CN106795596A - 金刚石复合材料和散热部件 - Google Patents

金刚石复合材料和散热部件 Download PDF

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Publication number
CN106795596A
CN106795596A CN201580047186.9A CN201580047186A CN106795596A CN 106795596 A CN106795596 A CN 106795596A CN 201580047186 A CN201580047186 A CN 201580047186A CN 106795596 A CN106795596 A CN 106795596A
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Prior art keywords
diamond
composite material
powder
group
metal
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Pending
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CN201580047186.9A
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English (en)
Chinese (zh)
Inventor
森川达矢
角仓孝典
大泽谦介
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ALMT Corp
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ALMT Corp
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Priority to CN202111355188.8A priority Critical patent/CN114032413A/zh
Priority to CN201910978537.8A priority patent/CN110656259A/zh
Publication of CN106795596A publication Critical patent/CN106795596A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • C22C5/08Alloys based on silver with copper as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732Diamonds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/066Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using impregnation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00Metallic composition of the powder or its coating
    • B22F2301/25Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255Silver or gold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/05Boride
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/20Nitride
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/40Carbon, graphite
    • B22F2302/406Diamond
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/45Others, including non-metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00Physical aspects of the powder
    • B22F2304/10Micron size particles, i.e. above 1 micrometer up to 500 micrometer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/005Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being borides
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/006Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being carbides
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/007Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being nitrides
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/008Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds other than carbides, borides or nitrides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Carbon And Carbon Compounds (AREA)
CN201580047186.9A 2014-09-02 2015-09-01 金刚石复合材料和散热部件 Pending CN106795596A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111355188.8A CN114032413A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件
CN201910978537.8A CN110656259A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014178434 2014-09-02
JP2014-178434 2014-09-02
PCT/JP2015/074880 WO2016035795A1 (ja) 2014-09-02 2015-09-01 ダイヤモンド複合材料、及び放熱部材

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202111355188.8A Division CN114032413A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件
CN201910978537.8A Division CN110656259A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件

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CN106795596A true CN106795596A (zh) 2017-05-31

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CN201910978537.8A Pending CN110656259A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件
CN202111355188.8A Pending CN114032413A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件
CN201580047186.9A Pending CN106795596A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件

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CN201910978537.8A Pending CN110656259A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件
CN202111355188.8A Pending CN114032413A (zh) 2014-09-02 2015-09-01 金刚石复合材料和散热部件

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US (1) US20170145280A1 (enExample)
EP (1) EP3190198B1 (enExample)
JP (2) JP6292688B2 (enExample)
CN (3) CN110656259A (enExample)
WO (1) WO2016035795A1 (enExample)

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CN111742073A (zh) * 2018-02-21 2020-10-02 住友电气工业株式会社 复合材料和复合材料的制造方法
CN113150551A (zh) * 2020-07-27 2021-07-23 谷歌有限责任公司 热界面材料及其制造方法
CN115461480A (zh) * 2020-04-09 2022-12-09 住友电气工业株式会社 复合材料、散热器及半导体装置
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JP2019071328A (ja) * 2017-10-06 2019-05-09 株式会社豊田中央研究所 半導体実装基板、半導体モジュールおよび半導体実装基板の製造方法
EP3754038B1 (en) 2018-02-14 2023-01-18 Sumitomo Electric Industries, Ltd. Composite member and method of manufacturing
JP7189214B2 (ja) * 2018-07-12 2022-12-13 住友電気工業株式会社 複合部材
JP6714786B1 (ja) 2018-10-25 2020-06-24 住友電気工業株式会社 複合部材
US12112993B2 (en) * 2018-10-31 2024-10-08 A.L.M.T. Corp. Heat radiation member
KR102818980B1 (ko) * 2019-03-29 2025-06-10 가부시끼가이샤 아라이도 마테리아루 복합 재료
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
KR20220152386A (ko) * 2020-03-24 2022-11-15 스미토모덴키고교가부시키가이샤 복합 재료 및 방열 부재
CN111421141B (zh) * 2020-04-20 2022-05-24 浙江工业大学 一种定向高导热金刚石/金属基复合材料的制备方法
WO2022109552A1 (en) * 2020-11-18 2022-05-27 Sharfi Benjamin K Diamond-based thermal cooling devices methods and materials
KR102576792B1 (ko) 2021-06-08 2023-09-11 주식회사 더굿시스템 복합재료 및 방열부품
CN114086047B (zh) * 2021-11-22 2022-05-31 合肥哈瑞克机电科技有限公司 一种高导热复合材料及其制备方法
KR102685109B1 (ko) * 2021-12-13 2024-07-15 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
KR102884605B1 (ko) 2022-05-25 2025-11-13 주식회사 더굿시스템 복합재료 및 이 복합재료를 포함하는 방열부품
WO2024157803A1 (ja) 2023-01-23 2024-08-02 旭ダイヤモンド工業株式会社 複合材料及びその製造方法
WO2024210148A1 (ja) * 2023-04-05 2024-10-10 積水化学工業株式会社 ダイヤモンド複合粒子、樹脂組成物

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US20100319900A1 (en) * 2009-10-21 2010-12-23 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity nd process of fabricating same
JP2013115096A (ja) * 2011-11-25 2013-06-10 Tomei Diamond Co Ltd ダイヤモンド含有ヒートシンク材及びその製法
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111742073A (zh) * 2018-02-21 2020-10-02 住友电气工业株式会社 复合材料和复合材料的制造方法
CN115461480A (zh) * 2020-04-09 2022-12-09 住友电气工业株式会社 复合材料、散热器及半导体装置
CN115461480B (zh) * 2020-04-09 2023-10-24 住友电气工业株式会社 复合材料、散热器及半导体装置
CN113150551A (zh) * 2020-07-27 2021-07-23 谷歌有限责任公司 热界面材料及其制造方法
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
US12195666B2 (en) 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same

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Publication number Publication date
US20170145280A1 (en) 2017-05-25
JPWO2016035795A1 (ja) 2017-06-15
WO2016035795A1 (ja) 2016-03-10
CN114032413A (zh) 2022-02-11
EP3190198B1 (en) 2019-11-06
CN110656259A (zh) 2020-01-07
JP2018111883A (ja) 2018-07-19
EP3190198A1 (en) 2017-07-12
EP3190198A4 (en) 2017-10-25
JP6292688B2 (ja) 2018-03-14

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Application publication date: 20170531