JP2023127609A5 - - Google Patents

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Publication number
JP2023127609A5
JP2023127609A5 JP2022031382A JP2022031382A JP2023127609A5 JP 2023127609 A5 JP2023127609 A5 JP 2023127609A5 JP 2022031382 A JP2022031382 A JP 2022031382A JP 2022031382 A JP2022031382 A JP 2022031382A JP 2023127609 A5 JP2023127609 A5 JP 2023127609A5
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JP
Japan
Prior art keywords
semiconductor element
lead electrode
joined
electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022031382A
Other languages
English (en)
Japanese (ja)
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JP2023127609A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022031382A priority Critical patent/JP2023127609A/ja
Priority claimed from JP2022031382A external-priority patent/JP2023127609A/ja
Priority to US18/062,411 priority patent/US20230282541A1/en
Priority to DE102023104299.8A priority patent/DE102023104299A1/de
Priority to CN202310161259.3A priority patent/CN116705721A/zh
Publication of JP2023127609A publication Critical patent/JP2023127609A/ja
Publication of JP2023127609A5 publication Critical patent/JP2023127609A5/ja
Pending legal-status Critical Current

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JP2022031382A 2022-03-02 2022-03-02 半導体装置 Pending JP2023127609A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022031382A JP2023127609A (ja) 2022-03-02 2022-03-02 半導体装置
US18/062,411 US20230282541A1 (en) 2022-03-02 2022-12-06 Semiconductor device
DE102023104299.8A DE102023104299A1 (de) 2022-03-02 2023-02-22 Halbleitervorrichtung
CN202310161259.3A CN116705721A (zh) 2022-03-02 2023-02-24 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022031382A JP2023127609A (ja) 2022-03-02 2022-03-02 半導体装置

Publications (2)

Publication Number Publication Date
JP2023127609A JP2023127609A (ja) 2023-09-14
JP2023127609A5 true JP2023127609A5 (enExample) 2024-04-04

Family

ID=87572301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022031382A Pending JP2023127609A (ja) 2022-03-02 2022-03-02 半導体装置

Country Status (4)

Country Link
US (1) US20230282541A1 (enExample)
JP (1) JP2023127609A (enExample)
CN (1) CN116705721A (enExample)
DE (1) DE102023104299A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025154399A1 (ja) * 2024-01-17 2025-07-24 富士電機株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3514649B2 (ja) * 1999-01-27 2004-03-31 シャープ株式会社 フリップチップ接続構造および接続方法
JP5383717B2 (ja) * 2011-01-04 2014-01-08 三菱電機株式会社 半導体装置
JP2012191057A (ja) * 2011-03-11 2012-10-04 Mitsubishi Electric Corp 電力用半導体装置
JP2018026370A (ja) * 2014-11-13 2018-02-15 株式会社日立製作所 パワー半導体モジュール
JP2017059723A (ja) * 2015-09-17 2017-03-23 トヨタ自動車株式会社 半導体装置の製造方法
JP2017199829A (ja) * 2016-04-28 2017-11-02 日産自動車株式会社 パワーモジュール構造
CN113841235B (zh) * 2019-05-28 2024-05-24 三菱电机株式会社 半导体模块、半导体模块的制造方法以及电力变换装置
JP7023339B1 (ja) * 2020-11-04 2022-02-21 三菱電機株式会社 半導体装置

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