JP2018111883A5 - - Google Patents

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Publication number
JP2018111883A5
JP2018111883A5 JP2018020004A JP2018020004A JP2018111883A5 JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5 JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5
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JP
Japan
Prior art keywords
composite material
diamond
material according
diamond composite
less
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Pending
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JP2018020004A
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English (en)
Japanese (ja)
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JP2018111883A (ja
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Publication of JP2018111883A publication Critical patent/JP2018111883A/ja
Publication of JP2018111883A5 publication Critical patent/JP2018111883A5/ja
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JP2018020004A 2014-09-02 2018-02-07 ダイヤモンド複合材料、及び放熱部材 Pending JP2018111883A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014178434 2014-09-02
JP2014178434 2014-09-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016546659A Division JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材

Publications (2)

Publication Number Publication Date
JP2018111883A JP2018111883A (ja) 2018-07-19
JP2018111883A5 true JP2018111883A5 (enExample) 2018-10-04

Family

ID=55439855

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016546659A Active JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材
JP2018020004A Pending JP2018111883A (ja) 2014-09-02 2018-02-07 ダイヤモンド複合材料、及び放熱部材

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2016546659A Active JP6292688B2 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材

Country Status (5)

Country Link
US (1) US12503633B2 (enExample)
EP (1) EP3190198B1 (enExample)
JP (2) JP6292688B2 (enExample)
CN (3) CN106795596A (enExample)
WO (1) WO2016035795A1 (enExample)

Families Citing this family (21)

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Publication number Priority date Publication date Assignee Title
JP5807935B1 (ja) 2014-10-09 2015-11-10 株式会社半導体熱研究所 放熱基板と、それを使用した半導体用モジュール
JP2019071328A (ja) * 2017-10-06 2019-05-09 株式会社豊田中央研究所 半導体実装基板、半導体モジュールおよび半導体実装基板の製造方法
CN111727266B (zh) 2018-02-14 2021-11-02 住友电气工业株式会社 复合部件以及复合部件的制造方法
EP3757240B1 (en) * 2018-02-21 2025-01-22 Sumitomo Electric Industries, Ltd. Composite material and method for producing composite material
JP7189214B2 (ja) * 2018-07-12 2022-12-13 住友電気工業株式会社 複合部材
WO2020084903A1 (ja) 2018-10-25 2020-04-30 住友電気工業株式会社 複合部材
US12112993B2 (en) 2018-10-31 2024-10-08 A.L.M.T. Corp. Heat radiation member
KR102818980B1 (ko) * 2019-03-29 2025-06-10 가부시끼가이샤 아라이도 마테리아루 복합 재료
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
EP4130309A1 (en) * 2020-03-24 2023-02-08 Sumitomo Electric Industries, Ltd. Composite material and heat dissipation member
US12252766B2 (en) * 2020-04-09 2025-03-18 Sumitomo Electric Industries, Ltd. Composite material, heat sink and semiconductor device
CN111421141B (zh) * 2020-04-20 2022-05-24 浙江工业大学 一种定向高导热金刚石/金属基复合材料的制备方法
US12195666B2 (en) * 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
EP4244887A4 (en) * 2020-11-18 2024-10-09 Sharfi, Benjamin K. DIAMOND-BASED THERMAL COOLING METHODS, DEVICES AND MATERIALS
KR102576792B1 (ko) 2021-06-08 2023-09-11 주식회사 더굿시스템 복합재료 및 방열부품
CN114086047B (zh) * 2021-11-22 2022-05-31 合肥哈瑞克机电科技有限公司 一种高导热复合材料及其制备方法
KR102685109B1 (ko) 2021-12-13 2024-07-15 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
KR102884605B1 (ko) 2022-05-25 2025-11-13 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
EP4656749A1 (en) 2023-01-23 2025-12-03 Asahi Diamond Industrial Co., Ltd. Composite material and method for producing same
TW202502654A (zh) * 2023-04-05 2025-01-16 日商積水化學工業股份有限公司 鑽石複合粒子、樹脂組成物

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US3650714A (en) * 1969-03-04 1972-03-21 Permattach Diamond Tool Corp A method of coating diamond particles with metal
US5834115A (en) * 1995-05-02 1998-11-10 Technical Research Associates, Inc. Metal and carbonaceous materials composites
US5976205A (en) * 1996-12-02 1999-11-02 Norton Company Abrasive tool
US6096414A (en) * 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
KR100537130B1 (ko) * 1999-05-13 2005-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 도전성 분체 및 그의 제조 방법
KR100777148B1 (ko) * 2000-06-30 2007-11-19 생-고뱅 어브레이시브즈, 인코포레이티드 초연삭제에 금속으로 코팅하는 방법
US7528413B2 (en) 2001-11-09 2009-05-05 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
JP2004200346A (ja) * 2002-12-18 2004-07-15 Sumitomo Electric Ind Ltd 半導体素子収納用パッケージ、その製造方法及び半導体装置
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
US6968990B2 (en) * 2003-01-23 2005-11-29 General Electric Company Fabrication and utilization of metallic powder prepared without melting
JP3899068B2 (ja) 2003-12-19 2007-03-28 株式会社アライドマテリアル タングステン合金線ならびにフィラメントおよびハロゲンランプ
CN101035876A (zh) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 导热性组合物及其制备方法
US20080187769A1 (en) * 2006-04-13 2008-08-07 3M Innovative Properties Metal-coated superabrasive material and methods of making the same
CN1944698A (zh) 2006-10-24 2007-04-11 北京科技大学 一种超高导热、低热膨胀系数的复合材料及其制备方法
EP2165002A1 (en) * 2007-05-22 2010-03-24 Element Six Limited Coated diamond
WO2011049479A1 (en) * 2009-10-21 2011-04-28 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity and process of fabricating same
CN101985702B (zh) * 2010-06-29 2013-02-06 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
JP5896400B2 (ja) * 2011-11-25 2016-03-30 トーメイダイヤ株式会社 ダイヤモンド含有ヒートシンク材及びその製法
US9117793B2 (en) 2012-06-29 2015-08-25 Materion Corporation Air cavity packages having high thermal conductivity base plates and methods of making

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