MY151464A - A method of fabricating a semiconductor device - Google Patents

A method of fabricating a semiconductor device

Info

Publication number
MY151464A
MY151464A MYUI2010005859A MY151464A MY 151464 A MY151464 A MY 151464A MY UI2010005859 A MYUI2010005859 A MY UI2010005859A MY 151464 A MY151464 A MY 151464A
Authority
MY
Malaysia
Prior art keywords
sacrificial layer
fabricating
semiconductor device
depositing
onto
Prior art date
Application number
Inventor
Lee Hing Wah
Daniel Bien Chia Sheng
Mohd Ismahadi Syono
Rozina Abdul Rani
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Publication of MY151464A publication Critical patent/MY151464A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING A LIFT-OFF METHOD. THE METHOD COMPRISES THE STEPS OF DEPOSITING AND PATTERNING A SACRIFICIAL LAYER (22) ONTO A SUBSTRATE (21), WHEREIN AT LEAST ONE PORTION OF THE SUBSTRATE SURFACE (21A) IS COVERED BY THE SACRIFICIAL LAYER (22) AND AT LEAST ONE PORTION OF THE SUBSTRATE SURFACE (21B) IS EXPOSED; DEPOSITING AND PATTERNING A CHEMICAL RESIST (23) ONTO THE SACRIFICIAL LAYER (22) AND THE EXPOSED SUBSTRATE SURFACE (21 B); REMOVING THE SACRIFICIAL LAYER (22); DEPOSITING A SEMICONDUCTOR FILM (24) ONTO THE SUBSTRATE (21) AND THE CHEMICAL RESIST (23); AND REMOVING THE CHEMICAL RESIST (23) AND THE SEMICONDUCTOR FILM (24) DEPOSITED ON THE CHEMICAL RESIST (23).
MYUI2010005859 2010-12-09 2010-12-09 A method of fabricating a semiconductor device MY151464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2010005859 2010-12-09

Publications (1)

Publication Number Publication Date
MY151464A true MY151464A (en) 2014-05-30

Family

ID=46207363

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2010005859 MY151464A (en) 2010-12-09 2010-12-09 A method of fabricating a semiconductor device

Country Status (2)

Country Link
MY (1) MY151464A (en)
WO (1) WO2012078025A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10297497B2 (en) * 2017-01-19 2019-05-21 Texas Instruments Incorporated Sacrificial layer for platinum patterning

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497684A (en) * 1983-02-22 1985-02-05 Amdahl Corporation Lift-off process for depositing metal on a substrate
US6495311B1 (en) * 2000-03-17 2002-12-17 International Business Machines Corporation Bilayer liftoff process for high moment laminate
US7319076B2 (en) * 2003-09-26 2008-01-15 Intel Corporation Low resistance T-shaped ridge structure
US8183162B2 (en) * 2008-09-12 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a sacrificial layer

Also Published As

Publication number Publication date
WO2012078025A1 (en) 2012-06-14

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