JP2020517088A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020517088A5 JP2020517088A5 JP2019534079A JP2019534079A JP2020517088A5 JP 2020517088 A5 JP2020517088 A5 JP 2020517088A5 JP 2019534079 A JP2019534079 A JP 2019534079A JP 2019534079 A JP2019534079 A JP 2019534079A JP 2020517088 A5 JP2020517088 A5 JP 2020517088A5
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- alloy
- activated
- tin
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 46
- 229910052759 nickel Inorganic materials 0.000 claims 23
- 229910000990 Ni alloy Inorganic materials 0.000 claims 20
- 238000000034 method Methods 0.000 claims 18
- 238000000151 deposition Methods 0.000 claims 12
- 229910001128 Sn alloy Inorganic materials 0.000 claims 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 9
- 229910000679 solder Inorganic materials 0.000 claims 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 3
- 230000008021 deposition Effects 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 150000003222 pyridines Chemical class 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16206665 | 2016-12-23 | ||
| EP16206665.8 | 2016-12-23 | ||
| PCT/EP2017/084320 WO2018115408A1 (en) | 2016-12-23 | 2017-12-22 | Method of forming a solderable solder deposit on a contact pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020517088A JP2020517088A (ja) | 2020-06-11 |
| JP2020517088A5 true JP2020517088A5 (https=) | 2021-02-04 |
| JP7143303B2 JP7143303B2 (ja) | 2022-09-28 |
Family
ID=57714447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019534079A Active JP7143303B2 (ja) | 2016-12-23 | 2017-12-22 | コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11032914B2 (https=) |
| EP (1) | EP3560304B1 (https=) |
| JP (1) | JP7143303B2 (https=) |
| KR (1) | KR102346987B1 (https=) |
| CN (1) | CN110115116B (https=) |
| TW (1) | TWI683604B (https=) |
| WO (1) | WO2018115408A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6696567B2 (ja) | 2016-05-16 | 2020-05-20 | 株式会社村田製作所 | セラミック電子部品 |
| US11276659B2 (en) * | 2020-02-28 | 2022-03-15 | Micron Technology, Inc. | Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2836581A1 (de) * | 1978-08-21 | 1980-03-06 | Henkel Kgaa | N-(2,3-dihydroxypropyl)-pyridiniumsulfate, deren herstellung sowie diese enthaltende saure galvanische nickelbaeder |
| US5693209A (en) | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
| US5503877A (en) | 1989-11-17 | 1996-04-02 | Atotech Deutschalnd Gmbh | Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate |
| EP1054081B1 (en) | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| US5650595A (en) * | 1995-05-25 | 1997-07-22 | International Business Machines Corporation | Electronic module with multiple solder dams in soldermask window |
| IT1275486B (it) * | 1995-07-06 | 1997-08-07 | Giuseppe Faranda | Sistema di sintesi per l'ottenimento di piridin propil sulfo betaina, senza rischi per l'uomo e per l'ambiente |
| JP2000286542A (ja) * | 1999-03-31 | 2000-10-13 | Harima Chem Inc | 半田付け方法及び半田付け基材 |
| US6355153B1 (en) * | 1999-09-17 | 2002-03-12 | Nutool, Inc. | Chip interconnect and packaging deposition methods and structures |
| JP2002271026A (ja) | 2001-03-14 | 2002-09-20 | Sony Corp | 多層型プリント配線基板及び多層型プリント配線基板の製造方法 |
| EP1322146A1 (en) | 2001-12-18 | 2003-06-25 | Phoenix Precision Technology Corporation | Method of electroplating solder bumps on an organic circuit board |
| JP2003258014A (ja) * | 2002-03-04 | 2003-09-12 | Megic Corp | 半導体表面上に金属バンプを形成する方法 |
| TWI255158B (en) | 2004-09-01 | 2006-05-11 | Phoenix Prec Technology Corp | Method for fabricating electrical connecting member of circuit board |
| TWI270329B (en) | 2005-04-04 | 2007-01-01 | Phoenix Prec Technology Corp | Method for fabricating conducting bump structures of circuit board |
| US7659193B2 (en) * | 2005-12-23 | 2010-02-09 | Phoenix Precision Technology Corporation | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof |
| TWI319297B (en) | 2006-06-06 | 2010-01-01 | Phoenix Prec Technology Corp | Repair structure of circuit board having pre-soldering bumps and method thereof |
| CN101005733A (zh) * | 2006-12-29 | 2007-07-25 | 上海芯光科技有限公司 | 薄型半导体照明平面集成光源模块的制造方法 |
| US20090188805A1 (en) * | 2008-01-25 | 2009-07-30 | Government Of The United States Of America, As Represented By The | Superconformal electrodeposition of nickel iron and cobalt magnetic alloys |
| MY158939A (en) | 2008-10-21 | 2016-11-30 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
| KR20100060968A (ko) * | 2008-11-28 | 2010-06-07 | 삼성전기주식회사 | 메탈 포스트를 구비한 기판 및 그 제조방법 |
| EP2405469B1 (en) * | 2010-07-05 | 2016-09-21 | ATOTECH Deutschland GmbH | Method to form solder alloy deposits on substrates |
| JP2013534367A (ja) * | 2010-08-02 | 2013-09-02 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 基板上にはんだ堆積物および非溶融バンプを形成する方法 |
| KR101154626B1 (ko) * | 2010-08-31 | 2012-06-08 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
| JP5588419B2 (ja) | 2011-10-26 | 2014-09-10 | 株式会社東芝 | パッケージ |
| JP5364838B1 (ja) | 2012-11-30 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | キャリア付銅箔 |
| JP6032254B2 (ja) | 2013-10-11 | 2016-11-24 | 大日本印刷株式会社 | パワーモジュール用金属配線付基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線付基板の製造方法 |
| WO2016180944A1 (en) | 2015-05-13 | 2016-11-17 | Atotech Deutschland Gmbh | Method for manufacturing of fine line circuitry |
-
2017
- 2017-12-22 EP EP17818584.9A patent/EP3560304B1/en not_active Not-in-force
- 2017-12-22 WO PCT/EP2017/084320 patent/WO2018115408A1/en not_active Ceased
- 2017-12-22 CN CN201780078958.4A patent/CN110115116B/zh not_active Expired - Fee Related
- 2017-12-22 JP JP2019534079A patent/JP7143303B2/ja active Active
- 2017-12-22 KR KR1020197018899A patent/KR102346987B1/ko not_active Expired - Fee Related
- 2017-12-22 US US16/466,817 patent/US11032914B2/en not_active Expired - Fee Related
- 2017-12-22 TW TW106145331A patent/TWI683604B/zh not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6079150B2 (ja) | めっきによる貫通孔の銅充填方法 | |
| CN104620394B (zh) | 用于太阳能电池基板的金属化的方法 | |
| TWI593831B (zh) | 錫或錫合金電鍍液 | |
| JP4472157B2 (ja) | ビアフィリング方法 | |
| TW201136893A (en) | Novel compound and use thereof | |
| JP2009158851A5 (https=) | ||
| JP2003113490A5 (https=) | ||
| JP6749937B2 (ja) | 電解銅めっき浴組成物及びその使用方法 | |
| TW200424362A (en) | Electroplating bath | |
| JP6474410B2 (ja) | 電気化学的に不活性なカチオンを含む銅電着浴 | |
| TW201139382A (en) | Plating bath and method | |
| TWI636162B (zh) | 用於電解鍍銅之酸性水性組合物 | |
| JP2010010500A (ja) | 銅回路部品およびその製造方法 | |
| JP2014053608A (ja) | 回路基板及びその製造方法 | |
| JP6231079B2 (ja) | 金属が充填されたビアを有するセラミック基板からなるセラミックプリント基板を製造する方法 | |
| JP2020517088A5 (https=) | ||
| CN103992235A (zh) | 用于电沉积的添加剂 | |
| TW201937003A (zh) | 包括雙芳基銨之鍍敷用整平劑、包含其的鍍銅溶液及使用其之鍍銅方法 | |
| TW201136891A (en) | Novel compound and use thereof | |
| JP2007519261A5 (https=) | ||
| CN107295753A (zh) | 采用半加成法制作电路板的方法 | |
| EP3560304B1 (en) | Method of forming a solderable solder deposit on a contact pad | |
| JP2006219752A5 (https=) | ||
| JP4354139B2 (ja) | 配線基板の製造方法 | |
| TWI288187B (en) | Method for fabricating circuit |