JP2021061393A5 - - Google Patents

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Publication number
JP2021061393A5
JP2021061393A5 JP2020158041A JP2020158041A JP2021061393A5 JP 2021061393 A5 JP2021061393 A5 JP 2021061393A5 JP 2020158041 A JP2020158041 A JP 2020158041A JP 2020158041 A JP2020158041 A JP 2020158041A JP 2021061393 A5 JP2021061393 A5 JP 2021061393A5
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JP
Japan
Prior art keywords
wiring member
electrode
joining
joining member
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020158041A
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English (en)
Japanese (ja)
Other versions
JP2021061393A (ja
JP7111140B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to CN202080069629.5A priority Critical patent/CN114503255B/zh
Priority to CN202511095690.8A priority patent/CN120933255A/zh
Priority to PCT/JP2020/036372 priority patent/WO2021065736A1/ja
Publication of JP2021061393A publication Critical patent/JP2021061393A/ja
Publication of JP2021061393A5 publication Critical patent/JP2021061393A5/ja
Priority to US17/708,525 priority patent/US12315825B2/en
Application granted granted Critical
Publication of JP7111140B2 publication Critical patent/JP7111140B2/ja
Priority to US19/189,450 priority patent/US20250259946A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020158041A 2019-10-04 2020-09-22 半導体装置 Active JP7111140B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202080069629.5A CN114503255B (zh) 2019-10-04 2020-09-25 半导体装置
CN202511095690.8A CN120933255A (zh) 2019-10-04 2020-09-25 半导体装置
PCT/JP2020/036372 WO2021065736A1 (ja) 2019-10-04 2020-09-25 半導体装置
US17/708,525 US12315825B2 (en) 2019-10-04 2022-03-30 Semiconductor device having wire pieces in bonding member
US19/189,450 US20250259946A1 (en) 2019-10-04 2025-04-25 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019184066 2019-10-04
JP2019184066 2019-10-04

Publications (3)

Publication Number Publication Date
JP2021061393A JP2021061393A (ja) 2021-04-15
JP2021061393A5 true JP2021061393A5 (enExample) 2021-10-14
JP7111140B2 JP7111140B2 (ja) 2022-08-02

Family

ID=75381495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020158041A Active JP7111140B2 (ja) 2019-10-04 2020-09-22 半導体装置

Country Status (1)

Country Link
JP (1) JP7111140B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120356880A (zh) * 2021-08-09 2025-07-22 华为技术有限公司 一种功率模块、电源电路及芯片

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397234A (ja) * 1989-09-11 1991-04-23 Nec Corp 半導体ペレット搭載基板
JP2007311577A (ja) * 2006-05-18 2007-11-29 Rohm Co Ltd 半導体装置
JP2008153432A (ja) * 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置およびその製造方法
JP2012069703A (ja) * 2010-09-22 2012-04-05 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
JP2014112608A (ja) * 2012-12-05 2014-06-19 Denso Corp 半導体装置
CN109168320B (zh) * 2016-04-26 2022-04-01 三菱电机株式会社 半导体装置

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