JP2016518739A5 - - Google Patents
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- JP2016518739A5 JP2016518739A5 JP2016501996A JP2016501996A JP2016518739A5 JP 2016518739 A5 JP2016518739 A5 JP 2016518739A5 JP 2016501996 A JP2016501996 A JP 2016501996A JP 2016501996 A JP2016501996 A JP 2016501996A JP 2016518739 A5 JP2016518739 A5 JP 2016518739A5
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- conductive layer
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361794744P | 2013-03-15 | 2013-03-15 | |
| US61/794,744 | 2013-03-15 | ||
| PCT/US2014/025924 WO2014151525A2 (en) | 2013-03-15 | 2014-03-13 | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017203056A Division JP6553695B2 (ja) | 2013-03-15 | 2017-10-20 | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016518739A JP2016518739A (ja) | 2016-06-23 |
| JP2016518739A5 true JP2016518739A5 (https=) | 2017-04-20 |
| JP6232124B2 JP6232124B2 (ja) | 2017-11-15 |
Family
ID=50549454
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016501996A Active JP6232124B2 (ja) | 2013-03-15 | 2014-03-13 | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
| JP2017203056A Active JP6553695B2 (ja) | 2013-03-15 | 2017-10-20 | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017203056A Active JP6553695B2 (ja) | 2013-03-15 | 2017-10-20 | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (8) | US9242275B2 (https=) |
| EP (3) | EP2969914B1 (https=) |
| JP (2) | JP6232124B2 (https=) |
| KR (1) | KR102170559B1 (https=) |
| CN (1) | CN105307975B (https=) |
| AU (2) | AU2014234071B2 (https=) |
| CA (1) | CA2905040C (https=) |
| TW (2) | TWI623081B (https=) |
| WO (1) | WO2014151525A2 (https=) |
Families Citing this family (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10006996B2 (en) * | 2011-03-14 | 2018-06-26 | Nokia Technologies Oy | Echolocation apparatus |
| US9533873B2 (en) | 2013-02-05 | 2017-01-03 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| WO2014151525A2 (en) | 2013-03-15 | 2014-09-25 | Butterfly Network, Inc. | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
| CN109954646B (zh) | 2013-03-15 | 2021-04-27 | 蝴蝶网络有限公司 | 超声装置 |
| US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
| AU2014293274B2 (en) | 2013-07-23 | 2018-11-01 | Butterfly Network, Inc. | Interconnectable ultrasound transducer probes and related methods and apparatus |
| CA2946120C (en) | 2014-04-18 | 2022-10-25 | Butterfly Network, Inc. | Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods |
| EP3132281B1 (en) | 2014-04-18 | 2019-10-30 | Butterfly Network Inc. | Ultrasonic imaging compression methods and apparatus |
| CA2946133A1 (en) | 2014-04-18 | 2015-10-22 | Butterfly Network, Inc. | Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| KR102373132B1 (ko) * | 2014-12-26 | 2022-03-11 | 삼성메디슨 주식회사 | 초음파 프로브 장치 및 초음파 촬영 장치 |
| US10098539B2 (en) | 2015-02-10 | 2018-10-16 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-invasive brain stimulation with ultrasound |
| CN104777483B (zh) * | 2015-04-17 | 2017-09-29 | 业成光电（深圳）有限公司 | 高解析触觉感测装置 |
| CN107673303B (zh) * | 2015-05-15 | 2019-08-09 | 风起科技股份有限公司 | 支撑柱、微型集音器、cmos麦克风单晶片 |
| WO2017001636A1 (en) | 2015-06-30 | 2017-01-05 | Koninklijke Philips N.V. | Ultrasound system and ultrasonic pulse transmission method |
| WO2017004562A1 (en) * | 2015-07-01 | 2017-01-05 | The Trustees Of Columbia University In The City Of New York | Systems and methods for modulation and mapping of brain tissue using an ultrasound assembly |
| WO2017040973A1 (en) | 2015-09-04 | 2017-03-09 | The Trustees Of Columbia University In The City Of New York | Micron-scale ultrasound identification sensing tags |
| US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| WO2017171988A2 (en) | 2016-01-21 | 2017-10-05 | The Trustees Of Columbia University In The City Of New York | Micron-scale active complementary metal-oxide-semiconductor (cmos) optical tags |
| WO2017161220A1 (en) * | 2016-03-17 | 2017-09-21 | Cornell University | Transmit-receive delay element apparatus, method, and applications |
| US9778348B1 (en) | 2016-03-31 | 2017-10-03 | Butterfly Network, Inc. | Symmetric receiver switch for bipolar pulser |
| US10082565B2 (en) * | 2016-03-31 | 2018-09-25 | Butterfly Network, Inc. | Multilevel bipolar pulser |
| US10856840B2 (en) | 2016-06-20 | 2020-12-08 | Butterfly Network, Inc. | Universal ultrasound device and related apparatus and methods |
| CN113857023B (zh) | 2016-06-20 | 2022-08-02 | 蝴蝶网络有限公司 | 用于微加工超声换能器的电接触布置 |
| US11712221B2 (en) | 2016-06-20 | 2023-08-01 | Bfly Operations, Inc. | Universal ultrasound device and related apparatus and methods |
| EP3490438A4 (en) | 2016-07-27 | 2020-03-18 | The Trustees of Columbia University in the City of New York | METHODS AND SYSTEMS FOR PERIPHERAL NERVOUS MODULATION WITH FOCUSED ULTRASOUND |
| US11020617B2 (en) | 2016-07-27 | 2021-06-01 | The Trustees Of Columbia University In The City Of New York | Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring |
| EP3279630B1 (en) * | 2016-08-03 | 2019-06-26 | ams AG | Pressure sensor module |
| CN115714130A (zh) * | 2016-12-05 | 2023-02-24 | 环球晶圆股份有限公司 | 高电阻率绝缘体上硅结构及其制造方法 |
| CN110325293B (zh) * | 2016-12-22 | 2021-06-22 | 皇家飞利浦有限公司 | 电容式射频微机电开关的系统和操作方法 |
| US20180180724A1 (en) * | 2016-12-26 | 2018-06-28 | Nxp Usa, Inc. | Ultrasonic transducer integrated with supporting electronics |
| DE102017102545B4 (de) * | 2017-02-09 | 2018-12-20 | Infineon Technologies Ag | Halbleitervorrichtung, Drucksensor, Mikrofon, Beschleunigungssensor und Verfahren zum Bilden einer Halbleitervorrichtung |
| EP3586093A4 (en) | 2017-02-27 | 2021-01-06 | Butterfly Network, Inc. | CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US11531096B2 (en) | 2017-03-23 | 2022-12-20 | Vave Health, Inc. | High performance handheld ultrasound |
| US10469846B2 (en) | 2017-03-27 | 2019-11-05 | Vave Health, Inc. | Dynamic range compression of ultrasound images |
| US10856843B2 (en) | 2017-03-23 | 2020-12-08 | Vave Health, Inc. | Flag table based beamforming in a handheld ultrasound device |
| US11446003B2 (en) | 2017-03-27 | 2022-09-20 | Vave Health, Inc. | High performance handheld ultrasound |
| WO2018178772A2 (en) * | 2017-03-28 | 2018-10-04 | Nanofone Ltd. | High performance sealed-gap capacitive microphone |
| EP3642611B1 (en) | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| WO2018237267A1 (en) | 2017-06-23 | 2018-12-27 | Butterfly Network, Inc. | Differential ultrasonic transducer element for ultrasound devices |
| JP2021502846A (ja) * | 2017-11-15 | 2021-02-04 | バタフライ ネットワーク，インコーポレイテッド | 超音波装置および超音波デバイスを製造するための方法 |
| KR102658983B1 (ko) * | 2017-12-21 | 2024-04-18 | 제네럴 일렉트릭 컴퍼니 | 초음파 변환기 및 초음파 프로브 제조 방법 |
| FR3076292B1 (fr) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de transfert d'une couche utile sur un substrat support |
| EP3745961B1 (en) | 2018-01-30 | 2025-10-01 | BFLY Operations, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| US11590532B2 (en) | 2018-03-09 | 2023-02-28 | Bfly Operations, Inc. | Ultrasound transducer devices and methods for fabricating ultrasound transducer devices |
| EP3788798B1 (en) | 2018-05-03 | 2023-07-05 | BFLY Operations, Inc. | Ultrasonic transducers with pressure ports |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| JP2021529459A (ja) | 2018-07-06 | 2021-10-28 | バタフライ ネットワーク，インコーポレイテッド | 超音波オンチップをパッケージングする方法及び装置 |
| IT201800007442A1 (it) * | 2018-07-23 | 2020-01-23 | Procedimento di fabbricazione di dispositivi microelettromeccanici, in particolare moduli elettroacustici | |
| WO2020069252A1 (en) * | 2018-09-28 | 2020-04-02 | Butterfly Network, Inc. | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
| CN109561876A (zh) * | 2018-10-24 | 2019-04-02 | 深圳市汇顶科技股份有限公司 | 超声换能器及其制造方法 |
| US11571711B2 (en) | 2018-11-15 | 2023-02-07 | Bfly Operations, Inc. | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices |
| JP7688911B2 (ja) | 2018-11-16 | 2025-06-05 | ヴァーモン エス．エー． | 容量性微細加工超音波トランスデューサ及びその製造方法 |
| US11851325B2 (en) * | 2018-11-30 | 2023-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for wafer bonding |
| AU2019392906A1 (en) | 2018-12-07 | 2021-07-22 | Octant, Inc. | Systems for protein-protein interaction screening |
| KR102196437B1 (ko) * | 2019-01-29 | 2020-12-30 | 한국과학기술연구원 | 정전용량형 미세가공 초음파 트랜스듀서 |
| WO2020163595A1 (en) * | 2019-02-07 | 2020-08-13 | Butterfly Network, Inc | Bi-layer metal electrode for micromachined ultrasonic transducer devices |
| WO2020176149A1 (en) * | 2019-02-25 | 2020-09-03 | Butterfly Network, Inc. | Adaptive cavity thickness control for micromachined ultrasonic transducer devices |
| US11484911B2 (en) | 2019-04-12 | 2022-11-01 | Bfly Operations, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
| US12515240B2 (en) | 2019-04-12 | 2026-01-06 | Bfly Operations, Inc. | Segmented getter openings for micromachined ultrasound transducer devices |
| US11501562B2 (en) | 2019-04-30 | 2022-11-15 | Bfly Operations, Inc. | Ultrasound face scanning and identification apparatuses and methods |
| WO2020251915A1 (en) * | 2019-06-10 | 2020-12-17 | Butterfly Network, Inc. | Curved micromachined ultrasonic transducer membranes |
| US12588895B2 (en) | 2019-06-13 | 2026-03-31 | The Trustees Of Columbia University In The City Of New York | System, method, computer-accessible medium and apparatus for flexible two-dimensional ultrasound phased array |
| US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| CN114401798B (zh) * | 2019-08-30 | 2024-03-26 | 维蒙股份公司 | 具有止动结构的cmut换能器及cmut换能器形成方法 |
| US11921240B2 (en) | 2019-09-19 | 2024-03-05 | Bfly Operations, Inc. | Symmetric receiver switch for ultrasound devices |
| JP2022550129A (ja) | 2019-09-27 | 2022-11-30 | ビーエフエルワイ オペレーションズ，インコーポレイテッド | 胎児心音及び子宮収縮信号を監視するための方法及び装置 |
| US11387919B2 (en) * | 2019-10-01 | 2022-07-12 | Texas Instruments Incorporated | High frequency CMOS ultrasonic transducer |
| US11145547B2 (en) * | 2019-10-01 | 2021-10-12 | Qorvo Us, Inc. | Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same |
| US11988640B2 (en) | 2020-03-11 | 2024-05-21 | Bfly Operations, Inc. | Bottom electrode material stack for micromachined ultrasonic transducer devices |
| TW202210830A (zh) | 2020-04-16 | 2022-03-16 | 美商蝴蝶網路公司 | 用於超音波裝置中之電路系統及/或換能器之內建自測試的方法和電路系統 |
| US20210403321A1 (en) * | 2020-06-30 | 2021-12-30 | Butterfly Network, Inc. | Formation of self-assembled monolayer for ultrasonic transducers |
| US11808897B2 (en) | 2020-10-05 | 2023-11-07 | Bfly Operations, Inc. | Methods and apparatuses for azimuthal summing of ultrasound data |
| FR3115278B1 (fr) | 2020-10-16 | 2024-02-16 | Soitec Silicon On Insulator | Procédé de transfert d’une membrane |
| CN112517361B (zh) * | 2020-11-30 | 2022-06-03 | 国网山西省电力公司朔州供电公司 | 一种高灵敏多频段复合式空耦超声换能器及其制备方法 |
| CN112718437B (zh) * | 2020-12-16 | 2022-01-14 | 武汉大学 | 基于多振膜耦合的压电微机械超声换能器 |
| US12246348B2 (en) | 2021-03-04 | 2025-03-11 | BFLY Operations, Inc | Capacitive Micromachined ultrasonic transducers (CMUTs) having non-uniform pedestals |
| TW202240165A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有柱腳的微加工超音波換能器 |
| WO2022212671A1 (en) | 2021-04-01 | 2022-10-06 | Bfly Operations, Inc. | Apparatuses and methods for configuring ultrasound devices |
| IT202100019718A1 (it) | 2021-07-23 | 2023-01-23 | St Microelectronics Srl | Procedimento perfezionato di fabbricazione di moduli elettroacustici |
| US12491536B2 (en) * | 2021-07-30 | 2025-12-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacturing same |
| CN113560158B (zh) * | 2021-08-27 | 2022-06-10 | 南京声息芯影科技有限公司 | 压电微机械超声换能器、阵列芯片及制造方法 |
| EP4406028A4 (en) * | 2021-09-23 | 2025-10-01 | Sensonics Transducers Private Ltd | LOW VOLTAGE CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER |
| US12284480B2 (en) | 2022-12-14 | 2025-04-22 | Stmicroelectronics International N.V. | Transducer assembly with buried cavities and method of manufacturing the same |
| US20250100014A1 (en) * | 2023-09-27 | 2025-03-27 | GE Precision Healthcare LLC | Method and system for providing a reliable isolation stack in capacitive micromachined ultrasonic transducers |
| WO2026049964A1 (en) * | 2024-08-26 | 2026-03-05 | Qorvo Us, Inc. | Wafer-level chip-scale packaging capacitive mems sensor |
Family Cites Families (119)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5286671A (en) | 1993-05-07 | 1994-02-15 | Kulite Semiconductor Products, Inc. | Fusion bonding technique for use in fabricating semiconductor devices |
| US6645145B1 (en) | 1998-11-19 | 2003-11-11 | Siemens Medical Solutions Usa, Inc. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
| US6430109B1 (en) | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US7541214B2 (en) | 1999-12-15 | 2009-06-02 | Chang-Feng Wan | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
| US6443901B1 (en) | 2000-06-15 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers |
| US6694817B2 (en) | 2001-08-21 | 2004-02-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
| US6779387B2 (en) | 2001-08-21 | 2004-08-24 | Georgia Tech Research Corporation | Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument |
| US6795374B2 (en) | 2001-09-07 | 2004-09-21 | Siemens Medical Solutions Usa, Inc. | Bias control of electrostatic transducers |
| US6659954B2 (en) | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
| US7429495B2 (en) | 2002-08-07 | 2008-09-30 | Chang-Feng Wan | System and method of fabricating micro cavities |
| US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| US6831394B2 (en) | 2002-12-11 | 2004-12-14 | General Electric Company | Backing material for micromachined ultrasonic transducer devices |
| US7312440B2 (en) | 2003-01-14 | 2007-12-25 | Georgia Tech Research Corporation | Integrated micro fuel processor and flow delivery infrastructure |
| US7208727B2 (en) | 2003-01-14 | 2007-04-24 | Georgia Tech Research Corporation | Electrospray systems and methods |
| US7257051B2 (en) | 2003-03-06 | 2007-08-14 | General Electric Company | Integrated interface electronics for reconfigurable sensor array |
| US7313053B2 (en) | 2003-03-06 | 2007-12-25 | General Electric Company | Method and apparatus for controlling scanning of mosaic sensor array |
| US6865140B2 (en) | 2003-03-06 | 2005-03-08 | General Electric Company | Mosaic arrays using micromachined ultrasound transducers |
| US20050075572A1 (en) * | 2003-10-01 | 2005-04-07 | Mills David M. | Focusing micromachined ultrasonic transducer arrays and related methods of manufacture |
| US7247246B2 (en) | 2003-10-20 | 2007-07-24 | Atmel Corporation | Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity |
| US20050121734A1 (en) | 2003-11-07 | 2005-06-09 | Georgia Tech Research Corporation | Combination catheter devices, methods, and systems |
| US7030536B2 (en) | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
| US7125383B2 (en) | 2003-12-30 | 2006-10-24 | General Electric Company | Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring |
| US7285897B2 (en) | 2003-12-31 | 2007-10-23 | General Electric Company | Curved micromachined ultrasonic transducer arrays and related methods of manufacture |
| US7052464B2 (en) | 2004-01-01 | 2006-05-30 | General Electric Company | Alignment method for fabrication of integrated ultrasonic transducer array |
| US7104129B2 (en) | 2004-02-02 | 2006-09-12 | Invensense Inc. | Vertically integrated MEMS structure with electronics in a hermetically sealed cavity |
| EP1713399A4 (en) | 2004-02-06 | 2010-08-11 | Georgia Tech Res Inst | CMUT DEVICES AND MANUFACTURING METHOD |
| US7646133B2 (en) | 2004-02-27 | 2010-01-12 | Georgia Tech Research Corporation | Asymmetric membrane cMUT devices and fabrication methods |
| WO2005084284A2 (en) | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Multiple element electrode cmut devices and fabrication methods |
| WO2005084267A2 (en) | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Harmonic cmut devices and fabrication methods |
| US7530952B2 (en) | 2004-04-01 | 2009-05-12 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive ultrasonic transducers with isolation posts |
| JP4280198B2 (ja) | 2004-04-30 | 2009-06-17 | 株式会社東芝 | 薄膜圧電共振器 |
| DE102004022838A1 (de) | 2004-05-08 | 2005-12-01 | Forschungszentrum Karlsruhe Gmbh | Ultraschallwandler sowie Verfahren zur Herstellung desselben |
| US8658453B2 (en) | 2004-09-15 | 2014-02-25 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer |
| US8309428B2 (en) | 2004-09-15 | 2012-11-13 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer |
| US7888709B2 (en) | 2004-09-15 | 2011-02-15 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer and manufacturing method |
| US7489593B2 (en) | 2004-11-30 | 2009-02-10 | Vermon | Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor |
| US7375420B2 (en) | 2004-12-03 | 2008-05-20 | General Electric Company | Large area transducer array |
| US7518251B2 (en) | 2004-12-03 | 2009-04-14 | General Electric Company | Stacked electronics for sensors |
| US7037746B1 (en) | 2004-12-27 | 2006-05-02 | General Electric Company | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane |
| JP4471856B2 (ja) * | 2005-01-27 | 2010-06-02 | 株式会社日立製作所 | 超音波トランスデューサおよびその製造方法 |
| US7449821B2 (en) | 2005-03-02 | 2008-11-11 | Research Triangle Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
| US7442570B2 (en) | 2005-03-18 | 2008-10-28 | Invensence Inc. | Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom |
| US7250353B2 (en) | 2005-03-29 | 2007-07-31 | Invensense, Inc. | Method and system of releasing a MEMS structure |
| US7704743B2 (en) | 2005-03-30 | 2010-04-27 | Georgia Tech Research Corporation | Electrosonic cell manipulation device and method of use thereof |
| US7538401B2 (en) | 2005-05-03 | 2009-05-26 | Rosemount Aerospace Inc. | Transducer for use in harsh environments |
| CA2607918A1 (en) | 2005-05-18 | 2006-11-23 | Kolo Technologies, Inc. | Micro-electro-mechanical transducers |
| US8105941B2 (en) | 2005-05-18 | 2012-01-31 | Kolo Technologies, Inc. | Through-wafer interconnection |
| US7637149B2 (en) | 2005-06-17 | 2009-12-29 | Georgia Tech Research Corporation | Integrated displacement sensors for probe microscopy and force spectroscopy |
| EP1907133A4 (en) | 2005-06-17 | 2012-05-09 | Kolo Technologies Inc | MICRO-ELECTRIC MECHANICAL CONVERTER WITH INSULATING EXTENSION |
| US7880565B2 (en) | 2005-08-03 | 2011-02-01 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
| US7564172B1 (en) | 2005-08-03 | 2009-07-21 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having embedded springs |
| US7878977B2 (en) | 2005-09-30 | 2011-02-01 | Siemens Medical Solutions Usa, Inc. | Flexible ultrasound transducer array |
| US7441447B2 (en) | 2005-10-07 | 2008-10-28 | Georgia Tech Research Corporation | Methods of imaging in probe microscopy |
| US7622848B2 (en) | 2006-01-06 | 2009-11-24 | General Electric Company | Transducer assembly with z-axis interconnect |
| US20070180916A1 (en) * | 2006-02-09 | 2007-08-09 | General Electric Company | Capacitive micromachined ultrasound transducer and methods of making the same |
| JP2007210083A (ja) | 2006-02-13 | 2007-08-23 | Hitachi Ltd | Ｍｅｍｓ素子及びその製造方法 |
| US7615834B2 (en) * | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
| US7956510B2 (en) | 2006-04-04 | 2011-06-07 | Kolo Technologies, Inc. | Modulation in micromachined ultrasonic transducers |
| US7910385B2 (en) | 2006-05-12 | 2011-03-22 | Micron Technology, Inc. | Method of fabricating microelectronic devices |
| US7451651B2 (en) | 2006-12-11 | 2008-11-18 | General Electric Company | Modular sensor assembly and methods of fabricating the same |
| US7687976B2 (en) | 2007-01-31 | 2010-03-30 | General Electric Company | Ultrasound imaging system |
| US7892176B2 (en) | 2007-05-02 | 2011-02-22 | General Electric Company | Monitoring or imaging system with interconnect structure for large area sensor array |
| US20080296708A1 (en) * | 2007-05-31 | 2008-12-04 | General Electric Company | Integrated sensor arrays and method for making and using such arrays |
| US8203912B2 (en) | 2007-07-31 | 2012-06-19 | Koninklijke Philips Electronics N.V. | CMUTs with a high-k dielectric |
| US8277380B2 (en) | 2007-09-11 | 2012-10-02 | Siemens Medical Solutions Usa, Inc. | Piezoelectric and CMUT layered ultrasound transducer array |
| CN101969856B (zh) | 2007-09-17 | 2013-06-05 | 皇家飞利浦电子股份有限公司 | 预塌陷的电容微机械超声传感器的制造及其应用 |
| US7843022B2 (en) * | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
| US7745248B2 (en) | 2007-10-18 | 2010-06-29 | The Board Of Trustees Of The Leland Stanford Junior University | Fabrication of capacitive micromachined ultrasonic transducers by local oxidation |
| US7786584B2 (en) | 2007-11-26 | 2010-08-31 | Infineon Technologies Ag | Through substrate via semiconductor components |
| US8559274B2 (en) | 2007-12-03 | 2013-10-15 | Kolo Technologies, Inc. | Dual-mode operation micromachined ultrasonic transducer |
| CN101874312B (zh) | 2007-12-03 | 2014-06-11 | 科隆科技公司 | 微机械超声换能器中的可变工作电压 |
| CN101868981B (zh) | 2007-12-03 | 2014-05-07 | 科隆科技公司 | 叠层换能设备 |
| WO2009073743A1 (en) | 2007-12-03 | 2009-06-11 | Kolo Technologies Inc. | Capacitive micromachined ultrasonic transducer with voltage feedback |
| CN101874287B (zh) | 2007-12-03 | 2012-08-29 | 科隆科技公司 | 静电换能器及阵列中的贯穿晶片互连 |
| US8483014B2 (en) | 2007-12-03 | 2013-07-09 | Kolo Technologies, Inc. | Micromachined ultrasonic transducers |
| US7781238B2 (en) | 2007-12-06 | 2010-08-24 | Robert Gideon Wodnicki | Methods of making and using integrated and testable sensor array |
| US8614151B2 (en) | 2008-01-04 | 2013-12-24 | Micron Technology, Inc. | Method of etching a high aspect ratio contact |
| KR100878454B1 (ko) | 2008-02-28 | 2009-01-13 | (주)실리콘화일 | 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법 |
| AU2009243918A1 (en) | 2008-05-07 | 2009-11-12 | Signostics Limited | Docking system for medical diagnostic scanning using a handheld device |
| WO2009149721A1 (de) | 2008-06-09 | 2009-12-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Diodenbolometer und ein verfahren zur herstellung eines diodenbolometers |
| JP2009291514A (ja) | 2008-06-09 | 2009-12-17 | Canon Inc | 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ |
| US20100075481A1 (en) * | 2008-07-08 | 2010-03-25 | Xiao (Charles) Yang | Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes |
| US8796746B2 (en) | 2008-07-08 | 2014-08-05 | MCube Inc. | Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes |
| US7812418B2 (en) * | 2008-07-29 | 2010-10-12 | Fortemedia, Inc | Chip-scaled MEMS microphone package |
| US8431420B2 (en) | 2009-01-16 | 2013-04-30 | Hitachi Medical Corporation | Manufacturing method of ultrasonic probe and ultrasonic probe |
| GB2467776A (en) | 2009-02-13 | 2010-08-18 | Wolfson Microelectronics Plc | Integrated MEMS transducer and circuitry |
| US8402831B2 (en) * | 2009-03-05 | 2013-03-26 | The Board Of Trustees Of The Leland Standford Junior University | Monolithic integrated CMUTs fabricated by low-temperature wafer bonding |
| US8315125B2 (en) | 2009-03-18 | 2012-11-20 | Sonetics Ultrasound, Inc. | System and method for biasing CMUT elements |
| EP2669019A1 (en) | 2009-03-26 | 2013-12-04 | Norwegian University of Science and Technology (NTNU) | An acoustic damping structure for use in an ultrasound transducer |
| JP5317826B2 (ja) * | 2009-05-19 | 2013-10-16 | キヤノン株式会社 | 容量型機械電気変換素子の製造方法 |
| US8451693B2 (en) | 2009-08-25 | 2013-05-28 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducer having compliant post structure |
| US8345508B2 (en) | 2009-09-20 | 2013-01-01 | General Electric Company | Large area modular sensor array assembly and method for making the same |
| US8222065B1 (en) | 2009-10-02 | 2012-07-17 | National Semiconductor Corporation | Method and system for forming a capacitive micromachined ultrasonic transducer |
| US8563345B2 (en) | 2009-10-02 | 2013-10-22 | National Semiconductor Corporated | Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements |
| US8241931B1 (en) * | 2009-10-19 | 2012-08-14 | Analog Devices, Inc. | Method of forming MEMS device with weakened substrate |
| JP5404335B2 (ja) | 2009-11-17 | 2014-01-29 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
| US8587078B2 (en) | 2010-04-06 | 2013-11-19 | United Microelectronics Corp. | Integrated circuit and fabricating method thereof |
| US8647279B2 (en) | 2010-06-10 | 2014-02-11 | Siemens Medical Solutions Usa, Inc. | Volume mechanical transducer for medical diagnostic ultrasound |
| US8957564B1 (en) * | 2010-06-29 | 2015-02-17 | Silicon Light Machines Corporation | Microelectromechanical system megasonic transducer |
| JP5702966B2 (ja) | 2010-08-02 | 2015-04-15 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
| US8273610B2 (en) | 2010-11-18 | 2012-09-25 | Monolithic 3D Inc. | Method of constructing a semiconductor device and structure |
| JP5677016B2 (ja) * | 2010-10-15 | 2015-02-25 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
| US8754529B2 (en) | 2011-03-28 | 2014-06-17 | Miradia, Inc. | MEMS device with simplified electrical conducting paths |
| US8461655B2 (en) | 2011-03-31 | 2013-06-11 | Infineon Technologies Ag | Micromechanical sound transducer having a membrane support with tapered surface |
| US9242273B2 (en) | 2011-10-11 | 2016-01-26 | The Board Of Trustees Of The Leland Stanford Junior University | Method for operating CMUTs under high and varying pressure |
| EP2768396A2 (en) | 2011-10-17 | 2014-08-27 | Butterfly Network Inc. | Transmissive imaging and related apparatus and methods |
| US20130096433A1 (en) | 2011-10-18 | 2013-04-18 | The Regents Of The University Of Michigan | System and Method for Unattended Monitoring of Blood Flow |
| US20130161702A1 (en) | 2011-12-25 | 2013-06-27 | Kun-Lung Chen | Integrated mems device |
| KR101894393B1 (ko) | 2011-12-28 | 2018-09-04 | 삼성전자주식회사 | 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법 |
| KR101388141B1 (ko) | 2012-05-31 | 2014-04-23 | 전자부품연구원 | Ｃｍｏｓ 회로가 집적된 마이크로폰 및 그 제조방법 |
| US10217045B2 (en) | 2012-07-16 | 2019-02-26 | Cornell University | Computation devices and artificial neurons based on nanoelectromechanical systems |
| US8735199B2 (en) | 2012-08-22 | 2014-05-27 | Honeywell International Inc. | Methods for fabricating MEMS structures by etching sacrificial features embedded in glass |
| US8564076B1 (en) | 2013-01-30 | 2013-10-22 | Invensense, Inc. | Internal electrical contact for enclosed MEMS devices |
| US9533873B2 (en) | 2013-02-05 | 2017-01-03 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| WO2014151525A2 (en) | 2013-03-15 | 2014-09-25 | Butterfly Network, Inc. | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
| CA2946133A1 (en) | 2014-04-18 | 2015-10-22 | Butterfly Network, Inc. | Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US20160009544A1 (en) | 2015-03-02 | 2016-01-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| EP3642611B1 (en) | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
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2014
- 2014-03-13 WO PCT/US2014/025924 patent/WO2014151525A2/en not_active Ceased
- 2014-03-13 KR KR1020157029571A patent/KR102170559B1/ko active Active
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