JP2012521704A5 - - Google Patents

Download PDF

Info

Publication number
JP2012521704A5
JP2012521704A5 JP2012501381A JP2012501381A JP2012521704A5 JP 2012521704 A5 JP2012521704 A5 JP 2012521704A5 JP 2012501381 A JP2012501381 A JP 2012501381A JP 2012501381 A JP2012501381 A JP 2012501381A JP 2012521704 A5 JP2012521704 A5 JP 2012521704A5
Authority
JP
Japan
Prior art keywords
substrate
cmut array
cavity
cmut
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012501381A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012521704A (ja
JP5744002B2 (ja
Filing date
Publication date
Priority claimed from GB0905256A external-priority patent/GB0905256D0/en
Priority claimed from GB0905255A external-priority patent/GB0905255D0/en
Priority claimed from GB0909296A external-priority patent/GB0909296D0/en
Application filed filed Critical
Priority claimed from PCT/GB2010/000583 external-priority patent/WO2010109205A2/en
Publication of JP2012521704A publication Critical patent/JP2012521704A/ja
Publication of JP2012521704A5 publication Critical patent/JP2012521704A5/ja
Application granted granted Critical
Publication of JP5744002B2 publication Critical patent/JP5744002B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012501381A 2009-03-26 2010-03-26 Ｃｍｕｔアレイ Expired - Fee Related JP5744002B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB0905256A GB0905256D0 (en) 2009-03-26 2009-03-26 Ultrasound transducer backing layer
GB0905256.4 2009-03-26
GB0905255.6 2009-03-26
GB0905255A GB0905255D0 (en) 2009-03-26 2009-03-26 Cmut array
GB0909296A GB0909296D0 (en) 2009-05-28 2009-05-28 Ultrasound transsducer damping layer
GB0909296.6 2009-05-28
PCT/GB2010/000583 WO2010109205A2 (en) 2009-03-26 2010-03-26 Cmut array

Publications (3)

Publication Number Publication Date
JP2012521704A JP2012521704A (ja) 2012-09-13
JP2012521704A5 true JP2012521704A5 (https=) 2013-05-16
JP5744002B2 JP5744002B2 (ja) 2015-07-01

Family

ID=42308937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012501381A Expired - Fee Related JP5744002B2 (ja) 2009-03-26 2010-03-26 Ｃｍｕｔアレイ

Country Status (7)

Country Link
US (1) US20120074509A1 (https=)
EP (4) EP2669019A1 (https=)
JP (1) JP5744002B2 (https=)
CN (1) CN102427890A (https=)
DK (1) DK2411163T3 (https=)
ES (1) ES2416182T3 (https=)
WO (1) WO2010109205A2 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136198A1 (ja) * 2007-04-27 2008-11-13 Hitachi, Ltd. 超音波トランスデューサ及び超音波撮像装置
FI124354B (fi) * 2011-04-04 2014-07-15 Okmetic Oyj Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille
EP2768396A2 (en) 2011-10-17 2014-08-27 Butterfly Network Inc. Transmissive imaging and related apparatus and methods
US9220415B2 (en) * 2011-10-25 2015-12-29 Andreas Mandelis Systems and methods for frequency-domain photoacoustic phased array imaging
WO2013089648A1 (en) * 2011-12-16 2013-06-20 Agency For Science, Technology And Research Capacitive micromachined ultrasonic transducer arrangement and method of fabricating the same
JP2013226389A (ja) * 2012-03-31 2013-11-07 Canon Inc 探触子及びその製造方法、及びそれを用いた被検体情報取得装置
CN104379268B (zh) * 2012-05-31 2017-02-22 皇家飞利浦有限公司 晶片及其制造方法
US9012324B2 (en) * 2012-08-24 2015-04-21 United Microelectronics Corp. Through silicon via process
KR101851569B1 (ko) 2012-11-28 2018-04-24 삼성전자주식회사 초음파 변환기 및 그 제조방법
JP6360499B2 (ja) * 2013-01-18 2018-07-18 イェール ユニバーシティーＹａｌｅ Ｕｎｉｖｅｒｓｉｔｙ 少なくとも１つの囲いを有する超伝導デバイスを製造するための方法
SG11201505616YA (en) 2013-01-18 2015-09-29 Univ Yale Superconducting device with at least one enclosure
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
CN109954646B (zh) 2013-03-15 2021-04-27 蝴蝶网络有限公司 超声装置
WO2014151525A2 (en) 2013-03-15 2014-09-25 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
CA2927326C (en) 2013-10-15 2024-02-27 Yale University Low-noise josephson junction-based directional amplifier
KR20150046637A (ko) * 2013-10-22 2015-04-30 삼성전자주식회사 광음향 이미지와 초음파 이미지를 위한 광대역 초음파 프로브
CA2930648A1 (en) 2013-11-22 2015-05-28 Sunnybrook Health Sciences Centre Ultrasonic transducer with backing having spatially segmented surface
KR20150065067A (ko) * 2013-12-04 2015-06-12 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법
US9948254B2 (en) 2014-02-21 2018-04-17 Yale University Wireless Josephson bifurcation amplifier
CA2946133A1 (en) 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
CA2946120C (en) 2014-04-18 2022-10-25 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
EP3132281B1 (en) 2014-04-18 2019-10-30 Butterfly Network Inc. Ultrasonic imaging compression methods and apparatus
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3233311B1 (en) 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
EP3262762B1 (en) 2015-02-27 2021-11-10 Yale University Josephson junction-based circulators and related systems and methods
US10468740B2 (en) 2015-02-27 2019-11-05 Yale University Techniques for coupling planar qubits to non-planar resonators and related systems and methods
CA2977968C (en) 2015-02-27 2023-10-17 Yale University Techniques for producing quantum amplifiers and related systems and methods
KR20180004132A (ko) 2015-04-17 2018-01-10 예일 유니버시티 무선 조셉슨 파라메트릭 컨버터
US10427188B2 (en) 2015-07-30 2019-10-01 North Carolina State University Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT)
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
WO2017123940A1 (en) 2016-01-15 2017-07-20 Yale University Techniques for manipulation of two-quantum states and related systems and methods
CN106998522B (zh) * 2016-01-25 2023-07-28 中国科学院苏州纳米技术与纳米仿生研究所 微电容超声传感器
FR3060844B1 (fr) 2016-12-15 2018-12-14 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif microelectronique acoustique
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
EP3676025B1 (en) 2017-11-16 2024-08-14 InvenSense, Inc. Piezoelectric micromachined ultrasonic transducer with a patterned membrane structure, and a method of fabrication
WO2019118442A1 (en) 2017-12-11 2019-06-20 Yale University Superconducting nonlinear asymmetric inductive element and related systems and methods
EP3788798B1 (en) * 2018-05-03 2023-07-05 BFLY Operations, Inc. Ultrasonic transducers with pressure ports
US11223355B2 (en) 2018-12-12 2022-01-11 Yale University Inductively-shunted transmon qubit for superconducting circuits
EP3912200B1 (en) 2019-01-17 2024-05-15 Yale University Josephson nonlinear circuit
EP4176978B1 (en) * 2019-03-14 2023-11-22 Imec VZW Flexible ultrasound array
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
FR3114255B1 (fr) * 2020-09-18 2023-05-05 Moduleus Transducteur CMUT
US20220409170A1 (en) * 2021-06-23 2022-12-29 Boston Scientific Scimed, Inc. Ultrasound transducer
FR3135858B1 (fr) * 2022-05-23 2025-04-18 Vermon Transducteur CMUT et procédé de fabrication d’un transducteur CMUT

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01312485A (ja) * 1988-06-13 1989-12-18 Agency Of Ind Science & Technol 静電容量型超音波トランスデューサ
US5267221A (en) * 1992-02-13 1993-11-30 Hewlett-Packard Company Backing for acoustic transducer array
JP3512500B2 (ja) * 1994-12-26 2004-03-29 株式会社東芝 超音波トランスジューサとその製造方法
US5648941A (en) * 1995-09-29 1997-07-15 Hewlett-Packard Company Transducer backing material
US6266857B1 (en) * 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6467138B1 (en) * 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
JP5027992B2 (ja) * 2002-05-23 2012-09-19 ショット アクチエンゲゼルシャフト 高周波用途のためのガラス材料
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US7321181B2 (en) * 2004-04-07 2008-01-22 The Board Of Trustees Of The Leland Stanford Junior University Capacitive membrane ultrasonic transducers with reduced bulk wave generation and method
US7545075B2 (en) * 2004-06-04 2009-06-09 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
EP1779784B1 (en) * 2004-06-07 2015-10-14 Olympus Corporation Electrostatic capacity type ultrasonic transducer
KR100618287B1 (ko) * 2004-08-24 2006-08-31 삼신이노텍 주식회사 블루투스를 이용한 펜타입의 휴대용 무선통신 단말기
ITRM20050093A1 (it) * 2005-03-04 2006-09-05 Consiglio Nazionale Ricerche Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato.
JP2008545501A (ja) * 2005-06-07 2008-12-18 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 超音波センサ組立体に対するバッキングブロック
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
JP4804961B2 (ja) * 2006-03-03 2011-11-02 オリンパスメディカルシステムズ株式会社 超音波振動子及びそれを搭載した体腔内超音波診断装置
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
WO2009154091A1 (ja) * 2008-06-17 2009-12-23 株式会社日立製作所 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JP2012521704A5 (https=)
CN104992956B (zh) 无边框显示装置及其制作方法
JP2012085239A5 (https=)
CN112005378A (zh) 显示基板及其制备方法
WO2010109205A3 (en) Wafer bond cmut array with conductive vias
WO2012143784A3 (en) Semiconductor device and manufacturing method thereof
JP2016518739A5 (https=)
JP2013511142A5 (https=)
JP2009033145A5 (https=)
JP2017516428A5 (https=)
JP2011151121A5 (https=)
JP2011054949A5 (ja) 半導体装置
WO2013055307A3 (en) Backplane reinforcement and interconnects for solar cells
WO2011061043A3 (en) Grid-line-free contact for a photovoltaic cell
JP2009194322A5 (https=)
JP2009003434A5 (https=)
EP2423948A3 (en) Lateral connection for a via-less thin film resistor and method of forming the same
WO2012061091A3 (en) Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package
JP2009278072A5 (https=)
WO2009028578A3 (en) Semiconductor device including semiconductor constituent and manufacturing method thereof
JP2009049393A5 (https=)
JP2011045040A5 (https=)
EP2230686A3 (en) Method of manufacturing semiconductor device
JP2009158743A5 (https=)
EP2031653A3 (en) Semiconductor device having multiple element formation regions and manufacturing method thereof