JP2021150518A5 - - Google Patents

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Publication number
JP2021150518A5
JP2021150518A5 JP2020049744A JP2020049744A JP2021150518A5 JP 2021150518 A5 JP2021150518 A5 JP 2021150518A5 JP 2020049744 A JP2020049744 A JP 2020049744A JP 2020049744 A JP2020049744 A JP 2020049744A JP 2021150518 A5 JP2021150518 A5 JP 2021150518A5
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JP
Japan
Prior art keywords
terminal
semiconductor device
exposed
parallel
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020049744A
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English (en)
Japanese (ja)
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JP7265502B2 (ja
JP2021150518A (ja
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Publication date
Priority claimed from JP2020049744A external-priority patent/JP7265502B2/ja
Priority to JP2020049744A priority Critical patent/JP7265502B2/ja
Application filed filed Critical
Priority to CN202010895058.2A priority patent/CN113496976B/zh
Priority to CN202210670342.9A priority patent/CN115050719B/zh
Priority to US17/020,435 priority patent/US11373937B2/en
Publication of JP2021150518A publication Critical patent/JP2021150518A/ja
Publication of JP2021150518A5 publication Critical patent/JP2021150518A5/ja
Priority to US17/824,877 priority patent/US11764132B2/en
Publication of JP7265502B2 publication Critical patent/JP7265502B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020049744A 2020-03-19 2020-03-19 半導体装置 Active JP7265502B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020049744A JP7265502B2 (ja) 2020-03-19 2020-03-19 半導体装置
CN202010895058.2A CN113496976B (zh) 2020-03-19 2020-08-31 半导体装置
CN202210670342.9A CN115050719B (zh) 2020-03-19 2020-08-31 半导体装置
US17/020,435 US11373937B2 (en) 2020-03-19 2020-09-14 Semiconductor device
US17/824,877 US11764132B2 (en) 2020-03-19 2022-05-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020049744A JP7265502B2 (ja) 2020-03-19 2020-03-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2021150518A JP2021150518A (ja) 2021-09-27
JP2021150518A5 true JP2021150518A5 (enExample) 2022-05-10
JP7265502B2 JP7265502B2 (ja) 2023-04-26

Family

ID=77748494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020049744A Active JP7265502B2 (ja) 2020-03-19 2020-03-19 半導体装置

Country Status (3)

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US (2) US11373937B2 (enExample)
JP (1) JP7265502B2 (enExample)
CN (2) CN115050719B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7265502B2 (ja) * 2020-03-19 2023-04-26 株式会社東芝 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968827A (ja) 1982-10-12 1984-04-18 Sony Corp 磁気転写用バイアス磁気ヘツド
JP4840893B2 (ja) * 2000-05-12 2011-12-21 大日本印刷株式会社 樹脂封止型半導体装置用フレーム
US6841854B2 (en) * 2002-04-01 2005-01-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device
JP2004363365A (ja) * 2003-06-05 2004-12-24 Renesas Technology Corp 半導体装置及びその製造方法
CN100490140C (zh) * 2003-07-15 2009-05-20 飞思卡尔半导体公司 双规引线框
JP4215814B2 (ja) * 2008-03-17 2009-01-28 三洋電機株式会社 半導体装置の製造方法
KR101657330B1 (ko) 2009-05-15 2016-09-13 로무 가부시키가이샤 반도체 장치
US8525305B1 (en) * 2010-06-29 2013-09-03 Eoplex Limited Lead carrier with print-formed package components
JP5968827B2 (ja) 2013-04-25 2016-08-10 アオイ電子株式会社 半導体パッケージおよびその製造方法
US10128434B2 (en) 2016-12-09 2018-11-13 Rohm Co., Ltd. Hall element module
JP6928463B2 (ja) 2016-12-09 2021-09-01 ローム株式会社 ホール素子モジュール
JP6283131B1 (ja) 2017-01-31 2018-02-21 株式会社加藤電器製作所 電子デバイス及び電子デバイスの製造方法
JP6842433B2 (ja) 2018-01-25 2021-03-17 株式会社加藤電器製作所 電子デバイス
JP7265502B2 (ja) * 2020-03-19 2023-04-26 株式会社東芝 半導体装置

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