JP2002026168A5 - - Google Patents

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Publication number
JP2002026168A5
JP2002026168A5 JP2000203057A JP2000203057A JP2002026168A5 JP 2002026168 A5 JP2002026168 A5 JP 2002026168A5 JP 2000203057 A JP2000203057 A JP 2000203057A JP 2000203057 A JP2000203057 A JP 2000203057A JP 2002026168 A5 JP2002026168 A5 JP 2002026168A5
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
resin
resin sealing
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000203057A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026168A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000203057A priority Critical patent/JP2002026168A/ja
Priority claimed from JP2000203057A external-priority patent/JP2002026168A/ja
Priority to TW090111982A priority patent/TWI249834B/zh
Priority to KR1020010028965A priority patent/KR100778174B1/ko
Priority to US09/881,716 priority patent/US6710429B2/en
Publication of JP2002026168A publication Critical patent/JP2002026168A/ja
Publication of JP2002026168A5 publication Critical patent/JP2002026168A5/ja
Pending legal-status Critical Current

Links

JP2000203057A 2000-06-30 2000-06-30 半導体装置およびその製造方法 Pending JP2002026168A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法
TW090111982A TWI249834B (en) 2000-06-30 2001-05-18 Semiconductor device and its manufacturing method
KR1020010028965A KR100778174B1 (ko) 2000-06-30 2001-05-25 반도체장치 및 그 제조방법
US09/881,716 US6710429B2 (en) 2000-06-30 2001-06-18 Semiconductor device and process for production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2002026168A JP2002026168A (ja) 2002-01-25
JP2002026168A5 true JP2002026168A5 (enExample) 2005-06-30

Family

ID=18700505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000203057A Pending JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Country Status (4)

Country Link
US (1) US6710429B2 (enExample)
JP (1) JP2002026168A (enExample)
KR (1) KR100778174B1 (enExample)
TW (1) TWI249834B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073600A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置およびその製造方法
DE102005038443A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
TWI405313B (zh) * 2010-03-31 2013-08-11 Quanta Comp Inc 具側邊接腳之積體電路封裝元件
TWI774221B (zh) * 2021-01-29 2022-08-11 隆達電子股份有限公司 發光裝置及其製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
JP3012816B2 (ja) 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging

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