JP2021048363A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract
Description
すなわち、従来の装置は、シール部材による支持ピンの摺動抵抗が非常に大きいので、支持ピンを駆動する駆動部品について、その駆動力を大きなものにしたり、駆動部品の数を増やしたり、複数本の支持ピンを連結し、駆動部品によって昇降される連結部材の強度を高めたりする必要がある。そのため、基板処理装置のコスト低減を妨げる原因となっている。
すなわち、請求項1に記載の発明は、処理液で基板を処理する基板処理装置において、前記処理液に対する耐性を備え、基板の直径より大なる直径を有し、外周側にて上面と下面とが連通した貫通口を複数個形成された回転部材と、前記処理液に対する耐性を備え、前記複数個の貫通口に非シール構造で取り付けられ、前記回転部材の上面から基板の下面を離間して支持するための複数本の支持ピンと、前記回転部材の上面にて前記複数本の支持ピンで支持された基板に対して処理液を供給する供給ノズルと、前記処理液に対する耐性を備え、前記回転部材の下面から下方に離間して配置されたカバーと、前記カバー内に配置され、前記回転部材を水平面内で回転駆動する回転駆動手段と、前記カバー内に配置され、前記複数本の支持ピンを駆動する駆動手段と、を備えていることを特徴とするものである。
図1は、実施例に係る基板処理装置の概略構成を示す全体構成図であり、図2は、保持ユニットの一部を示した縦断面図である。
1 … 保持ユニット
3 … カバー
5 … 飛散防止カップ
7 … 処理液供給系
9 … 下方供給系
11 … 洗浄液供給系
13 … 回転部材
15 … 支持ピン
17 … 周面部材
19 … 連結部材
21 … ガイドピン
23 … 上部磁石
25 … 磁石保持部材
27 … 下部磁石
29 … 回転軸
31 … 貫通口
41a … 吐出口
43a … エッジ開口
45 … 電動モータ
49,53 … シール部材
55 … 洗浄ノズル
Claims (6)
- 処理液で基板を処理する基板処理装置において、
前記処理液に対する耐性を備え、基板の直径より大なる直径を有し、外周側にて上面と下面とが連通した貫通口を複数個形成された回転部材と、
前記処理液に対する耐性を備え、前記複数個の貫通口に非シール構造で取り付けられ、前記回転部材の上面から基板の下面を離間して支持するための複数本の支持ピンと、
前記回転部材の上面にて前記複数本の支持ピンで支持された基板に対して処理液を供給する供給ノズルと、
前記処理液に対する耐性を備え、前記回転部材の下面から下方に離間して配置されたカバーと、
前記カバー内に配置され、前記回転部材を水平面内で回転駆動する回転駆動手段と、
前記カバー内に配置され、前記複数本の支持ピンを駆動する駆動手段と、
を備えていることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置において、
前記複数本の支持ピンのうちの一部の複数本を昇降ピンとし、
前記複数個の昇降ピンを前記回転部材の下方において連結する連結部材を備え、
前記駆動手段は、基板を受け渡すための受け渡し位置と、前記受け渡し位置より低い支持位置とにわたって前記連結部材を介して前記複数本の昇降ピンを昇降駆動することを特徴とする基板処理装置。 - 請求項2に記載の基板処理装置において、
前記駆動手段は、進退駆動される作動軸を備え、前記受け渡し位置に移動する際には前記連結部材に前記作動軸の上端が当接し、前記支持位置に移動する際には前記作動軸の上端が前記連結部材から離間し、
前記連結部材が前記受け渡し位置から前記支持位置に移動する際に、前記連結部材を下方へ磁力で吸引する磁石を備えていることを特徴とする基板処理装置。 - 請求項1から3のいずれかに記載の基板処理装置において、
前記回転部材は、その外周面から下方へ延出され、前記カバーの上面から上方へ離間した下端部を有し、下面が開放された周面部材を備えていることを特徴とする基板処理装置。 - 請求項4に記載の基板処理装置において、
前記周面部材の内部に向かって洗浄液を供給する洗浄ノズルを備えていることを特徴とする基板処理装置。 - 請求項1から5のいずれかに記載の基板処理装置において、
前記回転部材と前記複数本の支持ピンに支持された基板の下面との間に気体を供給する気体供給機構をさらに備え、
前記複数本の支持ピンに支持された基板に対して前記回転部材側への吸引力を生じさせることを特徴とする基板処理装置。
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KR20210157574A (ko) * | 2020-06-22 | 2021-12-29 | 주식회사 제우스 | 기판처리장치 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11102882A (ja) * | 1997-09-26 | 1999-04-13 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2002086048A (ja) * | 2000-09-13 | 2002-03-26 | Tokyo Electron Ltd | 液処理装置 |
JP2008130948A (ja) * | 2006-11-24 | 2008-06-05 | Dainippon Screen Mfg Co Ltd | 基板保持装置およびそれを備える基板処理装置 |
JP2016149420A (ja) * | 2015-02-12 | 2016-08-18 | 株式会社テックインテック | 基板処理装置 |
JP2018107388A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
JP2019046985A (ja) * | 2017-09-04 | 2019-03-22 | 株式会社Screenホールディングス | 基板保持装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263324A (ja) * | 1994-03-17 | 1995-10-13 | Dainippon Screen Mfg Co Ltd | 吸引チャック式基板回転処理装置 |
TW459266B (en) * | 1997-08-27 | 2001-10-11 | Tokyo Electron Ltd | Substrate processing method |
JP3973344B2 (ja) * | 2000-04-27 | 2007-09-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3904406B2 (ja) * | 2001-04-17 | 2007-04-11 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2005019701A (ja) * | 2003-06-26 | 2005-01-20 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2005135940A (ja) * | 2003-10-28 | 2005-05-26 | Okamoto Machine Tool Works Ltd | 半導体ウエハのユニバ−サルチャック機構およびウエハ取付板 |
US7055229B2 (en) * | 2003-12-31 | 2006-06-06 | Intel Corporation | Support system for semiconductor wafers and methods thereof |
JP4460334B2 (ja) * | 2004-03-12 | 2010-05-12 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP4349952B2 (ja) * | 2004-03-24 | 2009-10-21 | 京セラ株式会社 | ウェハ支持部材とその製造方法 |
JP2005317749A (ja) * | 2004-04-28 | 2005-11-10 | Sumitomo Electric Ind Ltd | 半導体製造装置用保持体及びそれを搭載した半導体製造装置 |
JP5242242B2 (ja) | 2007-10-17 | 2013-07-24 | 株式会社荏原製作所 | 基板洗浄装置 |
EP2051285B1 (en) * | 2007-10-17 | 2011-08-24 | Ebara Corporation | Substrate cleaning apparatus |
KR101227743B1 (ko) * | 2008-09-16 | 2013-01-29 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 배치대 |
JP5090299B2 (ja) | 2008-09-16 | 2012-12-05 | 東京エレクトロン株式会社 | プラズマ処理装置および基板載置台 |
JP2010080583A (ja) * | 2008-09-25 | 2010-04-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP5661597B2 (ja) * | 2011-11-14 | 2015-01-28 | 東京エレクトロン株式会社 | 基板保持体の再生方法 |
JP5646528B2 (ja) * | 2012-03-09 | 2014-12-24 | 東京エレクトロン株式会社 | 液処理装置 |
CN104538345B (zh) * | 2014-12-31 | 2017-06-06 | 北京七星华创电子股份有限公司 | 一种盘状物夹持旋转装置 |
JP6503194B2 (ja) * | 2015-02-16 | 2019-04-17 | 株式会社Screenホールディングス | 基板処理装置 |
JP6322255B2 (ja) * | 2016-10-21 | 2018-05-09 | 株式会社プレテック | ウェーハ保持装置及びウェーハ処理装置 |
JP6804325B2 (ja) * | 2017-02-09 | 2020-12-23 | 東京エレクトロン株式会社 | 液処理装置 |
JP7179466B2 (ja) * | 2018-02-13 | 2022-11-29 | 株式会社Screenホールディングス | 基板処理装置 |
-
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11102882A (ja) * | 1997-09-26 | 1999-04-13 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2002086048A (ja) * | 2000-09-13 | 2002-03-26 | Tokyo Electron Ltd | 液処理装置 |
JP2008130948A (ja) * | 2006-11-24 | 2008-06-05 | Dainippon Screen Mfg Co Ltd | 基板保持装置およびそれを備える基板処理装置 |
JP2016149420A (ja) * | 2015-02-12 | 2016-08-18 | 株式会社テックインテック | 基板処理装置 |
JP2018107388A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
JP2019046985A (ja) * | 2017-09-04 | 2019-03-22 | 株式会社Screenホールディングス | 基板保持装置 |
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JP7370201B2 (ja) | 2023-10-27 |
KR20210034491A (ko) | 2021-03-30 |
US20210086236A1 (en) | 2021-03-25 |
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KR102425864B1 (ko) | 2022-07-27 |
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