CN114846335A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN114846335A
CN114846335A CN202080089357.5A CN202080089357A CN114846335A CN 114846335 A CN114846335 A CN 114846335A CN 202080089357 A CN202080089357 A CN 202080089357A CN 114846335 A CN114846335 A CN 114846335A
Authority
CN
China
Prior art keywords
support beam
mounting portion
sensor mounting
electronic device
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202080089357.5A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤启太郎
明石照久
船桥博文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN114846335A publication Critical patent/CN114846335A/zh
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Structure Of Printed Boards (AREA)
CN202080089357.5A 2019-12-25 2020-12-25 电子装置 Withdrawn CN114846335A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019235222A JP7310598B2 (ja) 2019-12-25 2019-12-25 電子装置
JP2019-235222 2019-12-25
PCT/JP2020/048817 WO2021132594A1 (ja) 2019-12-25 2020-12-25 電子装置

Publications (1)

Publication Number Publication Date
CN114846335A true CN114846335A (zh) 2022-08-02

Family

ID=76573090

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080089357.5A Withdrawn CN114846335A (zh) 2019-12-25 2020-12-25 电子装置

Country Status (4)

Country Link
US (1) US20220317147A1 (enExample)
JP (1) JP7310598B2 (enExample)
CN (1) CN114846335A (enExample)
WO (1) WO2021132594A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115280905A (zh) * 2020-04-10 2022-11-01 株式会社电装 电子装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7706287B2 (ja) * 2021-07-21 2025-07-11 株式会社三共 遊技機

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763779A (ja) * 1993-08-27 1995-03-10 Kansei Corp 加速度センサ
JP2002107246A (ja) * 2000-09-29 2002-04-10 Matsushita Electric Works Ltd 半導体センサ
CN101030096A (zh) * 2006-03-01 2007-09-05 富士通株式会社 具有加速度传感器的信息处理装置
US20090194860A1 (en) * 2006-05-16 2009-08-06 Martin Holzmann Chip Housing Having Reduced Induced Vibration
US20090260226A1 (en) * 2008-04-22 2009-10-22 Microcomponents S.A. Device for assembling an electronic component
CN101617198A (zh) * 2007-02-20 2009-12-30 松下电器产业株式会社 惯性力传感器及复合惯性力传感器
US20110036167A1 (en) * 2007-09-03 2011-02-17 Panasonic Corporation Inertia force sensor
CN102216789A (zh) * 2008-11-13 2011-10-12 三菱电机株式会社 加速度传感器
US20130199295A1 (en) * 2012-02-02 2013-08-08 Robert Bosch Gmbh Damping device for a micromechanical sensor device
CN107110884A (zh) * 2015-01-16 2017-08-29 株式会社电装 复合传感器
US10582610B2 (en) * 2015-11-12 2020-03-03 Possehl Electronics Deutschland Gmbh Conductor path structure having a component received in a vibration-damped manner

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10253652A (ja) * 1997-03-14 1998-09-25 Denso Corp センサ装置及びその製造方法並びにその製造に用いられるリードフレーム
JPH11337571A (ja) * 1998-05-27 1999-12-10 Japan Aviation Electronics Ind Ltd 慣性センサ
JP4701505B2 (ja) * 2001-01-29 2011-06-15 パナソニック株式会社 慣性トランスデューサ
US7424347B2 (en) * 2001-07-19 2008-09-09 Kelsey-Hayes Company Motion sensors integrated within an electro-hydraulic control unit
US7253079B2 (en) * 2002-05-09 2007-08-07 The Charles Stark Draper Laboratory, Inc. Coplanar mounting member for a MEM sensor
JP2004271312A (ja) * 2003-03-07 2004-09-30 Denso Corp 容量型半導体センサ装置
JP4026573B2 (ja) * 2003-09-24 2007-12-26 株式会社デンソー 電子装置を収納するパッケージの製造方法
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
JP4438579B2 (ja) * 2004-09-14 2010-03-24 株式会社デンソー センサ装置
JP5070778B2 (ja) * 2006-09-20 2012-11-14 株式会社デンソー 力学量センサ
JP5417737B2 (ja) * 2008-04-23 2014-02-19 パナソニック株式会社 慣性力センサ
JP2011094987A (ja) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd 回路モジュールおよび回路モジュールの製造方法
JP2012039033A (ja) * 2010-08-11 2012-02-23 Clarion Co Ltd 電子回路基板、ナビゲーション装置
CN103518424B (zh) * 2011-05-26 2017-05-17 松下知识产权经营株式会社 电子部件安装方法、电子部件搭载装置以及电子部件安装系统
WO2016084630A1 (ja) * 2014-11-27 2016-06-02 ソニー株式会社 回路基板および電子機器
US11041726B2 (en) 2017-08-17 2021-06-22 Autel Robotics Co., Ltd. Inertial measurement apparatus and mechanical device
JP7283407B2 (ja) * 2020-02-04 2023-05-30 株式会社デンソー 電子装置
JP7200969B2 (ja) * 2020-04-10 2023-01-10 株式会社デンソー 電子装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763779A (ja) * 1993-08-27 1995-03-10 Kansei Corp 加速度センサ
JP2002107246A (ja) * 2000-09-29 2002-04-10 Matsushita Electric Works Ltd 半導体センサ
CN101030096A (zh) * 2006-03-01 2007-09-05 富士通株式会社 具有加速度传感器的信息处理装置
US20090194860A1 (en) * 2006-05-16 2009-08-06 Martin Holzmann Chip Housing Having Reduced Induced Vibration
CN101617198A (zh) * 2007-02-20 2009-12-30 松下电器产业株式会社 惯性力传感器及复合惯性力传感器
US20110036167A1 (en) * 2007-09-03 2011-02-17 Panasonic Corporation Inertia force sensor
US20090260226A1 (en) * 2008-04-22 2009-10-22 Microcomponents S.A. Device for assembling an electronic component
CN102216789A (zh) * 2008-11-13 2011-10-12 三菱电机株式会社 加速度传感器
US20130199295A1 (en) * 2012-02-02 2013-08-08 Robert Bosch Gmbh Damping device for a micromechanical sensor device
CN107110884A (zh) * 2015-01-16 2017-08-29 株式会社电装 复合传感器
US10582610B2 (en) * 2015-11-12 2020-03-03 Possehl Electronics Deutschland Gmbh Conductor path structure having a component received in a vibration-damped manner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115280905A (zh) * 2020-04-10 2022-11-01 株式会社电装 电子装置

Also Published As

Publication number Publication date
JP7310598B2 (ja) 2023-07-19
WO2021132594A1 (ja) 2021-07-01
US20220317147A1 (en) 2022-10-06
JP2021103151A (ja) 2021-07-15

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