JP2020516050A5 - - Google Patents
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- Publication number
- JP2020516050A5 JP2020516050A5 JP2019539221A JP2019539221A JP2020516050A5 JP 2020516050 A5 JP2020516050 A5 JP 2020516050A5 JP 2019539221 A JP2019539221 A JP 2019539221A JP 2019539221 A JP2019539221 A JP 2019539221A JP 2020516050 A5 JP2020516050 A5 JP 2020516050A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- platinum
- top surface
- sacrificial
- sacrificial layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 100
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 92
- 238000000034 method Methods 0.000 claims 50
- 229910052697 platinum Inorganic materials 0.000 claims 46
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 16
- 229910052782 aluminium Inorganic materials 0.000 claims 16
- 238000000151 deposition Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 9
- 229920002120 photoresistant polymer Polymers 0.000 claims 6
- 238000001039 wet etching Methods 0.000 claims 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 5
- 239000012790 adhesive layer Substances 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 5
- 229910052719 titanium Inorganic materials 0.000 claims 5
- 239000010936 titanium Substances 0.000 claims 5
- 238000000059 patterning Methods 0.000 claims 4
- 238000004544 sputter deposition Methods 0.000 claims 4
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 238000005137 deposition process Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762448110P | 2017-01-19 | 2017-01-19 | |
| US62/448,110 | 2017-01-19 | ||
| US15/658,039 US10297497B2 (en) | 2017-01-19 | 2017-07-24 | Sacrificial layer for platinum patterning |
| US15/658,039 | 2017-07-24 | ||
| PCT/US2018/014531 WO2018136802A1 (en) | 2017-01-19 | 2018-01-19 | Sacrificial layer for platinum patterning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020516050A JP2020516050A (ja) | 2020-05-28 |
| JP2020516050A5 true JP2020516050A5 (enExample) | 2021-02-25 |
| JP7219521B2 JP7219521B2 (ja) | 2023-02-08 |
Family
ID=62841661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019539221A Active JP7219521B2 (ja) | 2017-01-19 | 2018-01-19 | プラチナパターニングのための犠牲層 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10297497B2 (enExample) |
| EP (1) | EP3571711B1 (enExample) |
| JP (1) | JP7219521B2 (enExample) |
| CN (1) | CN110337710B (enExample) |
| WO (1) | WO2018136802A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11011381B2 (en) * | 2018-07-27 | 2021-05-18 | Texas Instruments Incorporated | Patterning platinum by alloying and etching platinum alloy |
| CN111945128A (zh) * | 2020-08-18 | 2020-11-17 | 江苏能华微电子科技发展有限公司 | 一种提高铂与衬底黏附性的方法及其产品 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4497684A (en) * | 1983-02-22 | 1985-02-05 | Amdahl Corporation | Lift-off process for depositing metal on a substrate |
| JPS59165425A (ja) * | 1983-03-10 | 1984-09-18 | Matsushita Electric Ind Co Ltd | パタ−ン形成方法 |
| JPH065717A (ja) * | 1992-06-19 | 1994-01-14 | Toshiba Corp | 電極へのオーム性接続金属層の形成方法 |
| JPH07130702A (ja) * | 1993-11-08 | 1995-05-19 | Fujitsu Ltd | 白金又はパラジウムよりなる金属膜のパターニング方法 |
| JPH07273280A (ja) * | 1994-03-29 | 1995-10-20 | Tokin Corp | 薄膜パターンの形成方法 |
| US5914507A (en) | 1994-05-11 | 1999-06-22 | Regents Of The University Of Minnesota | PZT microdevice |
| KR100224660B1 (ko) | 1996-06-17 | 1999-10-15 | 윤종용 | 백금-폴리실리콘 게이트 형성방법 |
| JP3481415B2 (ja) * | 1997-03-19 | 2003-12-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
| US6218297B1 (en) * | 1998-09-03 | 2001-04-17 | Micron Technology, Inc. | Patterning conductive metal layers and methods using same |
| JP3159255B2 (ja) * | 1998-09-16 | 2001-04-23 | 日本電気株式会社 | 強誘電体容量で用いる電極のスパッタ成長方法 |
| JP3591529B2 (ja) * | 2001-08-03 | 2004-11-24 | ヤマハ株式会社 | 貴金属薄膜パターンの形成方法 |
| US6956274B2 (en) * | 2002-01-11 | 2005-10-18 | Analog Devices, Inc. | TiW platinum interconnect and method of making the same |
| US7829215B2 (en) | 2005-08-29 | 2010-11-09 | University Of South Florida | Surface micromachined electrolyte-cavities for use in micro-aluminum galvanic cells |
| CN100479102C (zh) * | 2006-08-29 | 2009-04-15 | 中国科学院声学研究所 | 一种图形化铂/钛金属薄膜的剥离制备方法 |
| US20080124823A1 (en) * | 2006-11-24 | 2008-05-29 | United Microdisplay Optronics Corp. | Method of fabricating patterned layer using lift-off process |
| KR101045090B1 (ko) * | 2008-11-13 | 2011-06-29 | 주식회사 하이닉스반도체 | 반도체 소자의 미세 패턴 형성방법 |
| RU2426193C1 (ru) | 2010-05-05 | 2011-08-10 | Федеральное государственное бюджетное учреждение "Национальный исследовательский центр "Курчатовский институт" | Способ нанесения платиновых слоев на подложку |
| MY151464A (en) * | 2010-12-09 | 2014-05-30 | Mimos Berhad | A method of fabricating a semiconductor device |
| US9006105B2 (en) | 2013-07-30 | 2015-04-14 | United Microelectronics Corp. | Method of patterning platinum layer |
| JP6176025B2 (ja) * | 2013-09-25 | 2017-08-09 | 日亜化学工業株式会社 | 金属膜の形成方法及び発光素子の製造方法 |
| EP3050105B1 (en) | 2013-09-27 | 2020-11-11 | Robert Bosch GmbH | Semiconductor bolometer and method of fabrication thereof |
-
2017
- 2017-07-24 US US15/658,039 patent/US10297497B2/en active Active
-
2018
- 2018-01-19 CN CN201880014141.5A patent/CN110337710B/zh active Active
- 2018-01-19 EP EP18742117.7A patent/EP3571711B1/en active Active
- 2018-01-19 WO PCT/US2018/014531 patent/WO2018136802A1/en not_active Ceased
- 2018-01-19 JP JP2019539221A patent/JP7219521B2/ja active Active
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