TWI838579B - 晶圓處理系統 - Google Patents

晶圓處理系統 Download PDF

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Publication number
TWI838579B
TWI838579B TW109131459A TW109131459A TWI838579B TW I838579 B TWI838579 B TW I838579B TW 109131459 A TW109131459 A TW 109131459A TW 109131459 A TW109131459 A TW 109131459A TW I838579 B TWI838579 B TW I838579B
Authority
TW
Taiwan
Prior art keywords
frame assembly
vacuum chamber
wafer processing
assembly
processing system
Prior art date
Application number
TW109131459A
Other languages
English (en)
Chinese (zh)
Other versions
TW202117906A (zh
Inventor
亞提拉 納吉
克里斯 馬汀
Original Assignee
英商Ｓｐｔｓ科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英商Ｓｐｔｓ科技公司 filed Critical 英商Ｓｐｔｓ科技公司
Publication of TW202117906A publication Critical patent/TW202117906A/zh
Application granted granted Critical
Publication of TWI838579B publication Critical patent/TWI838579B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW109131459A 2019-09-16 2020-09-14 晶圓處理系統 TWI838579B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1913356.0 2019-09-16
GB201913356A GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system

Publications (2)

Publication Number Publication Date
TW202117906A TW202117906A (zh) 2021-05-01
TWI838579B true TWI838579B (zh) 2024-04-11

Family

ID=68315346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109131459A TWI838579B (zh) 2019-09-16 2020-09-14 晶圓處理系統

Country Status (7)

Country Link
US (1) US11309198B2 (cg-RX-API-DMAC7.html)
EP (1) EP3792963A1 (cg-RX-API-DMAC7.html)
JP (1) JP7335853B2 (cg-RX-API-DMAC7.html)
KR (1) KR102802742B1 (cg-RX-API-DMAC7.html)
CN (1) CN112509959B (cg-RX-API-DMAC7.html)
GB (1) GB201913356D0 (cg-RX-API-DMAC7.html)
TW (1) TWI838579B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803003B (zh) * 2021-09-24 2023-05-21 弘塑科技股份有限公司 濕式晶圓處理裝置及晶圓卡匣
CN118156201B (zh) * 2024-05-09 2024-08-02 泓浒(苏州)半导体科技有限公司 一种应用于真空盒式升降机的晶圆转运装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161706A1 (en) * 2002-02-22 2003-08-28 Applied Materials, Inc. Substrate support
TW201840389A (zh) * 2017-01-26 2018-11-16 美商布魯克斯自動機械公司 用於基板輸送設備位置補償之方法及設備

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP4294172B2 (ja) * 1999-07-19 2009-07-08 シンフォニアテクノロジー株式会社 ロードロック装置およびウェハ搬送システム
JP4119793B2 (ja) * 2003-06-12 2008-07-16 住友重機械工業株式会社 アライメント装置及びアライメント方法
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
KR20060121542A (ko) * 2005-05-24 2006-11-29 삼성전자주식회사 반도체장치의 제조설비
KR101192177B1 (ko) 2005-06-27 2012-10-17 엘지디스플레이 주식회사 기판 얼라이너 및 이를 이용한 로드락챔버
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
JP2008192840A (ja) 2007-02-05 2008-08-21 Tokyo Electron Ltd 真空処理装置及び真空処理方法並びに記憶媒体
JP5501688B2 (ja) * 2009-07-30 2014-05-28 東京エレクトロン株式会社 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
KR101652613B1 (ko) 2012-03-07 2016-08-30 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
KR102443290B1 (ko) * 2016-07-13 2022-09-14 유니버셜 인스트루먼츠 코퍼레이션 모듈식 다이 핸들링 시스템
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161706A1 (en) * 2002-02-22 2003-08-28 Applied Materials, Inc. Substrate support
TW201840389A (zh) * 2017-01-26 2018-11-16 美商布魯克斯自動機械公司 用於基板輸送設備位置補償之方法及設備

Also Published As

Publication number Publication date
EP3792963A1 (en) 2021-03-17
CN112509959B (zh) 2025-03-04
US11309198B2 (en) 2022-04-19
CN112509959A (zh) 2021-03-16
TW202117906A (zh) 2021-05-01
GB201913356D0 (en) 2019-10-30
US20210082722A1 (en) 2021-03-18
JP7335853B2 (ja) 2023-08-30
KR20210032270A (ko) 2021-03-24
KR102802742B1 (ko) 2025-04-30
JP2021048382A (ja) 2021-03-25

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