DK2411163T3 - Waferbundet cmut-array med ledende kontakthuller - Google Patents

Waferbundet cmut-array med ledende kontakthuller

Info

Publication number
DK2411163T3
DK2411163T3 DK10714943.7T DK10714943T DK2411163T3 DK 2411163 T3 DK2411163 T3 DK 2411163T3 DK 10714943 T DK10714943 T DK 10714943T DK 2411163 T3 DK2411163 T3 DK 2411163T3
Authority
DK
Denmark
Prior art keywords
array
contact holes
wafer bonded
leading contact
cmut
Prior art date
Application number
DK10714943.7T
Other languages
Danish (da)
English (en)
Inventor
Sigrid Berg
Kamal Chapagain
Jon Due-Hansen
Kjell Arne Ingebrigtsen
Geir Uri Jensen
Kjersti Midtboe
Erik Utne Poppe
Arne Roennekleiv
Dag Thorstein Wang
Original Assignee
Norwegian Univ Sci & Tech Ntnu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0905256A external-priority patent/GB0905256D0/en
Priority claimed from GB0905255A external-priority patent/GB0905255D0/en
Priority claimed from GB0909296A external-priority patent/GB0909296D0/en
Application filed by Norwegian Univ Sci & Tech Ntnu filed Critical Norwegian Univ Sci & Tech Ntnu
Application granted granted Critical
Publication of DK2411163T3 publication Critical patent/DK2411163T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H10W20/211—Through-semiconductor vias, e.g. TSVs
    • H10W20/212—Top-view shapes or dispositions, e.g. top-view layouts of the vias
    • H10W20/2125—Top-view shapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Bipolar Transistors (AREA)
  • Pressure Sensors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DK10714943.7T 2009-03-26 2010-03-26 Waferbundet cmut-array med ledende kontakthuller DK2411163T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0905256A GB0905256D0 (en) 2009-03-26 2009-03-26 Ultrasound transducer backing layer
GB0905255A GB0905255D0 (en) 2009-03-26 2009-03-26 Cmut array
GB0909296A GB0909296D0 (en) 2009-05-28 2009-05-28 Ultrasound transsducer damping layer
PCT/GB2010/000583 WO2010109205A2 (en) 2009-03-26 2010-03-26 Cmut array

Publications (1)

Publication Number Publication Date
DK2411163T3 true DK2411163T3 (da) 2013-06-10

Family

ID=42308937

Family Applications (1)

Application Number Title Priority Date Filing Date
DK10714943.7T DK2411163T3 (da) 2009-03-26 2010-03-26 Waferbundet cmut-array med ledende kontakthuller

Country Status (7)

Country Link
US (1) US20120074509A1 (https=)
EP (4) EP2669019A1 (https=)
JP (1) JP5744002B2 (https=)
CN (1) CN102427890A (https=)
DK (1) DK2411163T3 (https=)
ES (1) ES2416182T3 (https=)
WO (1) WO2010109205A2 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136198A1 (ja) * 2007-04-27 2008-11-13 Hitachi, Ltd. 超音波トランスデューサ及び超音波撮像装置
FI124354B (fi) * 2011-04-04 2014-07-15 Okmetic Oyj Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille
EP2768396A2 (en) 2011-10-17 2014-08-27 Butterfly Network Inc. Transmissive imaging and related apparatus and methods
US9220415B2 (en) * 2011-10-25 2015-12-29 Andreas Mandelis Systems and methods for frequency-domain photoacoustic phased array imaging
WO2013089648A1 (en) * 2011-12-16 2013-06-20 Agency For Science, Technology And Research Capacitive micromachined ultrasonic transducer arrangement and method of fabricating the same
JP2013226389A (ja) * 2012-03-31 2013-11-07 Canon Inc 探触子及びその製造方法、及びそれを用いた被検体情報取得装置
CN104379268B (zh) * 2012-05-31 2017-02-22 皇家飞利浦有限公司 晶片及其制造方法
US9012324B2 (en) * 2012-08-24 2015-04-21 United Microelectronics Corp. Through silicon via process
KR101851569B1 (ko) 2012-11-28 2018-04-24 삼성전자주식회사 초음파 변환기 및 그 제조방법
JP6360499B2 (ja) * 2013-01-18 2018-07-18 イェール ユニバーシティーＹａｌｅ Ｕｎｉｖｅｒｓｉｔｙ 少なくとも１つの囲いを有する超伝導デバイスを製造するための方法
SG11201505616YA (en) 2013-01-18 2015-09-29 Univ Yale Superconducting device with at least one enclosure
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
CN109954646B (zh) 2013-03-15 2021-04-27 蝴蝶网络有限公司 超声装置
WO2014151525A2 (en) 2013-03-15 2014-09-25 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
CA2927326C (en) 2013-10-15 2024-02-27 Yale University Low-noise josephson junction-based directional amplifier
KR20150046637A (ko) * 2013-10-22 2015-04-30 삼성전자주식회사 광음향 이미지와 초음파 이미지를 위한 광대역 초음파 프로브
CA2930648A1 (en) 2013-11-22 2015-05-28 Sunnybrook Health Sciences Centre Ultrasonic transducer with backing having spatially segmented surface
KR20150065067A (ko) * 2013-12-04 2015-06-12 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법
US9948254B2 (en) 2014-02-21 2018-04-17 Yale University Wireless Josephson bifurcation amplifier
CA2946133A1 (en) 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
CA2946120C (en) 2014-04-18 2022-10-25 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
EP3132281B1 (en) 2014-04-18 2019-10-30 Butterfly Network Inc. Ultrasonic imaging compression methods and apparatus
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3233311B1 (en) 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
EP3262762B1 (en) 2015-02-27 2021-11-10 Yale University Josephson junction-based circulators and related systems and methods
US10468740B2 (en) 2015-02-27 2019-11-05 Yale University Techniques for coupling planar qubits to non-planar resonators and related systems and methods
CA2977968C (en) 2015-02-27 2023-10-17 Yale University Techniques for producing quantum amplifiers and related systems and methods
KR20180004132A (ko) 2015-04-17 2018-01-10 예일 유니버시티 무선 조셉슨 파라메트릭 컨버터
US10427188B2 (en) 2015-07-30 2019-10-01 North Carolina State University Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT)
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
WO2017123940A1 (en) 2016-01-15 2017-07-20 Yale University Techniques for manipulation of two-quantum states and related systems and methods
CN106998522B (zh) * 2016-01-25 2023-07-28 中国科学院苏州纳米技术与纳米仿生研究所 微电容超声传感器
FR3060844B1 (fr) 2016-12-15 2018-12-14 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif microelectronique acoustique
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
EP3676025B1 (en) 2017-11-16 2024-08-14 InvenSense, Inc. Piezoelectric micromachined ultrasonic transducer with a patterned membrane structure, and a method of fabrication
WO2019118442A1 (en) 2017-12-11 2019-06-20 Yale University Superconducting nonlinear asymmetric inductive element and related systems and methods
EP3788798B1 (en) * 2018-05-03 2023-07-05 BFLY Operations, Inc. Ultrasonic transducers with pressure ports
US11223355B2 (en) 2018-12-12 2022-01-11 Yale University Inductively-shunted transmon qubit for superconducting circuits
EP3912200B1 (en) 2019-01-17 2024-05-15 Yale University Josephson nonlinear circuit
EP4176978B1 (en) * 2019-03-14 2023-11-22 Imec VZW Flexible ultrasound array
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
FR3114255B1 (fr) * 2020-09-18 2023-05-05 Moduleus Transducteur CMUT
US20220409170A1 (en) * 2021-06-23 2022-12-29 Boston Scientific Scimed, Inc. Ultrasound transducer
FR3135858B1 (fr) * 2022-05-23 2025-04-18 Vermon Transducteur CMUT et procédé de fabrication d’un transducteur CMUT

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01312485A (ja) * 1988-06-13 1989-12-18 Agency Of Ind Science & Technol 静電容量型超音波トランスデューサ
US5267221A (en) * 1992-02-13 1993-11-30 Hewlett-Packard Company Backing for acoustic transducer array
JP3512500B2 (ja) * 1994-12-26 2004-03-29 株式会社東芝 超音波トランスジューサとその製造方法
US5648941A (en) * 1995-09-29 1997-07-15 Hewlett-Packard Company Transducer backing material
US6266857B1 (en) * 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6467138B1 (en) * 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
JP5027992B2 (ja) * 2002-05-23 2012-09-19 ショット アクチエンゲゼルシャフト 高周波用途のためのガラス材料
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US7321181B2 (en) * 2004-04-07 2008-01-22 The Board Of Trustees Of The Leland Stanford Junior University Capacitive membrane ultrasonic transducers with reduced bulk wave generation and method
US7545075B2 (en) * 2004-06-04 2009-06-09 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
EP1779784B1 (en) * 2004-06-07 2015-10-14 Olympus Corporation Electrostatic capacity type ultrasonic transducer
KR100618287B1 (ko) * 2004-08-24 2006-08-31 삼신이노텍 주식회사 블루투스를 이용한 펜타입의 휴대용 무선통신 단말기
ITRM20050093A1 (it) * 2005-03-04 2006-09-05 Consiglio Nazionale Ricerche Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato.
JP2008545501A (ja) * 2005-06-07 2008-12-18 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 超音波センサ組立体に対するバッキングブロック
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
JP4804961B2 (ja) * 2006-03-03 2011-11-02 オリンパスメディカルシステムズ株式会社 超音波振動子及びそれを搭載した体腔内超音波診断装置
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
WO2009154091A1 (ja) * 2008-06-17 2009-12-23 株式会社日立製作所 半導体装置の製造方法

Also Published As

Publication number Publication date
ES2416182T3 (es) 2013-07-30
JP2012521704A (ja) 2012-09-13
US20120074509A1 (en) 2012-03-29
EP2659987A1 (en) 2013-11-06
EP2669019A1 (en) 2013-12-04
JP5744002B2 (ja) 2015-07-01
CN102427890A (zh) 2012-04-25
EP2411163A2 (en) 2012-02-01
WO2010109205A2 (en) 2010-09-30
EP2662153A1 (en) 2013-11-13
WO2010109205A3 (en) 2011-03-03
EP2411163B1 (en) 2013-05-15

Similar Documents

Publication Publication Date Title
DK2411163T3 (da) Waferbundet cmut-array med ledende kontakthuller
EP2494594A4 (en) SEMICONDUCTOR DEVICE
EP2477238A4 (en) SEMICONDUCTOR LUMINESCENT ELEMENT
EP2442355A4 (en) SEMICONDUCTOR DEVICE
BRPI1006760A2 (pt) montagem
DK2411442T4 (da) Umættet polyesterresin
DE112010004215A5 (de) Hydrostataktor
FI20105379A0 (fi) Liitinyksikkö
DK2430035T3 (da) Uracylspipooxetannukleosider
BRPI1008827A2 (pt) deisobutenizador
DK2442771T3 (da) Silikone-arbehandlingspræparat
EP2433729A4 (en) Chuck device
BR112012008158A2 (pt) substrato de dispositivo
BRPI1014968A2 (pt) subalargador
DE112010002728A5 (de) Turboinhalator
DE112010004249A5 (de) Spindelaktor
BRPI1009303A2 (pt) elastômero para união de substrato
DE112009005323A5 (de) Hebelarmprüfmaschine
BR112012004964A2 (pt) girocóptero
BRPI1008070A2 (pt) tricianoboratos
FI20095459A0 (fi) Uusia määritysmenetelmiä
DK2483126T3 (da) Skinnekøretøj
DE112010004865T8 (de) Lamellennassreibkupplung
EP2434544A4 (en) Integrated circuit
DE112010003255A5 (de) Fördergutverteiler