JP2020514964A5 - - Google Patents
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- Publication number
- JP2020514964A5 JP2020514964A5 JP2019533318A JP2019533318A JP2020514964A5 JP 2020514964 A5 JP2020514964 A5 JP 2020514964A5 JP 2019533318 A JP2019533318 A JP 2019533318A JP 2019533318 A JP2019533318 A JP 2019533318A JP 2020514964 A5 JP2020514964 A5 JP 2020514964A5
- Authority
- JP
- Japan
- Prior art keywords
- particles
- conductive
- core
- core particles
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 claims 24
- 239000007771 core particle Substances 0.000 claims 17
- 229910052751 metal Inorganic materials 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 12
- 239000011159 matrix material Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 239000000463 material Substances 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 4
- 239000002241 glass-ceramic Substances 0.000 claims 4
- 239000002243 precursor Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662437236P | 2016-12-21 | 2016-12-21 | |
| US62/437,236 | 2016-12-21 | ||
| PCT/US2017/067247 WO2018118880A1 (en) | 2016-12-21 | 2017-12-19 | Conductive particles, articles, and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020514964A JP2020514964A (ja) | 2020-05-21 |
| JP2020514964A5 true JP2020514964A5 (enExample) | 2021-02-12 |
Family
ID=61132889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019533318A Withdrawn JP2020514964A (ja) | 2016-12-21 | 2017-12-19 | 導電性粒子、物品、及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10964441B2 (enExample) |
| EP (1) | EP3559958B1 (enExample) |
| JP (1) | JP2020514964A (enExample) |
| KR (1) | KR102458776B1 (enExample) |
| CN (1) | CN110088847B (enExample) |
| WO (1) | WO2018118880A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110041849A (zh) * | 2019-04-25 | 2019-07-23 | 永道无线射频标签(扬州)有限公司 | 一种z向导电性能强化的导电胶 |
| CN112625657B (zh) * | 2019-09-24 | 2022-01-14 | 华为技术有限公司 | 导热体、导热材料和半导体器件的封装结构 |
| US20230287248A1 (en) * | 2020-07-29 | 2023-09-14 | 3M Innovative Properties Company | Electrically Conductive Adhesive Film |
| KR102460883B1 (ko) * | 2020-12-07 | 2022-11-02 | 덕산하이메탈(주) | 전도성 입자 |
| WO2024058115A1 (ja) * | 2022-09-16 | 2024-03-21 | サトーホールディングス株式会社 | 導電性基材の製造方法、電子デバイスの製造方法、電磁波シールドフィルムの製造方法、面状発熱体の製造方法および導電性組成物 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4125665A (en) | 1977-08-29 | 1978-11-14 | Johnson & Johnson | Container sealing tape |
| US4152231A (en) | 1978-10-26 | 1979-05-01 | Shell Oil Company | Radiation cured polydiene based polymer composition |
| JPS608214A (ja) | 1983-06-27 | 1985-01-17 | Mitsubishi Rayon Co Ltd | 歯科用材料 |
| US4656213A (en) | 1984-10-26 | 1987-04-07 | Atlantic Richfield Company | Acrylic hot melt pressure sensitive adhesive compounds |
| US4612242A (en) | 1985-06-03 | 1986-09-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tape containing coated glass microbubbles |
| JP3083535B2 (ja) * | 1990-06-01 | 2000-09-04 | 積水化学工業株式会社 | 導電性微粒子及び導電性接着剤 |
| JP3608214B2 (ja) * | 1994-01-27 | 2005-01-05 | 日立化成工業株式会社 | 異方導電性シートの製造方法 |
| US5804610A (en) | 1994-09-09 | 1998-09-08 | Minnesota Mining And Manufacturing Company | Methods of making packaged viscoelastic compositions |
| US5774265A (en) | 1996-02-05 | 1998-06-30 | Minnesota Mining And Manufacturing Company | Durable retroreflective elements |
| US6734256B1 (en) | 1998-12-29 | 2004-05-11 | 3M Innovative Properties Company | Block copolymer hot-melt processable adhesives, methods of their preparation, and articles therefrom |
| JP3083535U (ja) | 2001-07-19 | 2002-02-08 | 東洋石材株式会社 | 透水性天然石敷石と透水性舗装構造 |
| JP4050086B2 (ja) * | 2002-04-24 | 2008-02-20 | ナトコ株式会社 | 導電性粒子、導電性材料および異方性導電膜 |
| CN100437838C (zh) * | 2003-07-07 | 2008-11-26 | 积水化学工业株式会社 | 包覆导电性粒子、各向异性导电材料以及导电连接结构体 |
| JP4387175B2 (ja) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
| WO2005030382A2 (en) | 2003-09-26 | 2005-04-07 | 3M Innovative Properties Company | Nanoscale gold catalysts, activating agents, support media, and related methodologies useful for making such catalyst systems especially when the gold is deposited onto the support media using physical vapor deposition |
| US20050158461A1 (en) | 2004-01-21 | 2005-07-21 | 3M Innovative Properties Company | Methods of making reflective elements |
| US7371464B2 (en) | 2005-12-23 | 2008-05-13 | 3M Innovative Properties Company | Adhesive compositions |
| JP2007207665A (ja) * | 2006-02-03 | 2007-08-16 | Sekisui Chem Co Ltd | 導電性粒子の製造方法、導電性粒子及び異方性導電材料 |
| US8701441B2 (en) | 2006-08-21 | 2014-04-22 | 3M Innovative Properties Company | Method of making inorganic, metal oxide spheres using microstructured molds |
| US8202934B2 (en) | 2007-07-31 | 2012-06-19 | 3M Innovative Properties Company | Hot melt processable polyurea copolymers and methods of their preparation and use |
| US20090110861A1 (en) | 2007-10-29 | 2009-04-30 | 3M Innovative Properties Company | Pressure sensitive adhesive article |
| US8034254B2 (en) | 2007-12-21 | 2011-10-11 | 3M Innovative Properties Company | Optical adhesive for liquid crystal display |
| CN102459490B (zh) | 2009-05-15 | 2014-04-23 | 3M创新有限公司 | 基于氨基甲酸酯的压敏粘合剂 |
| JP5439057B2 (ja) * | 2009-06-29 | 2014-03-12 | 三井金属鉱業株式会社 | 複合銅粒子 |
| KR20130129239A (ko) | 2010-12-16 | 2013-11-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 광학적으로 투명한 접착제 및 코팅을 제조하는 방법 |
| KR101151366B1 (ko) * | 2011-11-24 | 2012-06-08 | 한화케미칼 주식회사 | 도전성 입자 및 이의 제조방법 |
| WO2013096039A1 (en) | 2011-12-22 | 2013-06-27 | 3M Innovative Properties Company | Ethylene removal agent |
| WO2014104017A1 (ja) * | 2012-12-28 | 2014-07-03 | 積水化学工業株式会社 | 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体 |
| WO2015073346A1 (en) | 2013-11-15 | 2015-05-21 | 3M Innovative Properties Company | An electrically conductive article containing shaped particles and methods of making same |
| US10227496B2 (en) * | 2014-01-14 | 2019-03-12 | Toyo Aluminium Kabushiki Kaisha | Composite conductive particle, conductive resin composition containing same and conductive coated article |
| JP6507551B2 (ja) * | 2014-10-03 | 2019-05-08 | 日立化成株式会社 | 導電粒子 |
| JP2016089153A (ja) * | 2014-10-29 | 2016-05-23 | デクセリアルズ株式会社 | 導電材料 |
| WO2018042701A1 (ja) * | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | 接着剤組成物 |
| CN110312772A (zh) * | 2017-02-17 | 2019-10-08 | 日立化成株式会社 | 粘接剂膜 |
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2017
- 2017-12-19 CN CN201780078744.7A patent/CN110088847B/zh active Active
- 2017-12-19 EP EP17837923.6A patent/EP3559958B1/en active Active
- 2017-12-19 JP JP2019533318A patent/JP2020514964A/ja not_active Withdrawn
- 2017-12-19 WO PCT/US2017/067247 patent/WO2018118880A1/en not_active Ceased
- 2017-12-19 KR KR1020197018167A patent/KR102458776B1/ko active Active
- 2017-12-19 US US16/472,148 patent/US10964441B2/en active Active