JPWO2023286531A5 - - Google Patents

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Publication number
JPWO2023286531A5
JPWO2023286531A5 JP2023535191A JP2023535191A JPWO2023286531A5 JP WO2023286531 A5 JPWO2023286531 A5 JP WO2023286531A5 JP 2023535191 A JP2023535191 A JP 2023535191A JP 2023535191 A JP2023535191 A JP 2023535191A JP WO2023286531 A5 JPWO2023286531 A5 JP WO2023286531A5
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JP
Japan
Prior art keywords
band
semiconductor device
shaped portion
thickness direction
virtual line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023535191A
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English (en)
Japanese (ja)
Other versions
JPWO2023286531A1 (enExample
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/024547 external-priority patent/WO2023286531A1/ja
Publication of JPWO2023286531A1 publication Critical patent/JPWO2023286531A1/ja
Publication of JPWO2023286531A5 publication Critical patent/JPWO2023286531A5/ja
Pending legal-status Critical Current

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JP2023535191A 2021-07-13 2022-06-20 Pending JPWO2023286531A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021115861 2021-07-13
PCT/JP2022/024547 WO2023286531A1 (ja) 2021-07-13 2022-06-20 半導体装置、および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023286531A1 JPWO2023286531A1 (enExample) 2023-01-19
JPWO2023286531A5 true JPWO2023286531A5 (enExample) 2025-06-20

Family

ID=84919213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535191A Pending JPWO2023286531A1 (enExample) 2021-07-13 2022-06-20

Country Status (5)

Country Link
US (1) US20240105560A1 (enExample)
JP (1) JPWO2023286531A1 (enExample)
CN (1) CN117616568A (enExample)
DE (1) DE112022003077T5 (enExample)
WO (1) WO2023286531A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007125939A1 (ja) * 2006-04-27 2009-09-10 株式会社Neomaxマテリアル 配線接続用クラッド材及びそのクラッド材から加工された配線接続部材
JP4537370B2 (ja) * 2006-12-04 2010-09-01 日立オートモティブシステムズ株式会社 電子装置
JP2013235882A (ja) 2012-05-07 2013-11-21 Mitsubishi Electric Corp 半導体装置
EP4404464A3 (en) * 2013-11-20 2024-10-23 Rohm Co., Ltd. Switching device and electronic circuit
DE212018000078U1 (de) * 2017-03-14 2019-04-03 Rohm Co., Ltd. Halbleiterbauelement

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