JP2010153803A5 - - Google Patents
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- Publication number
- JP2010153803A5 JP2010153803A5 JP2009252591A JP2009252591A JP2010153803A5 JP 2010153803 A5 JP2010153803 A5 JP 2010153803A5 JP 2009252591 A JP2009252591 A JP 2009252591A JP 2009252591 A JP2009252591 A JP 2009252591A JP 2010153803 A5 JP2010153803 A5 JP 2010153803A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting module
- component mounting
- substrate
- metal fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000010419 fine particle Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009252591A JP2010153803A (ja) | 2008-11-28 | 2009-11-04 | 電子部品実装モジュール及び電気機器 |
| EP09014627A EP2192614A3 (en) | 2008-11-28 | 2009-11-24 | Electronic component mounting module and electrical apparatus |
| US12/625,917 US8197099B2 (en) | 2008-11-28 | 2009-11-25 | Electronic component mounting module and electrical apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008303670 | 2008-11-28 | ||
| JP2009252591A JP2010153803A (ja) | 2008-11-28 | 2009-11-04 | 電子部品実装モジュール及び電気機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010153803A JP2010153803A (ja) | 2010-07-08 |
| JP2010153803A5 true JP2010153803A5 (enExample) | 2012-11-08 |
Family
ID=41606672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009252591A Pending JP2010153803A (ja) | 2008-11-28 | 2009-11-04 | 電子部品実装モジュール及び電気機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8197099B2 (enExample) |
| EP (1) | EP2192614A3 (enExample) |
| JP (1) | JP2010153803A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201540443U (zh) * | 2009-10-23 | 2010-08-04 | 中强光电股份有限公司 | 光源模块 |
| TWI435144B (zh) * | 2010-04-12 | 2014-04-21 | Young Lighting Technology Corp | 背光模組 |
| FR2967329B1 (fr) * | 2010-11-10 | 2013-04-26 | Valeo Systemes Thermiques | Ecran d'affichage |
| KR20140017602A (ko) * | 2011-03-22 | 2014-02-11 | 다우 코닝 코포레이션 | Ｌｅｄ 조립체 내의 열 관리 |
| KR101824038B1 (ko) * | 2011-07-22 | 2018-01-31 | 엘지이노텍 주식회사 | 디스플레이 장치 |
| KR101427119B1 (ko) * | 2012-12-10 | 2014-08-06 | 주식회사 영동테크 | 마그네슘 압출물 히트싱크를 가진 고전력 led조명장치 |
| WO2014135820A1 (en) * | 2013-03-06 | 2014-09-12 | Aurora Limited | Improved downlights |
| US10420203B2 (en) * | 2013-07-01 | 2019-09-17 | Hamilton Sundstrand Corporation | Heat pipe embedded heat sink with integrated posts |
| DE102015215011A1 (de) * | 2015-08-06 | 2017-02-09 | Robert Bosch Gmbh | Thermisches und/oder elektrisches Kontaktelement, Kontaktanordnung und Verfahren zur Reduzierung einer Formtoleranz eines Kontaktelementes und/oder einer Kontaktanordnung |
| CN111033768A (zh) | 2017-08-23 | 2020-04-17 | 日本碍子株式会社 | 透明密封构件及光学部件 |
| BE1026114B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via component |
| BE1026115B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via pin |
| USD921905S1 (en) * | 2019-07-19 | 2021-06-08 | Carre Technologies Inc. | Case |
| US11264299B1 (en) | 2020-09-03 | 2022-03-01 | Northrop Grumman Systems Corporation | Direct write, high conductivity MMIC attach |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
| US5355280A (en) * | 1989-09-27 | 1994-10-11 | Robert Bosch Gmbh | Connection arrangement with PC board |
| US5098609A (en) * | 1989-11-03 | 1992-03-24 | The Research Foundation Of State Univ. Of N.Y. | Stable high solids, high thermal conductivity pastes |
| US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
| US5781412A (en) * | 1996-11-22 | 1998-07-14 | Parker-Hannifin Corporation | Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
| JP3583019B2 (ja) | 1999-04-28 | 2004-10-27 | 京セラ株式会社 | 放熱配線基板の接合構造 |
| US8100552B2 (en) * | 2002-07-12 | 2012-01-24 | Yechezkal Evan Spero | Multiple light-source illuminating system |
| US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| WO2004049462A1 (en) * | 2002-11-26 | 2004-06-10 | Stockeryale, (Irl), Limited | An illuminator and production method |
| US6774482B2 (en) * | 2002-12-27 | 2004-08-10 | International Business Machines Corporation | Chip cooling |
| JP3988735B2 (ja) * | 2004-03-15 | 2007-10-10 | 日立金属株式会社 | 半導体装置及びその製造方法 |
| US7719108B2 (en) * | 2005-01-10 | 2010-05-18 | Lockheed Martin Corporation | Enhanced reliability semiconductor package |
| JP2006344690A (ja) | 2005-06-07 | 2006-12-21 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| CN101375395B (zh) * | 2006-01-26 | 2012-10-03 | 迈图高新材料日本合同公司 | 散热材料以及使用该材料的半导体装置 |
| JP2008103602A (ja) * | 2006-10-20 | 2008-05-01 | Seiko Epson Corp | 電子基板、その製造方法および電子機器 |
| DE102007023918A1 (de) * | 2007-05-23 | 2008-11-27 | Siemens Ag Österreich | Beleuchtungseinheit |
-
2009
- 2009-11-04 JP JP2009252591A patent/JP2010153803A/ja active Pending
- 2009-11-24 EP EP09014627A patent/EP2192614A3/en not_active Withdrawn
- 2009-11-25 US US12/625,917 patent/US8197099B2/en not_active Expired - Fee Related