JP2013140876A5 - - Google Patents
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- Publication number
- JP2013140876A5 JP2013140876A5 JP2012000502A JP2012000502A JP2013140876A5 JP 2013140876 A5 JP2013140876 A5 JP 2013140876A5 JP 2012000502 A JP2012000502 A JP 2012000502A JP 2012000502 A JP2012000502 A JP 2012000502A JP 2013140876 A5 JP2013140876 A5 JP 2013140876A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- metal lid
- electronic
- metallized layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000010894 electron beam technology Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000502A JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000502A JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013140876A JP2013140876A (ja) | 2013-07-18 |
| JP2013140876A5 true JP2013140876A5 (enExample) | 2015-01-29 |
Family
ID=49038081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000502A Withdrawn JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013140876A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6687049B2 (ja) * | 2018-03-12 | 2020-04-22 | セイコーエプソン株式会社 | 電子デバイス、電子デバイス用回路基板、電子機器、移動体 |
| JP2020036179A (ja) * | 2018-08-30 | 2020-03-05 | 日本電波工業株式会社 | 圧電デバイス |
| JP7652160B2 (ja) | 2022-09-08 | 2025-03-27 | 株式会社村田製作所 | 電子部品パッケージ及び電子部品パッケージの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179373A (ja) * | 2002-11-27 | 2004-06-24 | Kinseki Ltd | 電子部品パッケ−ジとその封止方法 |
| JP2011066651A (ja) * | 2009-09-17 | 2011-03-31 | Kyocera Kinseki Corp | 圧電デバイス |
-
2012
- 2012-01-05 JP JP2012000502A patent/JP2013140876A/ja not_active Withdrawn
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