KR102458776B1 - 전도성 입자, 물품 및 방법 - Google Patents

전도성 입자, 물품 및 방법 Download PDF

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KR102458776B1
KR102458776B1 KR1020197018167A KR20197018167A KR102458776B1 KR 102458776 B1 KR102458776 B1 KR 102458776B1 KR 1020197018167 A KR1020197018167 A KR 1020197018167A KR 20197018167 A KR20197018167 A KR 20197018167A KR 102458776 B1 KR102458776 B1 KR 102458776B1
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particles
particle
core
conductive
glass
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KR20190097069A (ko
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크레이그 더블유 린제이
켄톤 디 버드
디팬카르 고쉬
노아 오 산티
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쓰리엠 이노베이티브 프로퍼티즈 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
KR1020197018167A 2016-12-21 2017-12-19 전도성 입자, 물품 및 방법 Active KR102458776B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662437236P 2016-12-21 2016-12-21
US62/437,236 2016-12-21
PCT/US2017/067247 WO2018118880A1 (en) 2016-12-21 2017-12-19 Conductive particles, articles, and methods

Publications (2)

Publication Number Publication Date
KR20190097069A KR20190097069A (ko) 2019-08-20
KR102458776B1 true KR102458776B1 (ko) 2022-10-25

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Country Link
US (1) US10964441B2 (enExample)
EP (1) EP3559958A1 (enExample)
JP (1) JP2020514964A (enExample)
KR (1) KR102458776B1 (enExample)
CN (1) CN110088847B (enExample)
WO (1) WO2018118880A1 (enExample)

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CN110041849A (zh) * 2019-04-25 2019-07-23 永道无线射频标签(扬州)有限公司 一种z向导电性能强化的导电胶
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
US20230287248A1 (en) * 2020-07-29 2023-09-14 3M Innovative Properties Company Electrically Conductive Adhesive Film
KR102460883B1 (ko) * 2020-12-07 2022-11-02 덕산하이메탈(주) 전도성 입자
JP2024043509A (ja) * 2022-09-16 2024-03-29 サトーホールディングス株式会社 導電性基材の製造方法、電子デバイスの製造方法、電磁波シールドフィルムの製造方法、面状発熱体の製造方法および導電性組成物

Citations (3)

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JP3083535B2 (ja) 1990-06-01 2000-09-04 積水化学工業株式会社 導電性微粒子及び導電性接着剤
JP2003317546A (ja) 2002-04-24 2003-11-07 Natoko Kk 導電性粒子、導電性材料および異方性導電膜
WO2005004172A1 (ja) 2003-07-07 2005-01-13 Sekisui Chemical Co., Ltd. 被覆導電性粒子、異方性導電材料及び導電接続構造体

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JPS608214A (ja) 1983-06-27 1985-01-17 Mitsubishi Rayon Co Ltd 歯科用材料
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JP3083535B2 (ja) 1990-06-01 2000-09-04 積水化学工業株式会社 導電性微粒子及び導電性接着剤
JP2003317546A (ja) 2002-04-24 2003-11-07 Natoko Kk 導電性粒子、導電性材料および異方性導電膜
WO2005004172A1 (ja) 2003-07-07 2005-01-13 Sekisui Chemical Co., Ltd. 被覆導電性粒子、異方性導電材料及び導電接続構造体

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KR20190097069A (ko) 2019-08-20
US20190326031A1 (en) 2019-10-24
JP2020514964A (ja) 2020-05-21
US10964441B2 (en) 2021-03-30
EP3559958A1 (en) 2019-10-30
CN110088847A (zh) 2019-08-02
CN110088847B (zh) 2021-07-06
WO2018118880A1 (en) 2018-06-28

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