CA2905040C - Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same - Google Patents

Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same Download PDF

Info

Publication number
CA2905040C
CA2905040C CA2905040A CA2905040A CA2905040C CA 2905040 C CA2905040 C CA 2905040C CA 2905040 A CA2905040 A CA 2905040A CA 2905040 A CA2905040 A CA 2905040A CA 2905040 C CA2905040 C CA 2905040C
Authority
CA
Canada
Prior art keywords
membrane
cavity
wafer
thickness
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2905040A
Other languages
English (en)
French (fr)
Other versions
CA2905040A1 (en
Inventor
Jonathan M. Rothberg
Keith G. Fife
Tyler S. Ralston
Gregory L. Charvat
Nevada J. Sanchez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Butterfly Network Inc
Original Assignee
Butterfly Network Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Butterfly Network Inc filed Critical Butterfly Network Inc
Publication of CA2905040A1 publication Critical patent/CA2905040A1/en
Application granted granted Critical
Publication of CA2905040C publication Critical patent/CA2905040C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0195—Transfer of a layer from a carrier wafer to a device wafer the layer being unstructured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B81C2203/0771—Stacking the electronic processing unit and the micromechanical structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Pressure Sensors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
CA2905040A 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same Active CA2905040C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361794744P 2013-03-15 2013-03-15
US61/794,744 2013-03-15
PCT/US2014/025924 WO2014151525A2 (en) 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same

Publications (2)

Publication Number Publication Date
CA2905040A1 CA2905040A1 (en) 2014-09-25
CA2905040C true CA2905040C (en) 2021-10-19

Family

ID=50549454

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2905040A Active CA2905040C (en) 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same

Country Status (9)

Country Link
US (8) US9242275B2 (https=)
EP (3) EP2969914B1 (https=)
JP (2) JP6232124B2 (https=)
KR (1) KR102170559B1 (https=)
CN (1) CN105307975B (https=)
AU (2) AU2014234071B2 (https=)
CA (1) CA2905040C (https=)
TW (2) TWI663706B (https=)
WO (1) WO2014151525A2 (https=)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10006996B2 (en) * 2011-03-14 2018-06-26 Nokia Technologies Oy Echolocation apparatus
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
JP6232124B2 (ja) 2013-03-15 2017-11-15 バタフライ ネットワーク，インコーポレイテッド 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
TWI682817B (zh) 2013-07-23 2020-01-21 美商蝴蝶網路公司 可互連的超音波換能器探頭以及相關的方法和設備
CN106461767B (zh) 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
CA2946137C (en) 2014-04-18 2022-08-09 Butterfly Network, Inc. Ultrasonic imaging compression methods and apparatus
KR102237662B1 (ko) 2014-04-18 2021-04-09 버터플라이 네트워크, 인크. 상보적 금속 산화물 반도체(ｃｍｏｓ) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
US10098539B2 (en) 2015-02-10 2018-10-16 The Trustees Of Columbia University In The City Of New York Systems and methods for non-invasive brain stimulation with ultrasound
CN104777483B (zh) * 2015-04-17 2017-09-29 业成光电（深圳）有限公司 高解析触觉感测装置
CN106145028B (zh) * 2015-05-15 2021-09-17 风泰仪器股份有限公司 支撑柱、微型集音器、cmos麦克风单晶片及制造方法
JP6925286B2 (ja) * 2015-06-30 2021-08-25 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波システム及び超音波パルス送信方法
WO2017004562A1 (en) * 2015-07-01 2017-01-05 The Trustees Of Columbia University In The City Of New York Systems and methods for modulation and mapping of brain tissue using an ultrasound assembly
WO2017040973A1 (en) 2015-09-04 2017-03-09 The Trustees Of Columbia University In The City Of New York Micron-scale ultrasound identification sensing tags
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
WO2017171988A2 (en) 2016-01-21 2017-10-05 The Trustees Of Columbia University In The City Of New York Micron-scale active complementary metal-oxide-semiconductor (cmos) optical tags
WO2017161220A1 (en) * 2016-03-17 2017-09-21 Cornell University Transmit-receive delay element apparatus, method, and applications
US10082565B2 (en) * 2016-03-31 2018-09-25 Butterfly Network, Inc. Multilevel bipolar pulser
US9778348B1 (en) 2016-03-31 2017-10-03 Butterfly Network, Inc. Symmetric receiver switch for bipolar pulser
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
US10856840B2 (en) * 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
TWI721183B (zh) 2016-06-20 2021-03-11 美商蝴蝶網路公司 用於微製造超音波傳感器的電接點配置
WO2018022902A1 (en) 2016-07-27 2018-02-01 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using focused ultrasound
US11020617B2 (en) 2016-07-27 2021-06-01 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring
EP3279630B1 (en) * 2016-08-03 2019-06-26 ams AG Pressure sensor module
US10468295B2 (en) * 2016-12-05 2019-11-05 GlobalWafers Co. Ltd. High resistivity silicon-on-insulator structure and method of manufacture thereof
CN110325293B (zh) * 2016-12-22 2021-06-22 皇家飞利浦有限公司 电容式射频微机电开关的系统和操作方法
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
DE102017102545B4 (de) * 2017-02-09 2018-12-20 Infineon Technologies Ag Halbleitervorrichtung, Drucksensor, Mikrofon, Beschleunigungssensor und Verfahren zum Bilden einer Halbleitervorrichtung
EP3586093A4 (en) 2017-02-27 2021-01-06 Butterfly Network, Inc. CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES
US10196261B2 (en) * 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
US10284963B2 (en) * 2017-03-28 2019-05-07 Nanofone Ltd. High performance sealed-gap capacitive microphone
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
EP3641954B1 (en) 2017-06-23 2024-04-10 BFLY Operations, Inc. Differential ultrasonic transducer element for ultrasound devices
EP3709894B1 (en) * 2017-11-15 2026-02-25 BFLY Operations, Inc. Ultrasound apparatuses and methods for fabricating ultrasound devices
KR102658983B1 (ko) * 2017-12-21 2024-04-18 제네럴 일렉트릭 컴퍼니 초음파 변환기 및 초음파 프로브 제조 방법
FR3076292B1 (fr) * 2017-12-28 2020-01-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de transfert d'une couche utile sur un substrat support
WO2019152340A1 (en) 2018-01-30 2019-08-08 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
EP3762155B1 (en) * 2018-03-09 2023-12-13 BFLY Operations, Inc. Methods for fabricating ultrasound transducer devices
CN112075090B (zh) 2018-05-03 2022-10-14 蝴蝶网络有限公司 用于cmos传感器上的超声换能器的压力端口
WO2019226958A1 (en) 2018-05-24 2019-11-28 The Research Foundation For The State University Of New York Capacitive sensor
CA3105492A1 (en) 2018-07-06 2020-01-09 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
IT201800007442A1 (it) * 2018-07-23 2020-01-23 Procedimento di fabbricazione di dispositivi microelettromeccanici, in particolare moduli elettroacustici
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
WO2020082256A1 (zh) * 2018-10-24 2020-04-30 深圳市汇顶科技股份有限公司 超声换能器及其制造方法
WO2020102492A1 (en) 2018-11-15 2020-05-22 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
JP7688911B2 (ja) 2018-11-16 2025-06-05 ヴァーモン エス．エー． 容量性微細加工超音波トランスデューサ及びその製造方法
US11851325B2 (en) * 2018-11-30 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for wafer bonding
AU2019392906A1 (en) 2018-12-07 2021-07-22 Octant, Inc. Systems for protein-protein interaction screening
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
US11583894B2 (en) 2019-02-25 2023-02-21 Bfly Operations, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
CN114555248A (zh) 2019-04-12 2022-05-27 布弗莱运营公司 用于微加工超声换能器器件的分段式吸气剂开口
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
US11383269B2 (en) 2019-06-10 2022-07-12 Bfly Operations, Inc. Curved micromachined ultrasonic transducer membranes
US12588895B2 (en) 2019-06-13 2026-03-31 The Trustees Of Columbia University In The City Of New York System, method, computer-accessible medium and apparatus for flexible two-dimensional ultrasound phased array
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US12145838B2 (en) * 2019-08-30 2024-11-19 Vermon Sa CMUT transducer with motion-stopping structure and CMUT transducer forming method
US11921240B2 (en) 2019-09-19 2024-03-05 Bfly Operations, Inc. Symmetric receiver switch for ultrasound devices
CA3155022A1 (en) 2019-09-27 2021-04-01 Nevada J. Sanchez Methods and apparatuses for monitoring fetal heartbeat and uterine contraction signals
US11145547B2 (en) * 2019-10-01 2021-10-12 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US11387919B2 (en) 2019-10-01 2022-07-12 Texas Instruments Incorporated High frequency CMOS ultrasonic transducer
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
US20210328564A1 (en) 2020-04-16 2021-10-21 Butterfly Network, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
US20210403321A1 (en) * 2020-06-30 2021-12-30 Butterfly Network, Inc. Formation of self-assembled monolayer for ultrasonic transducers
US11808897B2 (en) 2020-10-05 2023-11-07 Bfly Operations, Inc. Methods and apparatuses for azimuthal summing of ultrasound data
FR3115278B1 (fr) 2020-10-16 2024-02-16 Soitec Silicon On Insulator Procédé de transfert d’une membrane
CN112517361B (zh) * 2020-11-30 2022-06-03 国网山西省电力公司朔州供电公司 一种高灵敏多频段复合式空耦超声换能器及其制备方法
CN112718437B (zh) * 2020-12-16 2022-01-14 武汉大学 基于多振膜耦合的压电微机械超声换能器
TW202240165A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有柱腳的微加工超音波換能器
TW202239483A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有不均勻柱腳的電容式微加工超音波換能器
WO2022212671A1 (en) 2021-04-01 2022-10-06 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
IT202100019718A1 (it) 2021-07-23 2023-01-23 St Microelectronics Srl Procedimento perfezionato di fabbricazione di moduli elettroacustici
US12491536B2 (en) * 2021-07-30 2025-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing same
CN113560158B (zh) * 2021-08-27 2022-06-10 南京声息芯影科技有限公司 压电微机械超声换能器、阵列芯片及制造方法
US20240425365A1 (en) 2021-09-23 2024-12-26 Sensonics Transducers Private Limited Low voltage capacitive micromachined ultrasonic transducer (cmut) design and manufacturing flow
US12284480B2 (en) 2022-12-14 2025-04-22 Stmicroelectronics International N.V. Transducer assembly with buried cavities and method of manufacturing the same
US20250100014A1 (en) * 2023-09-27 2025-03-27 GE Precision Healthcare LLC Method and system for providing a reliable isolation stack in capacitive micromachined ultrasonic transducers
WO2026049964A1 (en) * 2024-08-26 2026-03-05 Qorvo Us, Inc. Wafer-level chip-scale packaging capacitive mems sensor

Family Cites Families (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286671A (en) 1993-05-07 1994-02-15 Kulite Semiconductor Products, Inc. Fusion bonding technique for use in fabricating semiconductor devices
US6645145B1 (en) 1998-11-19 2003-11-11 Siemens Medical Solutions Usa, Inc. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US7541214B2 (en) 1999-12-15 2009-06-02 Chang-Feng Wan Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
US6443901B1 (en) 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6779387B2 (en) 2001-08-21 2004-08-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6694817B2 (en) 2001-08-21 2004-02-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6795374B2 (en) 2001-09-07 2004-09-21 Siemens Medical Solutions Usa, Inc. Bias control of electrostatic transducers
US6659954B2 (en) 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7429495B2 (en) 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7312440B2 (en) 2003-01-14 2007-12-25 Georgia Tech Research Corporation Integrated micro fuel processor and flow delivery infrastructure
US7208727B2 (en) 2003-01-14 2007-04-24 Georgia Tech Research Corporation Electrospray systems and methods
US7313053B2 (en) 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US6865140B2 (en) 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US20050075572A1 (en) * 2003-10-01 2005-04-07 Mills David M. Focusing micromachined ultrasonic transducer arrays and related methods of manufacture
US7247246B2 (en) 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
US20050121734A1 (en) 2003-11-07 2005-06-09 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7125383B2 (en) 2003-12-30 2006-10-24 General Electric Company Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
US7104129B2 (en) 2004-02-02 2006-09-12 Invensense Inc. Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
US20050177045A1 (en) 2004-02-06 2005-08-11 Georgia Tech Research Corporation cMUT devices and fabrication methods
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
WO2005084284A2 (en) 2004-02-27 2005-09-15 Georgia Tech Research Corporation Multiple element electrode cmut devices and fabrication methods
JP2007531357A (ja) 2004-02-27 2007-11-01 ジョージア テック リサーチ コーポレイション ハーモニックｃｍｕｔ素子及び製造方法
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
JP4280198B2 (ja) 2004-04-30 2009-06-17 株式会社東芝 薄膜圧電共振器
DE102004022838A1 (de) 2004-05-08 2005-12-01 Forschungszentrum Karlsruhe Gmbh Ultraschallwandler sowie Verfahren zur Herstellung desselben
US8658453B2 (en) 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US7518251B2 (en) 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7375420B2 (en) 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7037746B1 (en) 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
JP4471856B2 (ja) * 2005-01-27 2010-06-02 株式会社日立製作所 超音波トランスデューサおよびその製造方法
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7250353B2 (en) 2005-03-29 2007-07-31 Invensense, Inc. Method and system of releasing a MEMS structure
US7704743B2 (en) 2005-03-30 2010-04-27 Georgia Tech Research Corporation Electrosonic cell manipulation device and method of use thereof
US7538401B2 (en) * 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
WO2006123300A2 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
EP1883956A4 (en) 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
US7637149B2 (en) 2005-06-17 2009-12-29 Georgia Tech Research Corporation Integrated displacement sensors for probe microscopy and force spectroscopy
CN101558552B (zh) 2005-06-17 2017-05-31 科隆科技公司 具有绝缘延伸部的微机电换能器
US7612635B2 (en) 2005-08-03 2009-11-03 Kolo Technologies, Inc. MEMS acoustic filter and fabrication of the same
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7878977B2 (en) 2005-09-30 2011-02-01 Siemens Medical Solutions Usa, Inc. Flexible ultrasound transducer array
US7441447B2 (en) 2005-10-07 2008-10-28 Georgia Tech Research Corporation Methods of imaging in probe microscopy
US7622848B2 (en) 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
JP2007210083A (ja) 2006-02-13 2007-08-23 Hitachi Ltd Ｍｅｍｓ素子及びその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US7764003B2 (en) 2006-04-04 2010-07-27 Kolo Technologies, Inc. Signal control in micromachined ultrasonic transducer
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080296708A1 (en) 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
US8203912B2 (en) 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US8277380B2 (en) 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
US8327521B2 (en) 2007-09-17 2012-12-11 Koninklijke Philips Electronics N.V. Method for production and using a capacitive micro-machined ultrasonic transducer
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7786584B2 (en) 2007-11-26 2010-08-31 Infineon Technologies Ag Through substrate via semiconductor components
US8429808B2 (en) 2007-12-03 2013-04-30 Kolo Technologies, Inc. Method for fabrication an electrical transducer
CN101874312B (zh) 2007-12-03 2014-06-11 科隆科技公司 微机械超声换能器中的可变工作电压
US8483014B2 (en) 2007-12-03 2013-07-09 Kolo Technologies, Inc. Micromachined ultrasonic transducers
WO2009073562A1 (en) * 2007-12-03 2009-06-11 Kolo Technologies, Inc. Dual-mode operation micromachined ultrasonic transducer
WO2009073748A1 (en) 2007-12-03 2009-06-11 Kolo Technologies, Inc. Stacked transducing devices
EP2215855A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Capacitive micromachined ultrasonic transducer with voltage feedback
US7781238B2 (en) 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8614151B2 (en) 2008-01-04 2013-12-24 Micron Technology, Inc. Method of etching a high aspect ratio contact
KR100878454B1 (ko) 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
NZ589503A (en) 2008-05-07 2013-07-26 Signostics Ltd Docking system for medical diagnostic scanning using a handheld device
JP2009291514A (ja) 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
WO2009149721A1 (de) 2008-06-09 2009-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Diodenbolometer und ein verfahren zur herstellung eines diodenbolometers
US8796746B2 (en) 2008-07-08 2014-08-05 MCube Inc. Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
US20100075481A1 (en) * 2008-07-08 2010-03-25 Xiao (Charles) Yang Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes
US7812418B2 (en) * 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
US8431420B2 (en) 2009-01-16 2013-04-30 Hitachi Medical Corporation Manufacturing method of ultrasonic probe and ultrasonic probe
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
US8315125B2 (en) 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
ES2416182T3 (es) 2009-03-26 2013-07-30 Norwegian University Of Science And Technology (Ntnu) Matriz CMUT de unión de ondas con vías conductoras
JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
US8451693B2 (en) 2009-08-25 2013-05-28 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducer having compliant post structure
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8563345B2 (en) 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8222065B1 (en) 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
US8241931B1 (en) * 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate
JP5404335B2 (ja) 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8587078B2 (en) 2010-04-06 2013-11-19 United Microelectronics Corp. Integrated circuit and fabricating method thereof
US8647279B2 (en) 2010-06-10 2014-02-11 Siemens Medical Solutions Usa, Inc. Volume mechanical transducer for medical diagnostic ultrasound
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5702966B2 (ja) 2010-08-02 2015-04-15 キヤノン株式会社 電気機械変換装置及びその作製方法
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
US8754529B2 (en) 2011-03-28 2014-06-17 Miradia, Inc. MEMS device with simplified electrical conducting paths
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US9242273B2 (en) 2011-10-11 2016-01-26 The Board Of Trustees Of The Leland Stanford Junior University Method for operating CMUTs under high and varying pressure
HK1201429A1 (en) 2011-10-17 2015-09-04 Butterfly Network Inc. Transmissive imaging and related apparatus and methods
US20130096433A1 (en) 2011-10-18 2013-04-18 The Regents Of The University Of Michigan System and Method for Unattended Monitoring of Blood Flow
US20130161702A1 (en) 2011-12-25 2013-06-27 Kun-Lung Chen Integrated mems device
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
KR101388141B1 (ko) 2012-05-31 2014-04-23 전자부품연구원 Ｃｍｏｓ 회로가 집적된 마이크로폰 및 그 제조방법
US10217045B2 (en) 2012-07-16 2019-02-26 Cornell University Computation devices and artificial neurons based on nanoelectromechanical systems
US8735199B2 (en) 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
US8564076B1 (en) 2013-01-30 2013-10-22 Invensense, Inc. Internal electrical contact for enclosed MEMS devices
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
JP6232124B2 (ja) 2013-03-15 2017-11-15 バタフライ ネットワーク，インコーポレイテッド 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法
KR102237662B1 (ko) 2014-04-18 2021-04-09 버터플라이 네트워크, 인크. 상보적 금속 산화물 반도체(ｃｍｏｓ) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

Also Published As

Publication number Publication date
TWI623081B (zh) 2018-05-01
US9242275B2 (en) 2016-01-26
JP6553695B2 (ja) 2019-07-31
US20150084053A1 (en) 2015-03-26
TW201826495A (zh) 2018-07-16
US20170283254A1 (en) 2017-10-05
EP2969914B1 (en) 2020-01-01
AU2014234071A1 (en) 2015-10-15
US9061318B2 (en) 2015-06-23
EP2969914A2 (en) 2016-01-20
CN105307975A (zh) 2016-02-03
US9944514B2 (en) 2018-04-17
JP2018023165A (ja) 2018-02-08
EP4122609C0 (en) 2024-11-06
EP3639937A1 (en) 2020-04-22
US20150251896A1 (en) 2015-09-10
US9738514B2 (en) 2017-08-22
AU2018203942A1 (en) 2018-06-21
AU2014234071B2 (en) 2018-05-17
US9290375B2 (en) 2016-03-22
US20160207760A1 (en) 2016-07-21
US20180186628A1 (en) 2018-07-05
US20140264660A1 (en) 2014-09-18
EP4122609B1 (en) 2024-11-06
WO2014151525A2 (en) 2014-09-25
TW201501270A (zh) 2015-01-01
EP4122609A1 (en) 2023-01-25
US20170029271A1 (en) 2017-02-02
US10266401B2 (en) 2019-04-23
JP2016518739A (ja) 2016-06-23
WO2014151525A3 (en) 2015-04-09
CA2905040A1 (en) 2014-09-25
US10710873B2 (en) 2020-07-14
TWI663706B (zh) 2019-06-21
AU2018203942B2 (en) 2020-03-12
KR102170559B1 (ko) 2020-10-27
US9499395B2 (en) 2016-11-22
CN105307975B (zh) 2017-04-26
JP6232124B2 (ja) 2017-11-15
KR20150144750A (ko) 2015-12-28
US20190210869A1 (en) 2019-07-11

Similar Documents

Publication Publication Date Title
US10710873B2 (en) Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
US11684949B2 (en) CMOS ultrasonic transducers and related apparatus and methods

Legal Events

Date Code Title Description
EEER Examination request

Effective date: 20181120

MPN Maintenance fee for patent paid

Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 11TH ANNIV.) - STANDARD

Year of fee payment: 11

U00 Fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED

Effective date: 20250307

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT DETERMINED COMPLIANT

Effective date: 20250307