JPS6234445Y2 - - Google Patents

Info

Publication number
JPS6234445Y2
JPS6234445Y2 JP1982085735U JP8573582U JPS6234445Y2 JP S6234445 Y2 JPS6234445 Y2 JP S6234445Y2 JP 1982085735 U JP1982085735 U JP 1982085735U JP 8573582 U JP8573582 U JP 8573582U JP S6234445 Y2 JPS6234445 Y2 JP S6234445Y2
Authority
JP
Japan
Prior art keywords
frame
package
welding frame
semiconductor device
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982085735U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58187149U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982085735U priority Critical patent/JPS58187149U/ja
Publication of JPS58187149U publication Critical patent/JPS58187149U/ja
Application granted granted Critical
Publication of JPS6234445Y2 publication Critical patent/JPS6234445Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1982085735U 1982-06-09 1982-06-09 半導体素子用パツケ−ジ Granted JPS58187149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982085735U JPS58187149U (ja) 1982-06-09 1982-06-09 半導体素子用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982085735U JPS58187149U (ja) 1982-06-09 1982-06-09 半導体素子用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58187149U JPS58187149U (ja) 1983-12-12
JPS6234445Y2 true JPS6234445Y2 (enExample) 1987-09-02

Family

ID=30094583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982085735U Granted JPS58187149U (ja) 1982-06-09 1982-06-09 半導体素子用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58187149U (enExample)

Also Published As

Publication number Publication date
JPS58187149U (ja) 1983-12-12

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