JP2020514964A - 導電性粒子、物品、及び方法 - Google Patents

導電性粒子、物品、及び方法 Download PDF

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Publication number
JP2020514964A
JP2020514964A JP2019533318A JP2019533318A JP2020514964A JP 2020514964 A JP2020514964 A JP 2020514964A JP 2019533318 A JP2019533318 A JP 2019533318A JP 2019533318 A JP2019533318 A JP 2019533318A JP 2020514964 A JP2020514964 A JP 2020514964A
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JP
Japan
Prior art keywords
particles
core
conductive
core particles
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2019533318A
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English (en)
Japanese (ja)
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JP2020514964A5 (enExample
Inventor
ダブリュ． リンジー，クレイグ
ダブリュ． リンジー，クレイグ
ディー． バッド，ケントン
ディー． バッド，ケントン
ゴーシュ，ディパンカー
オー． シャンティ，ノア
オー． シャンティ，ノア
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2020514964A publication Critical patent/JP2020514964A/ja
Publication of JP2020514964A5 publication Critical patent/JP2020514964A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
JP2019533318A 2016-12-21 2017-12-19 導電性粒子、物品、及び方法 Withdrawn JP2020514964A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662437236P 2016-12-21 2016-12-21
US62/437,236 2016-12-21
PCT/US2017/067247 WO2018118880A1 (en) 2016-12-21 2017-12-19 Conductive particles, articles, and methods

Publications (2)

Publication Number Publication Date
JP2020514964A true JP2020514964A (ja) 2020-05-21
JP2020514964A5 JP2020514964A5 (enExample) 2021-02-12

Family

ID=61132889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019533318A Withdrawn JP2020514964A (ja) 2016-12-21 2017-12-19 導電性粒子、物品、及び方法

Country Status (6)

Country Link
US (1) US10964441B2 (enExample)
EP (1) EP3559958A1 (enExample)
JP (1) JP2020514964A (enExample)
KR (1) KR102458776B1 (enExample)
CN (1) CN110088847B (enExample)
WO (1) WO2018118880A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110041849A (zh) * 2019-04-25 2019-07-23 永道无线射频标签(扬州)有限公司 一种z向导电性能强化的导电胶
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
KR20230046292A (ko) * 2020-07-29 2023-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 필름
KR102460883B1 (ko) * 2020-12-07 2022-11-02 덕산하이메탈(주) 전도성 입자
WO2024058115A1 (ja) * 2022-09-16 2024-03-21 サトーホールディングス株式会社 導電性基材の製造方法、電子デバイスの製造方法、電磁波シールドフィルムの製造方法、面状発熱体の製造方法および導電性組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436902A (ja) * 1990-06-01 1992-02-06 Sekisui Fine Chem Kk 導電性微粒子及び導電性接着剤

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US4125665A (en) 1977-08-29 1978-11-14 Johnson & Johnson Container sealing tape
US4152231A (en) 1978-10-26 1979-05-01 Shell Oil Company Radiation cured polydiene based polymer composition
JPS608214A (ja) 1983-06-27 1985-01-17 Mitsubishi Rayon Co Ltd 歯科用材料
US4656213A (en) 1984-10-26 1987-04-07 Atlantic Richfield Company Acrylic hot melt pressure sensitive adhesive compounds
US4612242A (en) 1985-06-03 1986-09-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tape containing coated glass microbubbles
JP3608214B2 (ja) * 1994-01-27 2005-01-05 日立化成工業株式会社 異方導電性シートの製造方法
US5804610A (en) 1994-09-09 1998-09-08 Minnesota Mining And Manufacturing Company Methods of making packaged viscoelastic compositions
WO1997028471A1 (en) 1996-02-05 1997-08-07 Minnesota Mining And Manufacturing Company Durable retroreflective elements
US6734256B1 (en) 1998-12-29 2004-05-11 3M Innovative Properties Company Block copolymer hot-melt processable adhesives, methods of their preparation, and articles therefrom
JP3083535U (ja) 2001-07-19 2002-02-08 東洋石材株式会社 透水性天然石敷石と透水性舗装構造
JP4050086B2 (ja) * 2002-04-24 2008-02-20 ナトコ株式会社 導電性粒子、導電性材料および異方性導電膜
JP4387175B2 (ja) 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
AU2004275787B2 (en) 2003-09-26 2010-06-17 3M Innovative Properties Company Nanoscale gold catalysts, activating agents, support media, and related methodologies useful for making such catalyst systems especially when the gold is deposited onto the support media using physical vapor deposition
US20050158461A1 (en) 2004-01-21 2005-07-21 3M Innovative Properties Company Methods of making reflective elements
US7371464B2 (en) 2005-12-23 2008-05-13 3M Innovative Properties Company Adhesive compositions
JP2007207665A (ja) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd 導電性粒子の製造方法、導電性粒子及び異方性導電材料
US8701441B2 (en) 2006-08-21 2014-04-22 3M Innovative Properties Company Method of making inorganic, metal oxide spheres using microstructured molds
US8202934B2 (en) 2007-07-31 2012-06-19 3M Innovative Properties Company Hot melt processable polyurea copolymers and methods of their preparation and use
US20090110861A1 (en) 2007-10-29 2009-04-30 3M Innovative Properties Company Pressure sensitive adhesive article
US8034254B2 (en) 2007-12-21 2011-10-11 3M Innovative Properties Company Optical adhesive for liquid crystal display
WO2010132176A2 (en) 2009-05-15 2010-11-18 3M Innovative Properties Company Urethane-based pressure sensitive adhesives
JP5439057B2 (ja) * 2009-06-29 2014-03-12 三井金属鉱業株式会社 複合銅粒子
US9841534B2 (en) 2010-12-16 2017-12-12 3M Innovative Properties Company Methods for preparing optically clear adhesives and coatings
KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
US20140363554A1 (en) 2011-12-22 2014-12-11 3M Innovative Properties Company Ethylene removal agent
KR102095290B1 (ko) * 2012-12-28 2020-03-31 세키스이가가쿠 고교가부시키가이샤 유기 무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체
JP6591413B2 (ja) 2013-11-15 2019-10-16 スリーエム イノベイティブ プロパティズ カンパニー 成形粒子を含有する導電性物品及びその作製方法
JP6579958B2 (ja) * 2014-01-14 2019-09-25 東洋アルミニウム株式会社 複合導電性粒子、それを含む導電性樹脂組成物および導電性塗布物
JP6507551B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
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Patent Citations (1)

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JPH0436902A (ja) * 1990-06-01 1992-02-06 Sekisui Fine Chem Kk 導電性微粒子及び導電性接着剤

Also Published As

Publication number Publication date
US20190326031A1 (en) 2019-10-24
CN110088847B (zh) 2021-07-06
KR102458776B1 (ko) 2022-10-25
WO2018118880A1 (en) 2018-06-28
EP3559958A1 (en) 2019-10-30
US10964441B2 (en) 2021-03-30
CN110088847A (zh) 2019-08-02
KR20190097069A (ko) 2019-08-20

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