JP2018111883A5 - - Google Patents

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Publication number
JP2018111883A5
JP2018111883A5 JP2018020004A JP2018020004A JP2018111883A5 JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5 JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5
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JP
Japan
Prior art keywords
composite material
diamond
material according
diamond composite
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018020004A
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English (en)
Japanese (ja)
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JP2018111883A (ja
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Application filed filed Critical
Publication of JP2018111883A publication Critical patent/JP2018111883A/ja
Publication of JP2018111883A5 publication Critical patent/JP2018111883A5/ja
Pending legal-status Critical Current

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JP2018020004A 2014-09-02 2018-02-07 ダイヤモンド複合材料、及び放熱部材 Pending JP2018111883A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014178434 2014-09-02
JP2014178434 2014-09-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016546659A Division JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材

Publications (2)

Publication Number Publication Date
JP2018111883A JP2018111883A (ja) 2018-07-19
JP2018111883A5 true JP2018111883A5 (enExample) 2018-10-04

Family

ID=55439855

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016546659A Active JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材
JP2018020004A Pending JP2018111883A (ja) 2014-09-02 2018-02-07 ダイヤモンド複合材料、及び放熱部材

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2016546659A Active JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材

Country Status (5)

Country Link
US (1) US20170145280A1 (enExample)
EP (1) EP3190198B1 (enExample)
JP (2) JP6292688B2 (enExample)
CN (3) CN106795596A (enExample)
WO (1) WO2016035795A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5807935B1 (ja) 2014-10-09 2015-11-10 株式会社半導体熱研究所 放熱基板と、それを使用した半導体用モジュール
JP2019071328A (ja) * 2017-10-06 2019-05-09 株式会社豊田中央研究所 半導体実装基板、半導体モジュールおよび半導体実装基板の製造方法
CN111727266B (zh) 2018-02-14 2021-11-02 住友电气工业株式会社 复合部件以及复合部件的制造方法
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method
WO2020012821A1 (ja) * 2018-07-12 2020-01-16 住友電気工業株式会社 複合部材
EP3872204A4 (en) 2018-10-25 2022-07-27 Sumitomo Electric Industries, Ltd. COMPOSITE ELEMENT
EP3876275A4 (en) * 2018-10-31 2022-08-03 Sumitomo Electric Industries, Ltd. HEAT RADIATOR
JP7350058B2 (ja) * 2019-03-29 2023-09-25 株式会社アライドマテリアル 複合材料
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
WO2021192916A1 (ja) * 2020-03-24 2021-09-30 住友電気工業株式会社 複合材料、及び放熱部材
FI4134457T3 (fi) * 2020-04-09 2024-11-12 Sumitomo Electric Industries Komposiittimateriaali, jäähdytyslevy sekä puolijohdelaite
CN111421141B (zh) * 2020-04-20 2022-05-24 浙江工业大学 一种定向高导热金刚石/金属基复合材料的制备方法
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
US12195666B2 (en) * 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same
EP4244887A4 (en) * 2020-11-18 2024-10-09 Sharfi, Benjamin K. DIAMOND-BASED THERMAL COOLING METHODS, DEVICES AND MATERIALS
KR102576792B1 (ko) 2021-06-08 2023-09-11 주식회사 더굿시스템 복합재료 및 방열부품
CN114086047B (zh) * 2021-11-22 2022-05-31 合肥哈瑞克机电科技有限公司 一种高导热复合材料及其制备方法
KR102685109B1 (ko) * 2021-12-13 2024-07-15 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
KR102884605B1 (ko) 2022-05-25 2025-11-13 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
JPWO2024157803A1 (enExample) * 2023-01-23 2024-08-02
CN121039317A (zh) * 2023-04-05 2025-11-28 积水化学工业株式会社 金刚石复合粒子、树脂组合物

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US3650714A (en) * 1969-03-04 1972-03-21 Permattach Diamond Tool Corp A method of coating diamond particles with metal
US5834115A (en) * 1995-05-02 1998-11-10 Technical Research Associates, Inc. Metal and carbonaceous materials composites
US5976205A (en) * 1996-12-02 1999-11-02 Norton Company Abrasive tool
US6096414A (en) * 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
TW554348B (en) * 1999-05-13 2003-09-21 Shinetsu Chemical Co Conductive powder and making process
RU2247794C2 (ru) * 2000-06-30 2005-03-10 Сент-Гобэн Абразивс, Инк. Способ покрытия суперабразива металлом
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
JP2004200346A (ja) * 2002-12-18 2004-07-15 Sumitomo Electric Ind Ltd 半導体素子収納用パッケージ、その製造方法及び半導体装置
US6968990B2 (en) * 2003-01-23 2005-11-29 General Electric Company Fabrication and utilization of metallic powder prepared without melting
CN101035876A (zh) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 导热性组合物及其制备方法
WO2007121052A2 (en) * 2006-04-13 2007-10-25 3M Innovative Properties Company Metal-coated superabrasive material and methods of making the same
CN1944698A (zh) * 2006-10-24 2007-04-11 北京科技大学 一种超高导热、低热膨胀系数的复合材料及其制备方法
US20100206941A1 (en) * 2007-05-22 2010-08-19 David Patrick Egan Coated diamond
WO2011049479A1 (en) * 2009-10-21 2011-04-28 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity and process of fabricating same
CN101985702B (zh) * 2010-06-29 2013-02-06 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
JP5896400B2 (ja) * 2011-11-25 2016-03-30 トーメイダイヤ株式会社 ダイヤモンド含有ヒートシンク材及びその製法
US9035448B2 (en) * 2012-06-29 2015-05-19 Materion Corporation Semiconductor packages having metal composite base plates

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