KR102802742B1 - 웨이퍼 프로세싱 시스템 - Google Patents

웨이퍼 프로세싱 시스템 Download PDF

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Publication number
KR102802742B1
KR102802742B1 KR1020200071396A KR20200071396A KR102802742B1 KR 102802742 B1 KR102802742 B1 KR 102802742B1 KR 1020200071396 A KR1020200071396 A KR 1020200071396A KR 20200071396 A KR20200071396 A KR 20200071396A KR 102802742 B1 KR102802742 B1 KR 102802742B1
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KR
South Korea
Prior art keywords
frame assembly
vacuum chamber
guide members
wafer processing
receiving area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020200071396A
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English (en)
Korean (ko)
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KR20210032270A (ko
Inventor
아틸라 나기
크리스 마틴
Original Assignee
에스피티에스 테크놀러지스 리미티드
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Publication of KR20210032270A publication Critical patent/KR20210032270A/ko
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Publication of KR102802742B1 publication Critical patent/KR102802742B1/ko
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Classifications

    • H01L21/68—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H01L21/67167—
    • H01L21/67196—
    • H01L21/67742—
    • H01L21/67766—
    • H01L21/67775—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020200071396A 2019-09-16 2020-06-12 웨이퍼 프로세싱 시스템 Active KR102802742B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1913356.0 2019-09-16
GB201913356A GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system

Publications (2)

Publication Number Publication Date
KR20210032270A KR20210032270A (ko) 2021-03-24
KR102802742B1 true KR102802742B1 (ko) 2025-04-30

Family

ID=68315346

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200071396A Active KR102802742B1 (ko) 2019-09-16 2020-06-12 웨이퍼 프로세싱 시스템

Country Status (7)

Country Link
US (1) US11309198B2 (cg-RX-API-DMAC7.html)
EP (1) EP3792963A1 (cg-RX-API-DMAC7.html)
JP (1) JP7335853B2 (cg-RX-API-DMAC7.html)
KR (1) KR102802742B1 (cg-RX-API-DMAC7.html)
CN (1) CN112509959B (cg-RX-API-DMAC7.html)
GB (1) GB201913356D0 (cg-RX-API-DMAC7.html)
TW (1) TWI838579B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803003B (zh) * 2021-09-24 2023-05-21 弘塑科技股份有限公司 濕式晶圓處理裝置及晶圓卡匣
CN118156201B (zh) * 2024-05-09 2024-08-02 泓浒(苏州)半导体科技有限公司 一种应用于真空盒式升降机的晶圆转运装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161706A1 (en) 2002-02-22 2003-08-28 Applied Materials, Inc. Substrate support

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP4294172B2 (ja) * 1999-07-19 2009-07-08 シンフォニアテクノロジー株式会社 ロードロック装置およびウェハ搬送システム
JP4119793B2 (ja) * 2003-06-12 2008-07-16 住友重機械工業株式会社 アライメント装置及びアライメント方法
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
KR20060121542A (ko) * 2005-05-24 2006-11-29 삼성전자주식회사 반도체장치의 제조설비
KR101192177B1 (ko) 2005-06-27 2012-10-17 엘지디스플레이 주식회사 기판 얼라이너 및 이를 이용한 로드락챔버
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
JP2008192840A (ja) 2007-02-05 2008-08-21 Tokyo Electron Ltd 真空処理装置及び真空処理方法並びに記憶媒体
JP5501688B2 (ja) * 2009-07-30 2014-05-28 東京エレクトロン株式会社 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
KR101652613B1 (ko) 2012-03-07 2016-08-30 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
KR102443290B1 (ko) * 2016-07-13 2022-09-14 유니버셜 인스트루먼츠 코퍼레이션 모듈식 다이 핸들링 시스템
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置
TWI897017B (zh) * 2017-01-26 2025-09-11 美商布魯克斯自動機械美國公司 基板輸送設備、基板處理工具及用於基板輸送設備位置補償之方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161706A1 (en) 2002-02-22 2003-08-28 Applied Materials, Inc. Substrate support

Also Published As

Publication number Publication date
EP3792963A1 (en) 2021-03-17
CN112509959B (zh) 2025-03-04
US11309198B2 (en) 2022-04-19
CN112509959A (zh) 2021-03-16
TW202117906A (zh) 2021-05-01
GB201913356D0 (en) 2019-10-30
US20210082722A1 (en) 2021-03-18
TWI838579B (zh) 2024-04-11
JP7335853B2 (ja) 2023-08-30
KR20210032270A (ko) 2021-03-24
JP2021048382A (ja) 2021-03-25

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