GB201913356D0 - Wafer processing system - Google Patents

Wafer processing system

Info

Publication number
GB201913356D0
GB201913356D0 GB201913356A GB201913356A GB201913356D0 GB 201913356 D0 GB201913356 D0 GB 201913356D0 GB 201913356 A GB201913356 A GB 201913356A GB 201913356 A GB201913356 A GB 201913356A GB 201913356 D0 GB201913356 D0 GB 201913356D0
Authority
GB
United Kingdom
Prior art keywords
processing system
wafer processing
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB201913356A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPTS Technologies Ltd
Original Assignee
SPTS Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPTS Technologies Ltd filed Critical SPTS Technologies Ltd
Priority to GB201913356A priority Critical patent/GB201913356D0/en
Publication of GB201913356D0 publication Critical patent/GB201913356D0/en
Priority to EP20165797.0A priority patent/EP3792963A1/en
Priority to CN202010391353.4A priority patent/CN112509959B/zh
Priority to JP2020086892A priority patent/JP7335853B2/ja
Priority to KR1020200071396A priority patent/KR102802742B1/ko
Priority to US16/919,180 priority patent/US11309198B2/en
Priority to TW109131459A priority patent/TWI838579B/zh
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
GB201913356A 2019-09-16 2019-09-16 Wafer processing system Ceased GB201913356D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB201913356A GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system
EP20165797.0A EP3792963A1 (en) 2019-09-16 2020-03-26 Wafer processing system
CN202010391353.4A CN112509959B (zh) 2019-09-16 2020-05-11 晶片处理系统
JP2020086892A JP7335853B2 (ja) 2019-09-16 2020-05-18 ウェハ処理システム
KR1020200071396A KR102802742B1 (ko) 2019-09-16 2020-06-12 웨이퍼 프로세싱 시스템
US16/919,180 US11309198B2 (en) 2019-09-16 2020-07-02 Wafer processing system
TW109131459A TWI838579B (zh) 2019-09-16 2020-09-14 晶圓處理系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201913356A GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system

Publications (1)

Publication Number Publication Date
GB201913356D0 true GB201913356D0 (en) 2019-10-30

Family

ID=68315346

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201913356A Ceased GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system

Country Status (7)

Country Link
US (1) US11309198B2 (cg-RX-API-DMAC7.html)
EP (1) EP3792963A1 (cg-RX-API-DMAC7.html)
JP (1) JP7335853B2 (cg-RX-API-DMAC7.html)
KR (1) KR102802742B1 (cg-RX-API-DMAC7.html)
CN (1) CN112509959B (cg-RX-API-DMAC7.html)
GB (1) GB201913356D0 (cg-RX-API-DMAC7.html)
TW (1) TWI838579B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803003B (zh) * 2021-09-24 2023-05-21 弘塑科技股份有限公司 濕式晶圓處理裝置及晶圓卡匣
CN118156201B (zh) * 2024-05-09 2024-08-02 泓浒(苏州)半导体科技有限公司 一种应用于真空盒式升降机的晶圆转运装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP4294172B2 (ja) * 1999-07-19 2009-07-08 シンフォニアテクノロジー株式会社 ロードロック装置およびウェハ搬送システム
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
JP4119793B2 (ja) * 2003-06-12 2008-07-16 住友重機械工業株式会社 アライメント装置及びアライメント方法
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
KR20060121542A (ko) * 2005-05-24 2006-11-29 삼성전자주식회사 반도체장치의 제조설비
KR101192177B1 (ko) 2005-06-27 2012-10-17 엘지디스플레이 주식회사 기판 얼라이너 및 이를 이용한 로드락챔버
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
JP2008192840A (ja) 2007-02-05 2008-08-21 Tokyo Electron Ltd 真空処理装置及び真空処理方法並びに記憶媒体
JP5501688B2 (ja) * 2009-07-30 2014-05-28 東京エレクトロン株式会社 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
KR101652613B1 (ko) 2012-03-07 2016-08-30 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
KR102443290B1 (ko) * 2016-07-13 2022-09-14 유니버셜 인스트루먼츠 코퍼레이션 모듈식 다이 핸들링 시스템
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置
TWI897017B (zh) * 2017-01-26 2025-09-11 美商布魯克斯自動機械美國公司 基板輸送設備、基板處理工具及用於基板輸送設備位置補償之方法

Also Published As

Publication number Publication date
EP3792963A1 (en) 2021-03-17
CN112509959B (zh) 2025-03-04
US11309198B2 (en) 2022-04-19
CN112509959A (zh) 2021-03-16
TW202117906A (zh) 2021-05-01
US20210082722A1 (en) 2021-03-18
TWI838579B (zh) 2024-04-11
JP7335853B2 (ja) 2023-08-30
KR20210032270A (ko) 2021-03-24
KR102802742B1 (ko) 2025-04-30
JP2021048382A (ja) 2021-03-25

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)