JP7335853B2 - ウェハ処理システム - Google Patents

ウェハ処理システム Download PDF

Info

Publication number
JP7335853B2
JP7335853B2 JP2020086892A JP2020086892A JP7335853B2 JP 7335853 B2 JP7335853 B2 JP 7335853B2 JP 2020086892 A JP2020086892 A JP 2020086892A JP 2020086892 A JP2020086892 A JP 2020086892A JP 7335853 B2 JP7335853 B2 JP 7335853B2
Authority
JP
Japan
Prior art keywords
frame assembly
wafer processing
processing system
guide members
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020086892A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021048382A5 (cg-RX-API-DMAC7.html
JP2021048382A (ja
Inventor
ナジ アッティラ
マーティン クリス
Original Assignee
エスピーティーエス テクノロジーズ リミティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エスピーティーエス テクノロジーズ リミティド filed Critical エスピーティーエス テクノロジーズ リミティド
Publication of JP2021048382A publication Critical patent/JP2021048382A/ja
Publication of JP2021048382A5 publication Critical patent/JP2021048382A5/ja
Application granted granted Critical
Publication of JP7335853B2 publication Critical patent/JP7335853B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2020086892A 2019-09-16 2020-05-18 ウェハ処理システム Active JP7335853B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1913356.0 2019-09-16
GB201913356A GB201913356D0 (en) 2019-09-16 2019-09-16 Wafer processing system

Publications (3)

Publication Number Publication Date
JP2021048382A JP2021048382A (ja) 2021-03-25
JP2021048382A5 JP2021048382A5 (cg-RX-API-DMAC7.html) 2023-05-24
JP7335853B2 true JP7335853B2 (ja) 2023-08-30

Family

ID=68315346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020086892A Active JP7335853B2 (ja) 2019-09-16 2020-05-18 ウェハ処理システム

Country Status (7)

Country Link
US (1) US11309198B2 (cg-RX-API-DMAC7.html)
EP (1) EP3792963A1 (cg-RX-API-DMAC7.html)
JP (1) JP7335853B2 (cg-RX-API-DMAC7.html)
KR (1) KR102802742B1 (cg-RX-API-DMAC7.html)
CN (1) CN112509959B (cg-RX-API-DMAC7.html)
GB (1) GB201913356D0 (cg-RX-API-DMAC7.html)
TW (1) TWI838579B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803003B (zh) * 2021-09-24 2023-05-21 弘塑科技股份有限公司 濕式晶圓處理裝置及晶圓卡匣
CN118156201B (zh) * 2024-05-09 2024-08-02 泓浒(苏州)半导体科技有限公司 一种应用于真空盒式升降机的晶圆转运装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192840A (ja) 2007-02-05 2008-08-21 Tokyo Electron Ltd 真空処理装置及び真空処理方法並びに記憶媒体
WO2013133101A1 (ja) 2012-03-07 2013-09-12 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP4294172B2 (ja) * 1999-07-19 2009-07-08 シンフォニアテクノロジー株式会社 ロードロック装置およびウェハ搬送システム
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
JP4119793B2 (ja) * 2003-06-12 2008-07-16 住友重機械工業株式会社 アライメント装置及びアライメント方法
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
KR20060121542A (ko) * 2005-05-24 2006-11-29 삼성전자주식회사 반도체장치의 제조설비
KR101192177B1 (ko) 2005-06-27 2012-10-17 엘지디스플레이 주식회사 기판 얼라이너 및 이를 이용한 로드락챔버
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
JP5501688B2 (ja) * 2009-07-30 2014-05-28 東京エレクトロン株式会社 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
KR102443290B1 (ko) * 2016-07-13 2022-09-14 유니버셜 인스트루먼츠 코퍼레이션 모듈식 다이 핸들링 시스템
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置
TWI897017B (zh) * 2017-01-26 2025-09-11 美商布魯克斯自動機械美國公司 基板輸送設備、基板處理工具及用於基板輸送設備位置補償之方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192840A (ja) 2007-02-05 2008-08-21 Tokyo Electron Ltd 真空処理装置及び真空処理方法並びに記憶媒体
WO2013133101A1 (ja) 2012-03-07 2013-09-12 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理方法

Also Published As

Publication number Publication date
EP3792963A1 (en) 2021-03-17
CN112509959B (zh) 2025-03-04
US11309198B2 (en) 2022-04-19
CN112509959A (zh) 2021-03-16
TW202117906A (zh) 2021-05-01
GB201913356D0 (en) 2019-10-30
US20210082722A1 (en) 2021-03-18
TWI838579B (zh) 2024-04-11
KR20210032270A (ko) 2021-03-24
KR102802742B1 (ko) 2025-04-30
JP2021048382A (ja) 2021-03-25

Similar Documents

Publication Publication Date Title
JP7693642B2 (ja) 基板処理装置
US11664259B2 (en) Process apparatus with on-the-fly substrate centering
CN1943009A (zh) 工件加工系统
CN115244674B (zh) 基板处理设备
JP7335853B2 (ja) ウェハ処理システム
KR100802526B1 (ko) 진공처리방법 또는 진공처리장치
US11189514B2 (en) Substrate processing apparatus and substrate transfer method
US20250183079A1 (en) Substrate Transport System and Substrate Position Adjustment Method
JP2021048382A5 (cg-RX-API-DMAC7.html)
JP2004146714A (ja) 被処理体の搬送機構
US12264747B2 (en) Loadlock apparatus and substrate processing apparatus including the same

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230516

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230516

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230516

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230725

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230818

R150 Certificate of patent or registration of utility model

Ref document number: 7335853

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150