JP2021048382A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2021048382A5 JP2021048382A5 JP2020086892A JP2020086892A JP2021048382A5 JP 2021048382 A5 JP2021048382 A5 JP 2021048382A5 JP 2020086892 A JP2020086892 A JP 2020086892A JP 2020086892 A JP2020086892 A JP 2020086892A JP 2021048382 A5 JP2021048382 A5 JP 2021048382A5
- Authority
- JP
- Japan
- Prior art keywords
- frame assembly
- wafer processing
- processing system
- vacuum chamber
- receiving area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 7
- 238000004891 communication Methods 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000012636 effector Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1913356.0 | 2019-09-16 | ||
| GB201913356A GB201913356D0 (en) | 2019-09-16 | 2019-09-16 | Wafer processing system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021048382A JP2021048382A (ja) | 2021-03-25 |
| JP2021048382A5 true JP2021048382A5 (cg-RX-API-DMAC7.html) | 2023-05-24 |
| JP7335853B2 JP7335853B2 (ja) | 2023-08-30 |
Family
ID=68315346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020086892A Active JP7335853B2 (ja) | 2019-09-16 | 2020-05-18 | ウェハ処理システム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11309198B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3792963A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7335853B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102802742B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN112509959B (cg-RX-API-DMAC7.html) |
| GB (1) | GB201913356D0 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI838579B (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI803003B (zh) * | 2021-09-24 | 2023-05-21 | 弘塑科技股份有限公司 | 濕式晶圓處理裝置及晶圓卡匣 |
| CN118156201B (zh) * | 2024-05-09 | 2024-08-02 | 泓浒(苏州)半导体科技有限公司 | 一种应用于真空盒式升降机的晶圆转运装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3139155B2 (ja) * | 1992-07-29 | 2001-02-26 | 東京エレクトロン株式会社 | 真空処理装置 |
| JP4294172B2 (ja) * | 1999-07-19 | 2009-07-08 | シンフォニアテクノロジー株式会社 | ロードロック装置およびウェハ搬送システム |
| US6824343B2 (en) * | 2002-02-22 | 2004-11-30 | Applied Materials, Inc. | Substrate support |
| JP4119793B2 (ja) * | 2003-06-12 | 2008-07-16 | 住友重機械工業株式会社 | アライメント装置及びアライメント方法 |
| US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| US20060102078A1 (en) * | 2004-11-18 | 2006-05-18 | Intevac Inc. | Wafer fab |
| KR20060121542A (ko) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | 반도체장치의 제조설비 |
| KR101192177B1 (ko) | 2005-06-27 | 2012-10-17 | 엘지디스플레이 주식회사 | 기판 얼라이너 및 이를 이용한 로드락챔버 |
| US20080138178A1 (en) * | 2006-12-06 | 2008-06-12 | Axcelis Technologies,Inc. | High throughput serial wafer handling end station |
| JP2008192840A (ja) | 2007-02-05 | 2008-08-21 | Tokyo Electron Ltd | 真空処理装置及び真空処理方法並びに記憶媒体 |
| JP5501688B2 (ja) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | 基板位置合わせ機構、それを用いた真空予備室および基板処理システム |
| JP6014302B2 (ja) * | 2010-09-06 | 2016-10-25 | 東京応化工業株式会社 | 貼り合わせ装置および貼り合わせ方法 |
| KR101652613B1 (ko) | 2012-03-07 | 2016-08-30 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램 |
| JP6179012B2 (ja) * | 2013-07-28 | 2017-08-16 | アテル株式会社 | ウエハ位置決め装置 |
| KR102443290B1 (ko) * | 2016-07-13 | 2022-09-14 | 유니버셜 인스트루먼츠 코퍼레이션 | 모듈식 다이 핸들링 시스템 |
| JP6810585B2 (ja) * | 2016-11-30 | 2021-01-06 | タツモ株式会社 | チャック装置及び貼合装置 |
| TWI897017B (zh) * | 2017-01-26 | 2025-09-11 | 美商布魯克斯自動機械美國公司 | 基板輸送設備、基板處理工具及用於基板輸送設備位置補償之方法 |
-
2019
- 2019-09-16 GB GB201913356A patent/GB201913356D0/en not_active Ceased
-
2020
- 2020-03-26 EP EP20165797.0A patent/EP3792963A1/en active Pending
- 2020-05-11 CN CN202010391353.4A patent/CN112509959B/zh active Active
- 2020-05-18 JP JP2020086892A patent/JP7335853B2/ja active Active
- 2020-06-12 KR KR1020200071396A patent/KR102802742B1/ko active Active
- 2020-07-02 US US16/919,180 patent/US11309198B2/en active Active
- 2020-09-14 TW TW109131459A patent/TWI838579B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4244555B2 (ja) | 被処理体の支持機構 | |
| JP4912253B2 (ja) | 基板搬送装置、基板処理装置及び基板搬送方法 | |
| KR102157427B1 (ko) | 기판 반송 로봇 및 기판 처리 시스템 | |
| JP7012143B2 (ja) | レチクルの搬送システム及び搬送方法 | |
| KR102163605B1 (ko) | 기판 처리 장치 | |
| KR102941975B1 (ko) | 반송 장치 | |
| JP2004282002A (ja) | 基板処理装置及び基板処理方法 | |
| JP5249098B2 (ja) | 基板処理システム及び基板処理方法 | |
| TW201700239A (zh) | 基板搬送機器人及基板處理系統 | |
| JP2021048382A5 (cg-RX-API-DMAC7.html) | ||
| KR100802526B1 (ko) | 진공처리방법 또는 진공처리장치 | |
| JP2025111814A (ja) | 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法 | |
| KR20010042421A (ko) | 얼라인먼트 처리기구 및 그것을 사용한 반도체 처리장치 | |
| WO2022202626A1 (ja) | 基板搬送方法 | |
| JP6014982B2 (ja) | サイド用ロードポート、efem | |
| US11309198B2 (en) | Wafer processing system | |
| KR102174063B1 (ko) | 반송 유닛, 그를 포함하는 기판 처리 장치 및 기판 처리 방법 | |
| JP7607449B2 (ja) | 基板の受け渡し方法及び基板受け渡し装置 | |
| KR102305353B1 (ko) | 기판 처리 장치 및 기판 반송 방법 | |
| US20250183079A1 (en) | Substrate Transport System and Substrate Position Adjustment Method | |
| WO2025164504A1 (ja) | アライナ装置及びアライナ装置の制御方法 | |
| KR20100135626A (ko) | 기판이송장치 및 이를 포함하는 기판처리시스템 | |
| KR101649299B1 (ko) | 선형 기판이송장치를 갖는 기판처리시스템 | |
| KR20210015538A (ko) | 기판 이송 모듈 및 기판 이송 방법 | |
| KR102577172B1 (ko) | 기판 반송 시스템 및 기판 반송 방법 |