 A JP 2020526133A JP 2020526133 A JP2020526133 A JP 2020526133A JP 2021504936 A5 JP2021504936 A5 JP 2021504936A5
- Authority
- JP
- Japan
- Prior art keywords
- superconducting
- substrate
- rear surface
- via layer
- coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 7
- 230000008878 coupling Effects 0.000 claims 5
- 238000010168 coupling process Methods 0.000 claims 5
- 238000005859 coupling reaction Methods 0.000 claims 5
- 239000003989 dielectric material Substances 0.000 claims 4
- 239000002887 superconductor Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 238000001459 lithography Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/822,338 | 2017-11-27 | ||
| US15/822,338 US10446736B2 (en) | 2017-11-27 | 2017-11-27 | Backside coupling with superconducting partial TSV for transmon qubits |
| PCT/EP2018/078707 WO2019101448A1 (en) | 2017-11-27 | 2018-10-19 | Backside coupling with superconducting partial tsv for transmon qubits |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021504936A JP2021504936A (ja) | 2021-02-15 |
| JP2021504936A5 true JP2021504936A5 (https=) | 2021-03-25 |
| JP7212439B2 JP7212439B2 (ja) | 2023-01-25 |
Family
ID=64049089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020526133A Active JP7212439B2 (ja) | 2017-11-27 | 2018-10-19 | 超電導部分ｔｓｖを用いたトランスモン・キュービット用の後面結合 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10446736B2 (https=) |
| EP (1) | EP3707647B1 (https=) |
| JP (1) | JP7212439B2 (https=) |
| CN (1) | CN111295678B (https=) |
| ES (1) | ES2896013T3 (https=) |
| WO (1) | WO2019101448A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10068184B1 (en) * | 2017-10-27 | 2018-09-04 | International Business Machines Corporation | Vertical superconducting capacitors for transmon qubits |
| US10446736B2 (en) * | 2017-11-27 | 2019-10-15 | International Business Machines Corporation | Backside coupling with superconducting partial TSV for transmon qubits |
| US10811588B2 (en) * | 2018-08-06 | 2020-10-20 | International Business Machines Corporation | Vertical dispersive readout of qubits of a lattice surface code architecture |
| US11088310B2 (en) * | 2019-04-29 | 2021-08-10 | International Business Machines Corporation | Through-silicon-via fabrication in planar quantum devices |
| US11699091B2 (en) | 2020-03-02 | 2023-07-11 | Massachusetts Institute Of Technology | Qubit circuits with deep, in-substrate components |
| US11289638B2 (en) * | 2020-06-22 | 2022-03-29 | International Business Machines Corporation | Superconducting qubit lifetime and coherence improvement via backside etching |
| US11152707B1 (en) * | 2020-07-02 | 2021-10-19 | International Business Machines Corporation | Fast radio frequency package |
| EP4002227B1 (en) * | 2020-11-23 | 2026-01-07 | IQM Finland Oy | Three-dimensional superconducting qubit and a method for manufacturing the same |
| US12033981B2 (en) | 2020-12-16 | 2024-07-09 | International Business Machines Corporation | Create a protected layer for interconnects and devices in a packaged quantum structure |
| WO2022143809A1 (zh) * | 2020-12-31 | 2022-07-07 | 合肥本源量子计算科技有限责任公司 | 超导量子芯片结构以及超导量子芯片制备方法 |
| EP4053865B1 (en) | 2021-03-02 | 2024-04-24 | Imec VZW | Trench capacitor device for a superconducting electronic circuit, superconducting qubit device and method for forming a trench capacitor device for a qubit device |
| US11621387B2 (en) * | 2021-03-11 | 2023-04-04 | International Business Machines Corporation | Quantum device with low surface losses |
| CN117063188A (zh) * | 2021-04-28 | 2023-11-14 | Iqm芬兰公司 | 用于量子位的光学驱动器 |
| US12532670B2 (en) | 2021-12-08 | 2026-01-20 | International Business Machines Corporation | Vertical transmon structure and its fabrication process |
| CN115697029B (zh) * | 2022-12-30 | 2023-06-20 | 量子科技长三角产业创新中心 | 一种超导量子芯片及其制备方法 |
| JP2026030901A (ja) | 2024-08-09 | 2026-02-24 | 富士通株式会社 | 量子デバイスの製造方法及び量子デバイス |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4117357A (en) | 1977-04-15 | 1978-09-26 | Electric Power Research Institute, Inc. | Flexible coupling for rotor elements of a superconducting generator |
| JPS6054485A (ja) * | 1983-09-05 | 1985-03-28 | Agency Of Ind Science & Technol | ジョゼフソン接合の製造方法 |
| US5232905A (en) | 1987-01-30 | 1993-08-03 | Hitachi, Ltd. | High Tc superconducting device with weak link between two superconducting electrodes |
| US5099215A (en) | 1990-08-29 | 1992-03-24 | General Electric Company | Coupling device for a superconducting magnet |
| JPH05129671A (ja) | 1991-10-31 | 1993-05-25 | Sharp Corp | 超電導磁気抵抗効果素子およびその製造方法 |
| US5291168A (en) | 1992-05-11 | 1994-03-01 | General Electric Company | Connector cooling and protection for power coupling assembly for superconducting magnets |
| US5569387A (en) | 1994-11-14 | 1996-10-29 | Bowne; William C. | Wastewater collection and discharge system |
| EP0828606A4 (en) | 1995-05-19 | 1999-09-08 | American Superconductor Corp | MULTI-FILAMENT SUPERCONDUCTING COMPOSITE AND MANUFACTURING METHOD |
| US6347237B1 (en) | 1999-03-16 | 2002-02-12 | Superconductor Technologies, Inc. | High temperature superconductor tunable filter |
| US6351045B1 (en) | 1999-09-30 | 2002-02-26 | Reliance Electric Technologies, Llc | Croyogenic rotary transfer coupling for superconducting electromechanical machine |
| US6657333B2 (en) | 2001-09-17 | 2003-12-02 | Reliance Electric Technologies, Llc | Vacuum coupling of rotating superconducting rotor |
| US7268576B2 (en) * | 2004-11-08 | 2007-09-11 | D-Wave Systems Inc. | Superconducting qubit with a plurality of capacitive couplings |
| KR100776419B1 (ko) | 2006-05-04 | 2007-11-16 | 조선대학교산학협력단 | 켄치특성 개선용 자속구속형 초전도 전류제한기 |
| US7477055B1 (en) | 2007-08-21 | 2009-01-13 | General Electric Company | Apparatus and method for coupling coils in a superconducting magnet |
| US8607179B2 (en) | 2011-11-25 | 2013-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | RC extraction methodology for floating silicon substrate with TSV |
| WO2013180780A2 (en) | 2012-03-08 | 2013-12-05 | D-Wave Systems Inc. | Systems and methods for fabrication of superconducting integrated circuits |
| JP2014027194A (ja) | 2012-07-30 | 2014-02-06 | National Institute Of Advanced Industrial & Technology | イオン粒子検出器並びにイオン粒子検出方法 |
| US20160104073A1 (en) * | 2012-12-05 | 2016-04-14 | The United States Of America As Represented By The Secretary Of Commerce | Radiation Suppression of Superconducting Quantum Bits Using a Conductive Plane |
| TWI493666B (zh) | 2013-01-25 | 2015-07-21 | 義守大學 | 晶片間信號傳輸系統及晶片間電容耦合傳輸電路 |
| EP2965054B1 (en) | 2013-03-05 | 2022-07-20 | Teknologian tutkimuskeskus VTT Oy | Superconducting thermal detector of terahertz radiation |
| EP3195377B1 (en) | 2014-08-13 | 2021-12-15 | D-Wave Systems Inc. | Method of forming superconducting wiring layers with low magnetic noise |
| KR102344884B1 (ko) | 2014-11-25 | 2021-12-29 | 삼성전자주식회사 | 멀티 큐빗 커플링 구조 |
| US9524470B1 (en) | 2015-06-12 | 2016-12-20 | International Business Machines Corporation | Modular array of vertically integrated superconducting qubit devices for scalable quantum computing |
| WO2017015432A1 (en) | 2015-07-23 | 2017-01-26 | Massachusetts Institute Of Technology | Superconducting integrated circuit |
| US9922289B2 (en) | 2015-09-30 | 2018-03-20 | International Business Machines Corporation | Quantum nondemolition microwave photon counter based on the cross-Kerr nonlinearity of a Josephson junction embedded in a superconducting circuit |
| CN105470225B (zh) | 2015-12-09 | 2018-04-17 | 西安交通大学 | 基于穿硅电容的三维容性耦合互连结构的制作方法 |
| JP2017110293A (ja) | 2015-12-15 | 2017-06-22 | 東京エレクトロン株式会社 | カーボン膜の成膜方法および成膜装置 |
| SG11201805152UA (en) | 2015-12-15 | 2018-07-30 | Google Llc | Superconducting bump bonds |
| WO2017217961A1 (en) | 2016-06-13 | 2017-12-21 | Intel Corporation | Josephson junctions made from refractory and noble metals |
| EP3563308A1 (en) | 2016-12-27 | 2019-11-06 | Intel Corporation | Superconducting qubit device packages |
| US10446736B2 (en) * | 2017-11-27 | 2019-10-15 | International Business Machines Corporation | Backside coupling with superconducting partial TSV for transmon qubits |
-
2017
- 2017-11-27 US US15/822,338 patent/US10446736B2/en active Active
-
2018
- 2018-10-19 CN CN201880070681.5A patent/CN111295678B/zh active Active
- 2018-10-19 WO PCT/EP2018/078707 patent/WO2019101448A1/en not_active Ceased
- 2018-10-19 EP EP18795343.5A patent/EP3707647B1/en active Active
- 2018-10-19 JP JP2020526133A patent/JP7212439B2/ja active Active
- 2018-10-19 ES ES18795343T patent/ES2896013T3/es active Active
-
2019
- 2019-02-05 US US16/267,463 patent/US10529908B2/en not_active Expired - Fee Related
- 2019-10-09 US US16/597,604 patent/US10804454B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021504936A5 (https=) | ||
| CN105762108B (zh) | 半导体结构及其形成方法 | |
| US9029212B2 (en) | MEMS pressure sensors and fabrication method thereof | |
| CN103400934B (zh) | 3d磁传感器的形成方法 | |
| JP2016511534A5 (https=) | ||
| TWI544808B (zh) | 整合式麥克風結構及製造麥克風之方法 | |
| JP2007311584A5 (https=) | ||
| JP2012521704A5 (https=) | ||
| JP2013520844A5 (https=) | ||
| CN104347477B (zh) | 半导体结构的形成方法 | |
| JP2006524436A5 (https=) | ||
| JP2010205990A5 (https=) | ||
| CN104795311B (zh) | 半导体器件的形成方法 | |
| TWI456752B (zh) | 半導體影像感測裝置及半導體影像感測元件與其形成方法 | |
| JP2015529017A5 (https=) | ||
| JP2017220494A5 (https=) | ||
| CN104993804B (zh) | 一种mems谐振结构的加工方法 | |
| CN103407959B (zh) | 三维电极图形制作方法 | |
| CN103839868A (zh) | 浅沟槽隔离结构的制作方法 | |
| TWI593057B (zh) | 藉由硏磨以分隔電子部件而在半導體基材上形成電子部件 | |
| JP2007001004A5 (https=) | ||
| JP2011139069A5 (https=) | ||
| CN107785278A (zh) | 一种晶圆级真空封装的mems晶振及制备方法 | |
| CN105185702A (zh) | 高k金属栅极结构的制造方法 | |
| CN102381681A (zh) | 一种微机械结构与集成电路单片集成的加工方法 |