JP2017017072A5 - - Google Patents
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- JP2017017072A5 JP2017017072A5 JP2015129211A JP2015129211A JP2017017072A5 JP 2017017072 A5 JP2017017072 A5 JP 2017017072A5 JP 2015129211 A JP2015129211 A JP 2015129211A JP 2015129211 A JP2015129211 A JP 2015129211A JP 2017017072 A5 JP2017017072 A5 JP 2017017072A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- film
- resist film
- forming
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001020 plasma etching Methods 0.000 claims description 5
- 238000004380 ashing Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015129211A JP6582616B2 (ja) | 2015-06-26 | 2015-06-26 | 半導体チップの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015129211A JP6582616B2 (ja) | 2015-06-26 | 2015-06-26 | 半導体チップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017017072A JP2017017072A (ja) | 2017-01-19 |
| JP2017017072A5 true JP2017017072A5 (enExample) | 2018-09-13 |
| JP6582616B2 JP6582616B2 (ja) | 2019-10-02 |
Family
ID=57831009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015129211A Active JP6582616B2 (ja) | 2015-06-26 | 2015-06-26 | 半導体チップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6582616B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6424996B1 (ja) * | 2017-02-01 | 2018-11-21 | 株式会社村田製作所 | Ｃｓｐ型半導体デバイスおよびその製造方法 |
| JP2018186240A (ja) * | 2017-04-27 | 2018-11-22 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2020013059A (ja) * | 2018-07-20 | 2020-01-23 | 株式会社東芝 | 装置の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287241A (ja) * | 1985-06-14 | 1986-12-17 | Sharp Corp | 半導体素子の製造方法 |
| JPH08120443A (ja) * | 1994-10-21 | 1996-05-14 | Fuji Elelctrochem Co Ltd | リフトオフによる膜パターン形成方法 |
| DE10031252A1 (de) * | 2000-06-27 | 2002-01-10 | Bosch Gmbh Robert | Verfahren zur Zertrennung eines Substratwafers in eine Anzahl von Substratchips |
| JP2002184698A (ja) * | 2000-12-18 | 2002-06-28 | Murata Mfg Co Ltd | 電子部品の製造方法 |
-
2015
- 2015-06-26 JP JP2015129211A patent/JP6582616B2/ja active Active
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