JP7111140B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7111140B2
JP7111140B2 JP2020158041A JP2020158041A JP7111140B2 JP 7111140 B2 JP7111140 B2 JP 7111140B2 JP 2020158041 A JP2020158041 A JP 2020158041A JP 2020158041 A JP2020158041 A JP 2020158041A JP 7111140 B2 JP7111140 B2 JP 7111140B2
Authority
JP
Japan
Prior art keywords
wire
electrode
semiconductor element
bonding
wiring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020158041A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021061393A (ja
JP2021061393A5 (enExample
Inventor
大輔 福岡
知巳 奥村
祐司 大谷
渉 小林
匠 野村
智明 満永
敬洋 平野
孝充 坂井
賢吾 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN202080069629.5A priority Critical patent/CN114503255B/zh
Priority to CN202511095690.8A priority patent/CN120933255A/zh
Priority to PCT/JP2020/036372 priority patent/WO2021065736A1/ja
Publication of JP2021061393A publication Critical patent/JP2021061393A/ja
Publication of JP2021061393A5 publication Critical patent/JP2021061393A5/ja
Priority to US17/708,525 priority patent/US12315825B2/en
Application granted granted Critical
Publication of JP7111140B2 publication Critical patent/JP7111140B2/ja
Priority to US19/189,450 priority patent/US20250259946A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8314—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020158041A 2019-10-04 2020-09-22 半導体装置 Active JP7111140B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202080069629.5A CN114503255B (zh) 2019-10-04 2020-09-25 半导体装置
CN202511095690.8A CN120933255A (zh) 2019-10-04 2020-09-25 半导体装置
PCT/JP2020/036372 WO2021065736A1 (ja) 2019-10-04 2020-09-25 半導体装置
US17/708,525 US12315825B2 (en) 2019-10-04 2022-03-30 Semiconductor device having wire pieces in bonding member
US19/189,450 US20250259946A1 (en) 2019-10-04 2025-04-25 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019184066 2019-10-04
JP2019184066 2019-10-04

Publications (3)

Publication Number Publication Date
JP2021061393A JP2021061393A (ja) 2021-04-15
JP2021061393A5 JP2021061393A5 (enExample) 2021-10-14
JP7111140B2 true JP7111140B2 (ja) 2022-08-02

Family

ID=75381495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020158041A Active JP7111140B2 (ja) 2019-10-04 2020-09-22 半導体装置

Country Status (1)

Country Link
JP (1) JP7111140B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120356880A (zh) * 2021-08-09 2025-07-22 华为技术有限公司 一种功率模块、电源电路及芯片

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311577A (ja) 2006-05-18 2007-11-29 Rohm Co Ltd 半導体装置
JP2008153432A (ja) 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置およびその製造方法
JP2012069703A (ja) 2010-09-22 2012-04-05 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
JP2014112608A (ja) 2012-12-05 2014-06-19 Denso Corp 半導体装置
WO2017187998A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397234A (ja) * 1989-09-11 1991-04-23 Nec Corp 半導体ペレット搭載基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311577A (ja) 2006-05-18 2007-11-29 Rohm Co Ltd 半導体装置
JP2008153432A (ja) 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置およびその製造方法
JP2012069703A (ja) 2010-09-22 2012-04-05 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
JP2014112608A (ja) 2012-12-05 2014-06-19 Denso Corp 半導体装置
WO2017187998A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 半導体装置

Also Published As

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JP2021061393A (ja) 2021-04-15

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