TWI683604B - 於接觸墊上形成可焊接焊料沉積物的方法及在活化接觸墊上暴露可焊接焊料沉積物之印刷電路板 - Google Patents

於接觸墊上形成可焊接焊料沉積物的方法及在活化接觸墊上暴露可焊接焊料沉積物之印刷電路板 Download PDF

Info

Publication number
TWI683604B
TWI683604B TW106145331A TW106145331A TWI683604B TW I683604 B TWI683604 B TW I683604B TW 106145331 A TW106145331 A TW 106145331A TW 106145331 A TW106145331 A TW 106145331A TW I683604 B TWI683604 B TW I683604B
Authority
TW
Taiwan
Prior art keywords
nickel
tin
alloy
opening
deposited
Prior art date
Application number
TW106145331A
Other languages
English (en)
Chinese (zh)
Other versions
TW201831064A (zh
Inventor
凱-珍斯 麥特傑特
史凡 藍彼奇
詹 史派林
克里斯汀 歐德
Original Assignee
德商德國艾托特克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商德國艾托特克公司 filed Critical 德商德國艾托特克公司
Publication of TW201831064A publication Critical patent/TW201831064A/zh
Application granted granted Critical
Publication of TWI683604B publication Critical patent/TWI683604B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW106145331A 2016-12-23 2017-12-22 於接觸墊上形成可焊接焊料沉積物的方法及在活化接觸墊上暴露可焊接焊料沉積物之印刷電路板 TWI683604B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16206665 2016-12-23
EP16206665.8 2016-12-23

Publications (2)

Publication Number Publication Date
TW201831064A TW201831064A (zh) 2018-08-16
TWI683604B true TWI683604B (zh) 2020-01-21

Family

ID=57714447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106145331A TWI683604B (zh) 2016-12-23 2017-12-22 於接觸墊上形成可焊接焊料沉積物的方法及在活化接觸墊上暴露可焊接焊料沉積物之印刷電路板

Country Status (7)

Country Link
US (1) US11032914B2 (https=)
EP (1) EP3560304B1 (https=)
JP (1) JP7143303B2 (https=)
KR (1) KR102346987B1 (https=)
CN (1) CN110115116B (https=)
TW (1) TWI683604B (https=)
WO (1) WO2018115408A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6696567B2 (ja) 2016-05-16 2020-05-20 株式会社村田製作所 セラミック電子部品
US11276659B2 (en) * 2020-02-28 2022-03-15 Micron Technology, Inc. Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW518924B (en) * 2001-03-14 2003-01-21 Sony Corp Multi-layer printed wiring board and manufacturing method therefor
US20070161223A1 (en) * 2005-12-23 2007-07-12 Phoenix Precision Technology Corporation Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
CN103053228A (zh) * 2010-08-02 2013-04-17 安美特德国有限公司 用于在衬底上形成焊料沉积和非熔融凸块结构的方法
TW201433220A (zh) * 2012-11-30 2014-08-16 Jx Nippon Mining & Metals Corp 附載體銅箔
WO2016047181A1 (ja) * 2014-09-25 2016-03-31 大日本印刷株式会社 パワーモジュール用金属配線付基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線付基板の製造方法
US9357644B2 (en) * 2011-10-26 2016-05-31 Kabushiki Kaisha Toshiba Joined structural body of members, joining method of members, and package for containing an electronic component
WO2016180944A1 (en) * 2015-05-13 2016-11-17 Atotech Deutschland Gmbh Method for manufacturing of fine line circuitry

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2836581A1 (de) * 1978-08-21 1980-03-06 Henkel Kgaa N-(2,3-dihydroxypropyl)-pyridiniumsulfate, deren herstellung sowie diese enthaltende saure galvanische nickelbaeder
US5693209A (en) 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
US5503877A (en) 1989-11-17 1996-04-02 Atotech Deutschalnd Gmbh Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate
EP1054081B1 (en) 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
IT1275486B (it) * 1995-07-06 1997-08-07 Giuseppe Faranda Sistema di sintesi per l'ottenimento di piridin propil sulfo betaina, senza rischi per l'uomo e per l'ambiente
JP2000286542A (ja) * 1999-03-31 2000-10-13 Harima Chem Inc 半田付け方法及び半田付け基材
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
EP1322146A1 (en) 2001-12-18 2003-06-25 Phoenix Precision Technology Corporation Method of electroplating solder bumps on an organic circuit board
JP2003258014A (ja) * 2002-03-04 2003-09-12 Megic Corp 半導体表面上に金属バンプを形成する方法
TWI255158B (en) 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
TWI270329B (en) 2005-04-04 2007-01-01 Phoenix Prec Technology Corp Method for fabricating conducting bump structures of circuit board
TWI319297B (en) 2006-06-06 2010-01-01 Phoenix Prec Technology Corp Repair structure of circuit board having pre-soldering bumps and method thereof
CN101005733A (zh) * 2006-12-29 2007-07-25 上海芯光科技有限公司 薄型半导体照明平面集成光源模块的制造方法
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
MY158939A (en) 2008-10-21 2016-11-30 Atotech Deutschland Gmbh Method to form solder deposits on substrates
KR20100060968A (ko) * 2008-11-28 2010-06-07 삼성전기주식회사 메탈 포스트를 구비한 기판 및 그 제조방법
EP2405469B1 (en) * 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Method to form solder alloy deposits on substrates
KR101154626B1 (ko) * 2010-08-31 2012-06-08 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW518924B (en) * 2001-03-14 2003-01-21 Sony Corp Multi-layer printed wiring board and manufacturing method therefor
US20070161223A1 (en) * 2005-12-23 2007-07-12 Phoenix Precision Technology Corporation Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
CN103053228A (zh) * 2010-08-02 2013-04-17 安美特德国有限公司 用于在衬底上形成焊料沉积和非熔融凸块结构的方法
CN103053228B (zh) 2010-08-02 2016-10-05 安美特德国有限公司 用于在衬底上形成焊料沉积和非熔融凸块结构的方法
US9357644B2 (en) * 2011-10-26 2016-05-31 Kabushiki Kaisha Toshiba Joined structural body of members, joining method of members, and package for containing an electronic component
TW201433220A (zh) * 2012-11-30 2014-08-16 Jx Nippon Mining & Metals Corp 附載體銅箔
WO2016047181A1 (ja) * 2014-09-25 2016-03-31 大日本印刷株式会社 パワーモジュール用金属配線付基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線付基板の製造方法
WO2016180944A1 (en) * 2015-05-13 2016-11-17 Atotech Deutschland Gmbh Method for manufacturing of fine line circuitry

Also Published As

Publication number Publication date
TW201831064A (zh) 2018-08-16
KR20190098165A (ko) 2019-08-21
WO2018115408A1 (en) 2018-06-28
CN110115116A (zh) 2019-08-09
US11032914B2 (en) 2021-06-08
JP7143303B2 (ja) 2022-09-28
KR102346987B1 (ko) 2022-01-03
US20190350088A1 (en) 2019-11-14
EP3560304B1 (en) 2021-02-03
JP2020517088A (ja) 2020-06-11
EP3560304A1 (en) 2019-10-30
CN110115116B (zh) 2022-05-27

Similar Documents

Publication Publication Date Title
CN103898570B (zh) 锡或锡合金电镀液
JP5808402B2 (ja) はんだ合金堆積物を基板上に形成する方法
US8507376B2 (en) Method to form solder deposits on substrates
JP5808403B2 (ja) はんだ堆積物を基板上に形成する方法
CN103053228B (zh) 用于在衬底上形成焊料沉积和非熔融凸块结构的方法
EP2180770A1 (en) Method to form solder deposits on substrates
TWI683604B (zh) 於接觸墊上形成可焊接焊料沉積物的方法及在活化接觸墊上暴露可焊接焊料沉積物之印刷電路板
JP2013093360A (ja) 半導体チップ搭載用基板及びその製造方法
EP2416634A1 (en) Method to form solder deposits on substrates
EP2506690A1 (en) Method to form solder deposits and non-melting bump structures on substrates
JPH09232734A (ja) バンプ付きフレキシブルプリント回路及びその製法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees