JP7143303B2 - コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法 - Google Patents

コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法 Download PDF

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JP7143303B2
JP7143303B2 JP2019534079A JP2019534079A JP7143303B2 JP 7143303 B2 JP7143303 B2 JP 7143303B2 JP 2019534079 A JP2019534079 A JP 2019534079A JP 2019534079 A JP2019534079 A JP 2019534079A JP 7143303 B2 JP7143303 B2 JP 7143303B2
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nickel
tin
activated
alloy
deposited
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Japanese (ja)
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JP2020517088A (ja
JP2020517088A5 (https=
Inventor
マテヤート カイ－イェンス
ランプレヒト スヴェン
シュペアリング ヤン
オーデ クリスティアン
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2019534079A 2016-12-23 2017-12-22 コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法 Active JP7143303B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16206665 2016-12-23
EP16206665.8 2016-12-23
PCT/EP2017/084320 WO2018115408A1 (en) 2016-12-23 2017-12-22 Method of forming a solderable solder deposit on a contact pad

Publications (3)

Publication Number Publication Date
JP2020517088A JP2020517088A (ja) 2020-06-11
JP2020517088A5 JP2020517088A5 (https=) 2021-02-04
JP7143303B2 true JP7143303B2 (ja) 2022-09-28

Family

ID=57714447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019534079A Active JP7143303B2 (ja) 2016-12-23 2017-12-22 コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法

Country Status (7)

Country Link
US (1) US11032914B2 (https=)
EP (1) EP3560304B1 (https=)
JP (1) JP7143303B2 (https=)
KR (1) KR102346987B1 (https=)
CN (1) CN110115116B (https=)
TW (1) TWI683604B (https=)
WO (1) WO2018115408A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6696567B2 (ja) 2016-05-16 2020-05-20 株式会社村田製作所 セラミック電子部品
US11276659B2 (en) * 2020-02-28 2022-03-15 Micron Technology, Inc. Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270987A (en) 1978-08-21 1981-06-02 Henkel Kommanditgesellschaft Auf Aktien Acid galvanic nickel baths containing N-(2,3-dihydroxypropyl)-pyridinium sulfates
US5723622A (en) 1995-07-06 1998-03-03 Faranda; Giuseppe Synthetic method for making pyridin-propyl-sulphobetaine without any risks for the human beings and the environment
JP2003258014A (ja) 2002-03-04 2003-09-12 Megic Corp 半導体表面上に金属バンプを形成する方法
US20060043158A1 (en) 2004-09-01 2006-03-02 Phoenix Precision Technology Corporation Method for fabricating electrical connections of circuit board
JP2010129996A (ja) 2008-11-28 2010-06-10 Samsung Electro-Mechanics Co Ltd メタルポストを備えた基板及びその製造方法
JP2012506628A (ja) 2008-10-21 2012-03-15 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物を形成する方法
JP2013531895A (ja) 2010-07-05 2013-08-08 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング はんだ合金堆積物を基板上に形成する方法
JP2013534367A (ja) 2010-08-02 2013-09-02 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物および非溶融バンプを形成する方法

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US5693209A (en) 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
US5503877A (en) 1989-11-17 1996-04-02 Atotech Deutschalnd Gmbh Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate
EP1054081B1 (en) 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
JP2000286542A (ja) * 1999-03-31 2000-10-13 Harima Chem Inc 半田付け方法及び半田付け基材
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
JP2002271026A (ja) 2001-03-14 2002-09-20 Sony Corp 多層型プリント配線基板及び多層型プリント配線基板の製造方法
EP1322146A1 (en) 2001-12-18 2003-06-25 Phoenix Precision Technology Corporation Method of electroplating solder bumps on an organic circuit board
TWI270329B (en) 2005-04-04 2007-01-01 Phoenix Prec Technology Corp Method for fabricating conducting bump structures of circuit board
US7659193B2 (en) * 2005-12-23 2010-02-09 Phoenix Precision Technology Corporation Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
TWI319297B (en) 2006-06-06 2010-01-01 Phoenix Prec Technology Corp Repair structure of circuit board having pre-soldering bumps and method thereof
CN101005733A (zh) * 2006-12-29 2007-07-25 上海芯光科技有限公司 薄型半导体照明平面集成光源模块的制造方法
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
KR101154626B1 (ko) * 2010-08-31 2012-06-08 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP5588419B2 (ja) 2011-10-26 2014-09-10 株式会社東芝 パッケージ
JP5364838B1 (ja) 2012-11-30 2013-12-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP6032254B2 (ja) 2013-10-11 2016-11-24 大日本印刷株式会社 パワーモジュール用金属配線付基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線付基板の製造方法
WO2016180944A1 (en) 2015-05-13 2016-11-17 Atotech Deutschland Gmbh Method for manufacturing of fine line circuitry

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270987A (en) 1978-08-21 1981-06-02 Henkel Kommanditgesellschaft Auf Aktien Acid galvanic nickel baths containing N-(2,3-dihydroxypropyl)-pyridinium sulfates
US5723622A (en) 1995-07-06 1998-03-03 Faranda; Giuseppe Synthetic method for making pyridin-propyl-sulphobetaine without any risks for the human beings and the environment
JP2003258014A (ja) 2002-03-04 2003-09-12 Megic Corp 半導体表面上に金属バンプを形成する方法
US20060043158A1 (en) 2004-09-01 2006-03-02 Phoenix Precision Technology Corporation Method for fabricating electrical connections of circuit board
JP2012506628A (ja) 2008-10-21 2012-03-15 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物を形成する方法
JP2010129996A (ja) 2008-11-28 2010-06-10 Samsung Electro-Mechanics Co Ltd メタルポストを備えた基板及びその製造方法
JP2013531895A (ja) 2010-07-05 2013-08-08 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング はんだ合金堆積物を基板上に形成する方法
JP2013534367A (ja) 2010-08-02 2013-09-02 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物および非溶融バンプを形成する方法

Also Published As

Publication number Publication date
TW201831064A (zh) 2018-08-16
KR20190098165A (ko) 2019-08-21
WO2018115408A1 (en) 2018-06-28
CN110115116A (zh) 2019-08-09
US11032914B2 (en) 2021-06-08
KR102346987B1 (ko) 2022-01-03
US20190350088A1 (en) 2019-11-14
EP3560304B1 (en) 2021-02-03
JP2020517088A (ja) 2020-06-11
EP3560304A1 (en) 2019-10-30
TWI683604B (zh) 2020-01-21
CN110115116B (zh) 2022-05-27

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