JP2010153803A - 電子部品実装モジュール及び電気機器 - Google Patents

電子部品実装モジュール及び電気機器 Download PDF

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Publication number
JP2010153803A
JP2010153803A JP2009252591A JP2009252591A JP2010153803A JP 2010153803 A JP2010153803 A JP 2010153803A JP 2009252591 A JP2009252591 A JP 2009252591A JP 2009252591 A JP2009252591 A JP 2009252591A JP 2010153803 A JP2010153803 A JP 2010153803A
Authority
JP
Japan
Prior art keywords
substrate
electronic component
metal fine
fine particle
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009252591A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010153803A5 (enExample
Inventor
Go Koyanazu
剛 小▲柳▼津
Kiyoko Kawashima
淨子 川島
Haruki Takei
春樹 武井
Naoko Matsui
直子 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2009252591A priority Critical patent/JP2010153803A/ja
Priority to EP09014627A priority patent/EP2192614A3/en
Priority to US12/625,917 priority patent/US8197099B2/en
Publication of JP2010153803A publication Critical patent/JP2010153803A/ja
Publication of JP2010153803A5 publication Critical patent/JP2010153803A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009252591A 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器 Pending JP2010153803A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009252591A JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器
EP09014627A EP2192614A3 (en) 2008-11-28 2009-11-24 Electronic component mounting module and electrical apparatus
US12/625,917 US8197099B2 (en) 2008-11-28 2009-11-25 Electronic component mounting module and electrical apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008303670 2008-11-28
JP2009252591A JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器

Publications (2)

Publication Number Publication Date
JP2010153803A true JP2010153803A (ja) 2010-07-08
JP2010153803A5 JP2010153803A5 (enExample) 2012-11-08

Family

ID=41606672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009252591A Pending JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器

Country Status (3)

Country Link
US (1) US8197099B2 (enExample)
EP (1) EP2192614A3 (enExample)
JP (1) JP2010153803A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026212A (ja) * 2011-07-22 2013-02-04 Lg Innotek Co Ltd バックライトユニット及びそれを用いたディスプレイ装置
JP2013545140A (ja) * 2010-11-10 2013-12-19 ヴァレオ システム テルミク 表示画面
JP2014517440A (ja) * 2011-03-22 2014-07-17 ダウ コーニング コーポレーション Ｌｅｄアセンブリ内の熱管理方法
KR101427119B1 (ko) * 2012-12-10 2014-08-06 주식회사 영동테크 마그네슘 압출물 히트싱크를 가진 고전력 led조명장치
WO2019039440A1 (ja) * 2017-08-23 2019-02-28 日本碍子株式会社 透明封止部材及び光学部品

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201540443U (zh) * 2009-10-23 2010-08-04 中强光电股份有限公司 光源模块
TWI435144B (zh) * 2010-04-12 2014-04-21 Young Lighting Technology Corp 背光模組
WO2014135820A1 (en) * 2013-03-06 2014-09-12 Aurora Limited Improved downlights
US10420203B2 (en) * 2013-07-01 2019-09-17 Hamilton Sundstrand Corporation Heat pipe embedded heat sink with integrated posts
DE102015215011A1 (de) * 2015-08-06 2017-02-09 Robert Bosch Gmbh Thermisches und/oder elektrisches Kontaktelement, Kontaktanordnung und Verfahren zur Reduzierung einer Formtoleranz eines Kontaktelementes und/oder einer Kontaktanordnung
BE1026114B1 (nl) * 2018-03-19 2019-10-17 Dk Ceramic Circuits Bvba Verbinding via component
BE1026115B1 (nl) * 2018-03-19 2019-10-17 Dk Ceramic Circuits Bvba Verbinding via pin
USD921905S1 (en) * 2019-07-19 2021-06-08 Carre Technologies Inc. Case
US11264299B1 (en) 2020-09-03 2022-03-01 Northrop Grumman Systems Corporation Direct write, high conductivity MMIC attach

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007086443A1 (ja) * 2006-01-26 2007-08-02 Momentive Performance Materials Japan Llc 放熱材及びそれを用いた半導体装置
JP2008103602A (ja) * 2006-10-20 2008-05-01 Seiko Epson Corp 電子基板、その製造方法および電子機器

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US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5355280A (en) * 1989-09-27 1994-10-11 Robert Bosch Gmbh Connection arrangement with PC board
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
JP3583019B2 (ja) 1999-04-28 2004-10-27 京セラ株式会社 放熱配線基板の接合構造
US8100552B2 (en) * 2002-07-12 2012-01-24 Yechezkal Evan Spero Multiple light-source illuminating system
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
WO2004049462A1 (en) * 2002-11-26 2004-06-10 Stockeryale, (Irl), Limited An illuminator and production method
US6774482B2 (en) * 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
JP3988735B2 (ja) * 2004-03-15 2007-10-10 日立金属株式会社 半導体装置及びその製造方法
US7719108B2 (en) * 2005-01-10 2010-05-18 Lockheed Martin Corporation Enhanced reliability semiconductor package
JP2006344690A (ja) 2005-06-07 2006-12-21 Fujikura Ltd 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
DE102007023918A1 (de) * 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007086443A1 (ja) * 2006-01-26 2007-08-02 Momentive Performance Materials Japan Llc 放熱材及びそれを用いた半導体装置
JP2008103602A (ja) * 2006-10-20 2008-05-01 Seiko Epson Corp 電子基板、その製造方法および電子機器

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013545140A (ja) * 2010-11-10 2013-12-19 ヴァレオ システム テルミク 表示画面
JP2014517440A (ja) * 2011-03-22 2014-07-17 ダウ コーニング コーポレーション Ｌｅｄアセンブリ内の熱管理方法
JP2013026212A (ja) * 2011-07-22 2013-02-04 Lg Innotek Co Ltd バックライトユニット及びそれを用いたディスプレイ装置
KR101427119B1 (ko) * 2012-12-10 2014-08-06 주식회사 영동테크 마그네슘 압출물 히트싱크를 가진 고전력 led조명장치
WO2019039440A1 (ja) * 2017-08-23 2019-02-28 日本碍子株式会社 透明封止部材及び光学部品
JPWO2019039440A1 (ja) * 2017-08-23 2020-08-20 日本碍子株式会社 透明封止部材及び光学部品
US11195980B2 (en) 2017-08-23 2021-12-07 Ngk Insulators, Ltd. Transparent sealing member and optical component

Also Published As

Publication number Publication date
EP2192614A2 (en) 2010-06-02
US8197099B2 (en) 2012-06-12
US20100135034A1 (en) 2010-06-03
EP2192614A3 (en) 2012-05-30

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