CN110115116B - 在接触垫上形成可焊接焊料沉积物的方法 - Google Patents

在接触垫上形成可焊接焊料沉积物的方法 Download PDF

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Publication number
CN110115116B
CN110115116B CN201780078958.4A CN201780078958A CN110115116B CN 110115116 B CN110115116 B CN 110115116B CN 201780078958 A CN201780078958 A CN 201780078958A CN 110115116 B CN110115116 B CN 110115116B
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CN
China
Prior art keywords
nickel
activated
tin
opening
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201780078958.4A
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English (en)
Chinese (zh)
Other versions
CN110115116A (zh
Inventor
K-J·马泰加特
S·兰普雷希特
J·斯珀林
C·奥德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication date
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Publication of CN110115116A publication Critical patent/CN110115116A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN201780078958.4A 2016-12-23 2017-12-22 在接触垫上形成可焊接焊料沉积物的方法 Expired - Fee Related CN110115116B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16206665 2016-12-23
EP16206665.8 2016-12-23
PCT/EP2017/084320 WO2018115408A1 (en) 2016-12-23 2017-12-22 Method of forming a solderable solder deposit on a contact pad

Publications (2)

Publication Number Publication Date
CN110115116A CN110115116A (zh) 2019-08-09
CN110115116B true CN110115116B (zh) 2022-05-27

Family

ID=57714447

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780078958.4A Expired - Fee Related CN110115116B (zh) 2016-12-23 2017-12-22 在接触垫上形成可焊接焊料沉积物的方法

Country Status (7)

Country Link
US (1) US11032914B2 (https=)
EP (1) EP3560304B1 (https=)
JP (1) JP7143303B2 (https=)
KR (1) KR102346987B1 (https=)
CN (1) CN110115116B (https=)
TW (1) TWI683604B (https=)
WO (1) WO2018115408A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6696567B2 (ja) 2016-05-16 2020-05-20 株式会社村田製作所 セラミック電子部品
US11276659B2 (en) * 2020-02-28 2022-03-15 Micron Technology, Inc. Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

Citations (2)

* Cited by examiner, † Cited by third party
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US5798285A (en) * 1995-05-25 1998-08-25 International Business Machines Corpoation Method of making electronic module with multiple solder dams in soldermask window
CN101005733A (zh) * 2006-12-29 2007-07-25 上海芯光科技有限公司 薄型半导体照明平面集成光源模块的制造方法

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US5693209A (en) 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
US5503877A (en) 1989-11-17 1996-04-02 Atotech Deutschalnd Gmbh Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate
EP1054081B1 (en) 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
IT1275486B (it) * 1995-07-06 1997-08-07 Giuseppe Faranda Sistema di sintesi per l'ottenimento di piridin propil sulfo betaina, senza rischi per l'uomo e per l'ambiente
JP2000286542A (ja) * 1999-03-31 2000-10-13 Harima Chem Inc 半田付け方法及び半田付け基材
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
JP2002271026A (ja) 2001-03-14 2002-09-20 Sony Corp 多層型プリント配線基板及び多層型プリント配線基板の製造方法
EP1322146A1 (en) 2001-12-18 2003-06-25 Phoenix Precision Technology Corporation Method of electroplating solder bumps on an organic circuit board
JP2003258014A (ja) * 2002-03-04 2003-09-12 Megic Corp 半導体表面上に金属バンプを形成する方法
TWI255158B (en) 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
TWI270329B (en) 2005-04-04 2007-01-01 Phoenix Prec Technology Corp Method for fabricating conducting bump structures of circuit board
US7659193B2 (en) * 2005-12-23 2010-02-09 Phoenix Precision Technology Corporation Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
TWI319297B (en) 2006-06-06 2010-01-01 Phoenix Prec Technology Corp Repair structure of circuit board having pre-soldering bumps and method thereof
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
MY158939A (en) 2008-10-21 2016-11-30 Atotech Deutschland Gmbh Method to form solder deposits on substrates
KR20100060968A (ko) * 2008-11-28 2010-06-07 삼성전기주식회사 메탈 포스트를 구비한 기판 및 그 제조방법
EP2405469B1 (en) * 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Method to form solder alloy deposits on substrates
JP2013534367A (ja) * 2010-08-02 2013-09-02 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物および非溶融バンプを形成する方法
KR101154626B1 (ko) * 2010-08-31 2012-06-08 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP5588419B2 (ja) 2011-10-26 2014-09-10 株式会社東芝 パッケージ
JP5364838B1 (ja) 2012-11-30 2013-12-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP6032254B2 (ja) 2013-10-11 2016-11-24 大日本印刷株式会社 パワーモジュール用金属配線付基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線付基板の製造方法
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Publication number Priority date Publication date Assignee Title
US5798285A (en) * 1995-05-25 1998-08-25 International Business Machines Corpoation Method of making electronic module with multiple solder dams in soldermask window
CN101005733A (zh) * 2006-12-29 2007-07-25 上海芯光科技有限公司 薄型半导体照明平面集成光源模块的制造方法

Also Published As

Publication number Publication date
TW201831064A (zh) 2018-08-16
KR20190098165A (ko) 2019-08-21
WO2018115408A1 (en) 2018-06-28
CN110115116A (zh) 2019-08-09
US11032914B2 (en) 2021-06-08
JP7143303B2 (ja) 2022-09-28
KR102346987B1 (ko) 2022-01-03
US20190350088A1 (en) 2019-11-14
EP3560304B1 (en) 2021-02-03
JP2020517088A (ja) 2020-06-11
EP3560304A1 (en) 2019-10-30
TWI683604B (zh) 2020-01-21

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