JP2021103151A5 - - Google Patents
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- Publication number
- JP2021103151A5 JP2021103151A5 JP2019235222A JP2019235222A JP2021103151A5 JP 2021103151 A5 JP2021103151 A5 JP 2021103151A5 JP 2019235222 A JP2019235222 A JP 2019235222A JP 2019235222 A JP2019235222 A JP 2019235222A JP 2021103151 A5 JP2021103151 A5 JP 2021103151A5
- Authority
- JP
- Japan
- Prior art keywords
- sensor mounting
- electronic device
- mounted member
- mounting portion
- support beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000035515 penetration Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235222A JP7310598B2 (ja) | 2019-12-25 | 2019-12-25 | 電子装置 |
| PCT/JP2020/048817 WO2021132594A1 (ja) | 2019-12-25 | 2020-12-25 | 電子装置 |
| CN202080089357.5A CN114846335A (zh) | 2019-12-25 | 2020-12-25 | 电子装置 |
| US17/845,563 US20220317147A1 (en) | 2019-12-25 | 2022-06-21 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235222A JP7310598B2 (ja) | 2019-12-25 | 2019-12-25 | 電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021103151A JP2021103151A (ja) | 2021-07-15 |
| JP2021103151A5 true JP2021103151A5 (enExample) | 2022-03-04 |
| JP7310598B2 JP7310598B2 (ja) | 2023-07-19 |
Family
ID=76573090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019235222A Active JP7310598B2 (ja) | 2019-12-25 | 2019-12-25 | 電子装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20220317147A1 (enExample) |
| JP (1) | JP7310598B2 (enExample) |
| CN (1) | CN114846335A (enExample) |
| WO (1) | WO2021132594A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7200969B2 (ja) * | 2020-04-10 | 2023-01-10 | 株式会社デンソー | 電子装置 |
| JP7706287B2 (ja) * | 2021-07-21 | 2025-07-11 | 株式会社三共 | 遊技機 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0763779A (ja) * | 1993-08-27 | 1995-03-10 | Kansei Corp | 加速度センサ |
| JPH10253652A (ja) * | 1997-03-14 | 1998-09-25 | Denso Corp | センサ装置及びその製造方法並びにその製造に用いられるリードフレーム |
| JPH11337571A (ja) * | 1998-05-27 | 1999-12-10 | Japan Aviation Electronics Ind Ltd | 慣性センサ |
| JP2002107246A (ja) | 2000-09-29 | 2002-04-10 | Matsushita Electric Works Ltd | 半導体センサ |
| JP4701505B2 (ja) * | 2001-01-29 | 2011-06-15 | パナソニック株式会社 | 慣性トランスデューサ |
| US7424347B2 (en) * | 2001-07-19 | 2008-09-09 | Kelsey-Hayes Company | Motion sensors integrated within an electro-hydraulic control unit |
| US7253079B2 (en) * | 2002-05-09 | 2007-08-07 | The Charles Stark Draper Laboratory, Inc. | Coplanar mounting member for a MEM sensor |
| JP2004271312A (ja) * | 2003-03-07 | 2004-09-30 | Denso Corp | 容量型半導体センサ装置 |
| JP4026573B2 (ja) * | 2003-09-24 | 2007-12-26 | 株式会社デンソー | 電子装置を収納するパッケージの製造方法 |
| US6927482B1 (en) * | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
| JP4438579B2 (ja) * | 2004-09-14 | 2010-03-24 | 株式会社デンソー | センサ装置 |
| JP2007233753A (ja) | 2006-03-01 | 2007-09-13 | Fujitsu Ltd | 加速度センサを備えた情報処理装置 |
| DE102006022807A1 (de) * | 2006-05-16 | 2007-11-22 | Robert Bosch Gmbh | Chipgehäuse mit reduzierter Schwingungseinkopplung |
| JP5070778B2 (ja) * | 2006-09-20 | 2012-11-14 | 株式会社デンソー | 力学量センサ |
| JP4858215B2 (ja) * | 2007-02-20 | 2012-01-18 | パナソニック株式会社 | 複合センサ |
| CN101796374A (zh) * | 2007-09-03 | 2010-08-04 | 松下电器产业株式会社 | 惯性力传感器 |
| EP2112471A1 (fr) * | 2008-04-22 | 2009-10-28 | Microcomponents AG | Dispositif de montage pour composant électronique |
| JP5417737B2 (ja) * | 2008-04-23 | 2014-02-19 | パナソニック株式会社 | 慣性力センサ |
| JPWO2010055716A1 (ja) * | 2008-11-13 | 2012-04-12 | 三菱電機株式会社 | 加速度センサ |
| JP2011094987A (ja) * | 2009-10-27 | 2011-05-12 | Panasonic Electric Works Co Ltd | 回路モジュールおよび回路モジュールの製造方法 |
| JP2012039033A (ja) * | 2010-08-11 | 2012-02-23 | Clarion Co Ltd | 電子回路基板、ナビゲーション装置 |
| CN103518424B (zh) * | 2011-05-26 | 2017-05-17 | 松下知识产权经营株式会社 | 电子部件安装方法、电子部件搭载装置以及电子部件安装系统 |
| DE102012201486B4 (de) * | 2012-02-02 | 2020-08-06 | Robert Bosch Gmbh | Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung |
| WO2016084630A1 (ja) * | 2014-11-27 | 2016-06-02 | ソニー株式会社 | 回路基板および電子機器 |
| JP6372361B2 (ja) * | 2015-01-16 | 2018-08-15 | 株式会社デンソー | 複合センサ |
| MX381703B (es) * | 2015-11-12 | 2025-03-13 | Possehl Electronics Deutschland Gmbh | Estructura de camino conductor que tiene un componente que se aloja en una manera amortiguada contra vibraciones. |
| US11041726B2 (en) | 2017-08-17 | 2021-06-22 | Autel Robotics Co., Ltd. | Inertial measurement apparatus and mechanical device |
| JP7283407B2 (ja) * | 2020-02-04 | 2023-05-30 | 株式会社デンソー | 電子装置 |
| JP7200969B2 (ja) * | 2020-04-10 | 2023-01-10 | 株式会社デンソー | 電子装置 |
-
2019
- 2019-12-25 JP JP2019235222A patent/JP7310598B2/ja active Active
-
2020
- 2020-12-25 WO PCT/JP2020/048817 patent/WO2021132594A1/ja not_active Ceased
- 2020-12-25 CN CN202080089357.5A patent/CN114846335A/zh not_active Withdrawn
-
2022
- 2022-06-21 US US17/845,563 patent/US20220317147A1/en not_active Abandoned